Transdimension introduces Family of Development kits for USB On-The-Go controller
Kits Provide Easy, Cost Effective Off-the-Shelf Solution; Enable Quick Time to Market
IRVINE, Calif., August 16, 2004 -TransDimension, a leading provider of USB connectivity solutions for embedded applications, today introduced a family of development kits for its second generation USB On-The-Go (OTG) controller, the TD242LP. These development kits provide customers with a fast, easy and cost effective way to implement and develop embedded host USB systems for quick time to market.
The family of development kits provides an off-the-shelf solution that includes a hardware board, software, and documentation needed for a user to begin integrating USB functionalities quickly into their system with the TD242LP. "Implementing USB is complex. TransDimension's development systems make it much easier," said Mike Holt, vice president of marketing and operations for the company. "Using our self-contained family of development kits, more customers are able to implement high performance embedded host USB solutions into their systems using TransDimension's market leading TD242LP controller and software."
TransDimension's TD242LP controller IC, has the smallest footprint and lowest power consumption amongst the other competitive OTG controllers on the market, and successfully completed compliance testing at the USB Implementer Forum (USB-IF) Workshop. The TD242LP controller has two ports-one dedicated host port, and another port that can operate as a host port, a peripheral port, or an OTG port. TD242LP enables high USB throughput while keeping CPU utilization at a minimum, and enabling interconnectivity for a wide range of consumer electronics and mobile products. Host controller drivers (HCD) in source code for different operating systems including WinCE and Linux, are available with the development kit.
The TD242LP development kit is priced at $999, and is supported and available through TransDimension's distributors.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of PC peripheral applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.
|
Related News
- TransDimension USB On-The-Go Controller is the first single-chip solution to achieve USB On-The-Go certification
- QuickLogic Ships the First ArcticLink Solution Platform, with Fully Integrated USB 2.0 High Speed On-the-Go Controller and PHY
- Atmel Introduces the World's Lowest Power 32-bit Flash MCU With Ethernet and USB On-the-Go
- Evatronix SA successfully completes High-Speed USB On-The-Go compliance testing procedure for its USB OTG controller core
- Mentor Graphics Announces Certification of its High-Speed USB On-The-Go Controller IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |