SMIC opens 300-mm wafer fab in Beijing

![]() ![]() | |
EE Times: Latest News SMIC opens 300-mm wafer fab in Beijing | |
(09/27/2004 1:34 PM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=47903119 | |
SAN JOSE, Calif. Chinese silicon foundry startup Semiconductor Manufacturing International Corp. (SMIC) officially opened its 300-mm fab in a ceremony in Beijing, the company said. SMIC has been processing wafers in the 300-mm fab, known as Fab 4, for some time. Production is slated in the fourth quarter of this year. SMIC said pilot production began in July. The fab will initially produce high-density DRAMs using 0.11- and 0.10-micron process technology, according to an SMIC statement. The Shanghai-based company, China's fast-growing foundry, is sticking to plans to spend $2 billion on capital equipment, but may pull back from plans to spend $1.3 billion in 2005, depending on how the global market develops, according to its chairman, president and chief executive officer (see Sept. 15 story). SMIC also said in a statement that its five fabs in Shanghai, Beijing and Tianjin will be producing 125,000 wafers a month by the end of the year.
| |
All material on this site Copyright 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
Breaking News
- GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
- Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
- Consortium's Move Will Boost RISC-V Ecosystem, Thankfully
- Are Chiplets Enough to Save Moore's Law?
- Andes Technology Showcases Pioneering RISC-V CPU IP Solutions at RISC-V Summit Europe
Most Popular
- Nanusens announces that it can now create ASICs with embedded sensors
- Intel Foundry Services Ushers in a New Era
- Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
- MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry
- Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |