Transdimension ships 5 MILLIONTH Embedded USB Host Controller
Demand Driven by the Increasingly Widespread Adoption of USB Host Connectivity Solutions in Embedded Products
IRVINE, Calif., June 15, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that it has shipped its 5 millionth USB host controller. This significant milestone demonstrates that customers worldwide are designing USB host functionality into a myriad of products and the market acceptance of TransDimension's connectivity solutions.
"The market has long been interested in direct peripheral connectivity without a PC. This interest has turned into significant demand for embedded USB host solutions," said Michael Holt, vice president of marketing and operations for TransDimension. "We expect continued growth for our USB host solutions, fueled by pervasive peripheral to peripheral connectivity requirements. We also see tremendous opportunity in wireless applications and intend to bring to market innovative wireless connectivity solutions, such as Ultra Wideband (UWB), that enable devices to exchange data without relying on a physical cable."
TransDimension's embedded USB host controllers have been adopted for numerous applications, such as printers, set top boxes and test/measurement equipment. Market demand has been driven by both the need to connect mass storage devices to set top boxes and personal video recorders and the widespread adoption of PictBridge. A new industry standard, PictBridge allows users to print directly from PictBridge-compliant digital still cameras without the use of a PC. When used in this manner, the printer functions as USB host, while the digital still camera operates as a USB peripheral.
Tightly coupled with the host controller is TransDimension's SoftConnex software, which enables the host functionality and supports a wide variety of operating systems and device class drivers. By providing both hardware and software, TransDimension enables customers to source their USB host solution from a single vendor, which reduces time to market and assures them of coordinated support once a project is underway.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions for peripheral connectivity. TransDimension's product lines include integrated circuits, IP cores and USB software stacks that enable direct connectivity and I/O for a wide range of applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, to exchange data. TransDimension solutions enable peripheral-to-peripheral interconnectivity. TransDimension's SoftConnex software solutions for USB offer the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com
|
Related News
- Renesas Technology Releases R8A66597 Two-Port Hi-Speed (480 Mbps) USB Host Controller Suitable for Embedded Use
- VinChip Systems announces successful silicon validation of Embedded USB 2.0 Host Controller by Myson Century
- Transdimension brings its embedded USB host solution to new HP ALL-IN-ONE Device
- USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing
- SD/eMMC Host and Device Controller IP Cores including matching PHYs with high performance, and high storage capacity available for license to secure your removable and embedded storage
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |