eInfochips Announces High Performance KVM/IP under $100
OEM Ready Solution for Remote Server Access and Control.
SANTA CLARA, CA – July 26, 2004 - eInfochips Inc. a leading provider of embedded systems solutions, ASIC design services and IP cores, today announced the availability of its new, high performance DSP based KVM/IP (keyboard, video, mouse interface) solution. With a BOM of $90, the manufacturing-ready solution enables rapid development of state-of-the-art KVM/IP switches. Targeted at OEMs, it is a designed to be highly scalable and easily customizable.
This cost-effective, manufacturing-ready solution supports all major server platforms and provides remote access to servers using standard IP connections. It enables management of servers right from the boot-up process as if the network administrator was sitting next to the managed device.
“The availability of this solution enables the KVM Switch OEMs to drive time and cost out of the development lifecycle for their new products, said Tapan Joshi, vice president of marketing at eInfochips. “We are proud to add this to our portfolio of OEM ready solutions and will continue to enhance this solution to add more features like support for Wireless Connectivity”
Based on high-performance DSP, the solution provides real-time responses of keyboard, video and mouse over TCP/IP to control servers remotely. To achieve this real-time performance, a frame compare and image compression algorithm with special techniques for noise filtering and video compression is implemented on the DSP. The solution also features all the standard KVM/IP requirements, such as highly secured remote access and server control right from boot-up, browser based control, field upgradeable design, compatibility with standard KVM switches and many more.
Availability and Pricing
The manufacturing-ready solution is available now, and for information on licensing and pricing, contact eInfochips.
About eInfochips Inc.
eInfochips Inc., based in Santa Clara, is a leading provider of cutting edge ASIC design services, Embedded systems solutions and IP cores. The capabilities extend from Specification to Silicon, with knowledge spanning ASIC/SoC Design and verification, automated verification methodologies using HVL, eVC development, physical layout & implementation, firmware development, DSP hardware & algorithms and board design. The company's India and US design centers have delivered SoC and Embedded solutions to a variety of customers thus increasing their cost-effectiveness, reducing their time-to-market and growing their market strength. A partial list of customers includes Broadcom, LSI Logic, Cisco, Sun Microsystems, Philips, IDEO, Northrup Grumman.
For more information on eInfochips visit http://www.einfochips.com.
|
Related News
- CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions
- Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
- Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
- Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |