New USA sales office of Digital Core Design
Digital Core Design's IP cores are widely being used by ASIC and FPGA (Xilinx, Altera, Lattice, etc.) designers as microcontrollers, bus interfaces, arithmetic coprocessors and other arithmetic components. "Our distribution agreement with Digital Core Design enables system designers to have easier and faster access to high quality of products and professional services that both companies offer." - Cyrus Mousavi Sr. Director of Business Development.
Digital Core Design's products offer industry-leading combination of high performance, low power, and small die size. Easy integration of Digital Core Design's IP cores along with the robust third party development and software tools provide ideal solutions for System On-Chip, ASIC, FPGA, and system designs. "HiTech Disti is a reliable partner with main business focused on IP Cores distribution. The agreement covers all of the Digital Core Design's products including the most popular 8051, 8390, PIC microcontrollers, and Digital Core Design's modern on-chip debugging technology." - Jacek Hanke Digital Core Design's president.
"HiTech Disti company extends access to Digital Core Design's products for all USA related customers, improves customers support, and brings more added value to our products" - Jacek Hanke.
About HiTech Disti LLC.
HiTech Disti LLC started its operation in 2001 in Silicon Valley, California. HiTech Disti is staffed with teams of highly trained engineers and marketers who can help its clients and partners to effectively promote and sell their products in the United States.
HiTech Disti's provides services to High-tech engineers and designers who are looking for fast, easy, and reliable ways to find design tools such as evaluation/prototyping boards, Software, IP Cores, emulators, debuggers, test equipments, and customized accessories. For more information about HiTech Disti, LLC, please visit: http://www.HiTechDisti.com
About Digital Core Design
DCD provides a broad line of general-purpose IP cores, including 8-, 16- and 32-bit processors, peripherals, serial interfaces, floating point arithmetic units and floating point coprocessors. Formed in 1999 Digital Core Design is a privately held company with headquarters placed in Bytom Poland. Since starting of productivity in 1999 – DCD has established a reputation for highest-quality products, flexible licensing and quick and responsive technical support. Experience of our highly qualified engineers allowed us to produce IP’s with highest market performance and smallest gate count. The number of DCD’s customers is growing every month, which makes DCD one of leading IP providers in the world. For more information, please visit: http://www.dcd.pl
|
Digital Core Design Hot IP
Related News
- Gowin Semiconductor Opens European Office and Commences Sales Operations Serving the EMEA Region
- Synopsys' New USB 3.1 IP Solution Enables 10 Gbps Data Transfer Speeds for Storage, Digital Office and Mobile Applications
- M31 Technology USA is established
- CAST Opens IP Cores Sales Office in China
- Cadence Opens Expanded Shanghai Sales Office and R&D Center
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |