MILPITAS, Calif., April 27, 2004 - LSI Logic Corporation (NYSE: LSI) continues to expand its RapidChip Integrator Platform ASIC family (www.rapidchip.com ) with the release of the RC11Si250 slice which offers the highest logic and memory content of all 0.11m Platform ASICs.
The RC11Si250 RapidChip Integrator slice combines 10.5M available gates with 5.68Mb of diffused memory, which is expandable to more than 6Mb when combined with transistor fabric based memories. All LSI Logic RapidChip Platform ASICs use a transistor fabric architecture that delivers the optimum balance of performance and density.
Included in the RC11Si250 slice as well as all other RapidChip Integrator slices is a feature known as the "Landing Zone" region. In this area, logic and memory resources are arranged so that a user can efficiently implement either an ARM926 microprocessor core running at 200 MHz or MIPS4Kec at 167 MHz. If an application does not use a processor on chip, the Landing Zone logic and memory elements are not wasted and may be used to implement user logic. The Landing Zone region on the RapidChip Integrator slices further speeds time-to-market for designers when combined with LSI Logic's System CoreWare as together they deliver pre-designed, pre-timed and pre-verified processor designs.
"With its system integration capabilities and flexible Landing Zone feature for Processor implementation, RC11Si250 pushes the standards in Platform ASICs to new heights," said Yousef Khalilollahi, RapidChip Marketing Director, LSI Logic. The RapidChip Integrator family also has additional flexibility in memory interface design with the ability to implement DDR on demand at up to 400Mb/s point to point.
With slice-to-slice migration available in compatible package footprints, the RapidChip Integrator family offers comprehensive support for low-risk design/feature creeps. The RC11Si250 is available in 896 or 1152 Flip Chip BGA packages and is available immediately for customer designs.
About LSI Logic's RapidChip Platform ASIC
RapidChip Platform ASICs combine the high-density, high-performance benefits of cell-based ASICs with the fast time-to-market and customization benefits of FPGAs, and the proven IP benefits of ASSPs. Target markets include Communications, Consumer, Storage, Industrial, Medical and Defense.
The RapidChip platform uses LSI Logic's high-performance field-tested CoreWare IP, customizable logic, embedded memory, and innovative design concepts to significantly reduce design and manufacturing risk and costs. The RapidChip platform also provides a fast and seamless migration path to full standard-cell ASIC -- driving unit costs even lower.
Unique to the RapidChip concept is the customer-friendly RapidWorx interface, which dramatically simplifies the underlying complexity of the design tools and flows associated with SoC design. Rule sets automatically manage architectural design, verification, and physical design. As a result, design schedules for high-performance chips are very predictable. Information on RapidChip technology is available through LSI Logic's direct sales channels and worldwide distribution partners or at www.rapidchip.com.
About LSI Logic Corporation
LSI Logic Corporation is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, California 95035. http://www.lsilogic.com.