Deployment of CEVA-Teak DSP Core Marks Third Generation DSP Core Licensed And Deployed By Oki
SAN JOSE, CA – April 13, 2004 - CEVA, Inc. (NASDAQ: CEVA, LSE: CVA) the leading licensor of Digital Signal Processor (DSP) cores and communication solutions to the semiconductor industry, today announced that Oki Electric Industry Co., Ltd. (TSE: 6703), a leader in digital communications and convergence, has deployed CEVA-Teak DSP core into its dual-core digital audio solution. Targeting the MP3, WMA and speech processing applications markets, Oki’s single chip audio solution offers a high performance solution for the burgeoning digital audio market.
Oki’s use of the CEVA-Teak in its ASSP (application-specific standard product) is a logical progression for their design of System on Chip (SoC) solutions. Oki has previously licensed and successfully developed products for other audio and wireless applications incorporating CEVA-Oak DSP Core and CEVA-TeakLite solutions. CEVA-Teak’s low-power, dual-MAC DSP architecture for high-performance multimedia processing enables Oki to build an efficient and flexible solution for a market driven by heavy, high speed applications.
Oki’s single-chip digital audio solution delivers a complete solution for designers to shorten consumer product development time and costs. The MCU and DSP dual-core architecture includes an ARM7™ and builds on CEVA’s and ARM’s collaboration on the Inter Processor Communication Mailbox (IPCM) standard and a joint tools development environment enabling mutual customers to rapidly design, emulate, and optimize hybrid ARM RISC and CEVA DSP SoCs.
“Oki is once again driving the market forward single chip solution for potable digital audio applications,” said Hiroshi Shinotsuka, Product Marketing Manager for digital consumer LSI products at Oki. “Oki is a long-term licensing partner of CEVA whose DSP cores are the perfect platform for our audio product portfolio.”
“DSP technology is fundamental in the shift from analog to digital based products. Oki is leading the market in digital solutions that define new parameters in performance, power consumption and cost,” said Gideon Wertheizer, EVP and CTO of CEVA. “Oki’s dual core chip underlines the advantages in creating a architectural standard in hybrid system-on-chip solutions with CEVA DSP cores.”
CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture features high-performance, high flexibility and throughput for complex Digital Signal Processing implementations. The core is designed for low-power, speech and audio processing, multimedia and wireless communications (GSM, CDMA, EDGE, GPRS, 3G, etc.), high-speed modems, advanced telecommunication systems, and various embedded control applications. CEAV-Teak is designed with consideration for low-power consumption to achieve the best possible performance with the lowest possible power consumption. It makes the core suitable to a wide variety of battery-powered portable applications.
CEVA Oak DSP Core, CEVA-TeakLite and CEVA Teak are registered trademarks CEVA, Inc. Other brands and products referenced herein are the trademarks or registered trademarks of their respective holders.
About CEVA, Inc.
Headquartered in San Jose, CEVA (NASDAQ: CEVA and LSE: CVA) is the leading licensor of DSP cores and integrated applications to the semiconductor industry. CEVA markets a portfolio of DSP IP in three integrated areas: CEVA DSPs, CEVA-Xpert Open Framework Environment, and CEVA-Xpert Applications, all supported by Xpert-Integration services. CEVA’s products are used in over 50 million devices each year. CEVA was created through the merger of the DSP licensing division of DSP Group, and Parthus Technologies. For more information, visit www.ceva-dsp.com.