TransDimension joins WiMedia Alliance and extends its peripheral connectivity strategy into Wireless connectivity
Focus to Leverage TransDimension's USB Wired Connectivity Capabilities into Wireless Peripheral Connectivity
IRVINE, Calif., June 2, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that it has joined the WiMedia Alliance, an industry alliance focused on Ultra Wideband (UWB) wireless connectivity, as part of TransDimension's extension of its USB wired peripheral interconnect strategy into wireless peripheral connectivity semiconductor and software solutions.
"TransDimension believes that UWB will be the wireless standard for peripheral interconnectivity. Much of the same capability that TransDimension uses to enable USB wired connectivity applies to wireless connectivity solutions," said Michael Holt, TransDimension vice president of marketing and business operations. "We develop integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of applications and mobile devices, without ties to a PC. Wireless connectivity is a critical aspect of our strategy and a natural extension for the company."
TransDimension's product lines include ICs (semiconductors), USB function blocks for integration into larger system-on-chip solutions and software that provide direct connectivity for a wide range of PC peripheral, consumer and mobile devices that until now have required an indirect means, such as a PC host, to exchange data. These embedded applications include cellular phones, set top boxes, printers, PDAs, digital cameras, portable storage products and CD, DVD and MP3 players.
"UWB connectivity is a natural extension to TransDimension's leadership in USB connectivity solutions," commented Glyn Roberts, president of the WiMedia Alliance. "TransDimension can play an important role in the standardization of UWB. We are glad to have TransDimension's participation."
About WiMedia
The WiMedia Alliance is a not-for-profit open industry association formed to promote personal-area range wireless connectivity and interoperability among multimedia devices in a networked environment. The Alliance develops and adopts standards-based specifications for connecting wireless multimedia devices including application, transport, and control profiles; test suites; and a certification program to accelerate widespread consumer adoption of "wire-free" imaging and multimedia solutions. For more information, go to www.wimedia.org.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity and I/O for a wide range of applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at www.transdimension.com.
|
Related News
- Tensilica Joins Wi-Fi Alliance to Provide Wireless Multi-Standard Modem Solutions
- CEVA, Inc Joins Wi-Fi Alliance to Further Advocate for a Software-based Wi-Fi Strategy
- Transdimension announces acquisition of peripheral connectivity property and product portfolio from ARC International
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |