Infinite Technology's RADcore(TM) Achieves TSMC's Three-Star IP Partner Status
Infinite Technology's RADcore(TM) Achieves TSMC's Three-Star IP Partner Status
RICHARDSON, Texas, March 22 /PRNewswire/ -- Infinite Technology Corporation (Pink Sheets: ITCJ) (ITC) announced its RADcore technology has achieved a three-star status having successfully been ``Verified for Functionality'' in the Taiwan Semiconductor Manufacturing Company (TSMC) 0.25 um CMOS process technology.
The inclusion of RADcore Technology in TSMC's catalog of third party intellectual property providers is an important marketing tool for ITC, placing its company among the industry-leading Intellectual Property (IP) companies and within a global alliance of qualified IC design implementation experts. TSMC's IP Alliance represents the cream of the IP industry. Now designers choosing RADcore Technology for their high-performance datapath solution can be assured the best possible design experience, easiest design reuse and the fastest integration into the overall system design.
``We expect that many of the customer design teams who utilize RADcore Technology will develop consumer oriented products that require ever higher levels of performance. Applications requiring enhanced Digital Signal Processing like those found in 3rd generation (3G) wireless communications, video streaming and multimedia Internet access personal devices are natural targets for application tuned DSP cores based on RADcore Technology,'' said Robert L. Veal, ITC Vice President of Marketing and Sales. Further, Veal said, ``Single-chip implementation is required to ensure these types of products are deployed with a consumer market cost sensitivity. Verifying that these SoC designs work right the first time is critical. Now, design teams can work through the TSMC IP Alliance facilities to verify and manufacture their SoC designs integrating ITC's RADcore DSP-based cores as well as other reusable IP cores.''
RADcore Technology allows system designers to configure DSP coprocessors for specific applications using pre-existing physical libraries, thus providing designers with the added benefit of collapsing the physical design cycle time for DSP cores from months to days. A RADcore coprocessor includes a quad multiply-accumulate (MAC) architecture designed on TSMC's 0.25-micron CMOS process and will achieve typical operating speeds of 350 MHz at 2.5 V and can enable up to 1.4 billion 17x17 MAC operations per second.
``The TSMC Design Services Alliance brings the leaders of required IC design resources (EDA, IP, library providers, and third-party design centers) together to create a robust team to address customer needs from beginning to completion of any IC design cycle,'' said Peyman Kazemkhani, Director of the IP Program at TSMC North America. ``We therefore welcome the inclusion of the ITC RADcore Technology for DSP coprocessor cores as a Three Star Partner for our IP Alliance portfolio.''
About Infinite Technology Corporation
Infinite Technology Corporation, based in Richardson, Texas, is the SemiConductor Original Publishing Enterprise specializing in the design, manufacturing and marketing of digital signal processing (DSP) solutions to create system-on-chip products utilizing its proprietary RADcore(TM) DSP Technology. Founded in 1991, ITC also provides integrated circuit design services and software development. More information can be found at http://www.infinite-tech.com, or by phone at 972.437.7800.
Notes:
1) The statements contained in this release that are not purely historical are forward-looking statements that may involve risks and uncertainties. The Company's actual results may differ significantly from the results contained in the forward-looking statements.
2) RAD, RADcore and RADware are trademarks of Infinite Technology Corporation.
Related News
- InProComm's Wireless LAN Intellectual Property Achieves TSMC's Three-Star IP Alliance Status
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
- Mentor achieves certifications for TSMC's leading-edge 3nm process technology
- M31 Technology Won TSMC's 2019 Partner of the Year Award for Specialty Process IP
Breaking News
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
Most Popular
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
E-mail This Article | Printer-Friendly Page |