Samsung Licenses CEVA's Newest Generation CEVA-X DSP Core
First deployments of CEVA-X targets Samsung's next generation 3G Multimedia Handsets
San Jose, CA. - April 15, 2004 - CEVA, Inc., (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced that Samsung Electronics Co., Ltd., the world's third largest manufacturer of mobile phones, has licensed the CEVA-X1620 DSP core to power Samsung's next generation 3G multimedia handsets.
CEVA-X1620 DSP core is the first implementation of the CEVA-X architecture that was launched in December 2003. CEVA-X is a scalable VLIW-SIMD DSP architecture delivering breakthrough performance, at low power consumption. Uniquely, the CEVA-X is designed as a multipurpose architecture allowing it be deployed efficiently in a broad range of markets such as 2.5G/3G multimedia phones, PDAs, Digital Cameras and Camcorder, DTV, HD-DVD and more. CEVA-X enables licensees to efficiently develop software using high-level languages such C and C++ allowing re-usability and fast time to market.
Samsung has licensed the CEVA-X1620 dual MAC 16-bit, fully synthesizable DSP core for cellular and applications processing for Samsung's next generation 3G cellular phones. CEVA and Samsung have had a long-standing partnership in DSP with Samsung having previously licensed and deployed the CEVA-TeakLite and CEVA-Teak DSP cores.
"CEVA-X is an outstanding technology delivering high performance and scalability to DSP which will enable Samsung handsets with new levels of communication and multimedia capabilities," said KyungHo Kim, Vice President of Samsung. "Samsung and CEVA have successfully partnered in the past in DSP technology, and we are pleased to be the lead partner for the very exciting CEVA-X DSP technology."
"Our agreement announced today with Samsung, a world leading player in the mobile industry, is a tremendous endorsement of CEVA-X's breakthrough performance, scalability and ease of programmability," said Chet Silvestri, Chairman and CEO of CEVA. "We are confident that CEVA-X will further extend our position as the industry leading provider of DSP technology and expand our reach to new application segments."
CEVA-X1620 is specifically designed for cost driven, low power applications where convergence of communication and multimedia is a necessity. Independent benchmarks by Berkeley Design Technology (BDTI), have demonstrated that the CEVA-X1620 will be faster than all DSPs in its class.*
CEVA-X1620 Features
- 16-bit Fixed-Point Dual MAC architecture
- Unique mix of Very Long Instruction Word (VLIW) and Single Instruction Multiple Data (SIMD)
- High frequency - up to 450 Mhz @ 0.13u (worst case)
- High-DSP performance. For example:
- 2 cycle FFT butterfly
- Single cycle Viterbi Add-compare-select
- Up to 8 instructions in parallel
- Variable instruction width (16 or 32-bit) and variable instruction packets
- Ultra low dynamic power consumption achieved by a built in mechanism which shuts off
any unnecessary logic
- Enable Customer Extensions
- Highly efficient C/C++ Compiler
- Complete software and hardware development environment
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunications, flat panel display and digital convergence technology. Samsung Electronics employs approximately 75,000 people in 89 offices across 47 countries. The company is the world's largest producer of CDMA mobile phones, memory chips, TFT-LCDs, monitors and VCRs. Samsung Electronics consists of six main business units: Corporate Technology Operations, Digital Media Business, Telecommunication Network Business, Digital Appliance Business, Semiconductor Business, and LCD Business. For more information, please visit www.samsung.com.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
* "BDTI Benchmarks" is a trademark of Berkeley design technology. For benchmark results and other information, visit www.BDTI.com.
|
Ceva, Inc. Hot IP
Related News
- CEVA Licenses CEVA-X DSP Architecture to Korea's EoNex to Power 3G Wireless Solutions
- MediaTek Licenses CEVA-X DSP Core and Subsystem from CEVA
- Alliantek Licenses CEVA-X DSP and Multimedia Subsystem for Multi-Standard Multimedia Platform
- Atmel Licenses Industry-Leading CEVA-X DSP And System Platform To Power Next-Generation High Performance Storage Applications
- Enea and CEVA Announce Enea OSE ck Real-Time Operating System for CEVA-X and CEVA-TeakLite-III DSP Architectures
Breaking News
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
- Codasip unveils versatile automotive-grade embedded RISC-V core
- Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
- CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
- Agile Analog announces MoU to support new Southern Taiwan IC Design Industry
Most Popular
- September foundry sales: a tale of differing fortunes
- Intel, TSMC to detail 2nm processes at IEDM
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
- DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs
E-mail This Article | Printer-Friendly Page |