Samsung Semiconductor offers SERDES Intellectual Property for high-speed ASIC designs
“Using our advanced SerDes technology, customers can supply small form-factor devices, gaining a predominant technological edge with a competitive chip-size as they develop their next generation devices,” said S.H. Hong, director of Samsung Semiconductor’s System LSI division. “Customers can select from several types of our SerDes IP blocks that support the state-of-the art enterprise storage solutions including 4G Fiber Channel, Serial Attached SCSI (SAS), and PCI Express.”
Samsung developed its advanced SerDes IP blocks in 0.13um CMOS logic process. These IPs operate with lower jitter and power usage—an essential requirement for embedded ASIC designs. In addition, SerDes IP enables very small die area resulting in substantially reduced device costs.
Availability/Support
Samsung is now offering SerDes IP at 2- and 4Gbits/s speeds for Fiber Channel, 3Gbits/s speed for Serial Attached SCSI (SAS), , and 2.5Gbits/s for PCI Express PHY. Evaluation kits are currently available. Samsung’s technical service teams are located worldwide to provide hands-on assistance, so customers can fully leverage the benefits of the SerDes technology into their enterprise storage and SAN designs.
About Samsung Electronics
Samsung Electronics Co. Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2003 parent company sales of US$36.4 billion and net income of US$5.0 billion. Employing approximately 88,000 people in 89 offices in 46 countries, the company consists of six main business units: Corporate Technology Operations, Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is the world’s largest producer of color monitors, color TVs, memory chips, TFT-LCDs and VCRs. For more information, visit www.samsung.com
Samsung Semiconductor Inc., a wholly owned U.S. subsidiary of Samsung Electronics Co., Ltd., is located in San Jose, Calif. More information can be found at http://www.usa.samsungsemi.com.
The names of actual companies and products mentioned herein may be the trademarks of their respective owners.
|
Related News
- TransDimension Licenses High-Speed USB Intellectual Property and Software Solution to Chipidea
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise
- Samsung, Intrinsity Partner to Provide New Generation High-Speed, Low Power Processor Cores
- Acacia Semiconductor Announces a New Family of Best-in-Class High-Speed 10-bit ADC IPs Silicon Proven in a 130nm Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |