English
Palm OS licensed to three device vendors
Mobile Pipeline News
Sep 27, 2004 (10:32 AM)
MANHASSET, N.Y. — PalmSource, which develops and markets the Palm platform, said Monday (Sept. 27) that three original design manufacturers have licensed the Palm OS for use in new smart phones and handhelds.
ODMs design and develop phones on behalf of other vendors and wireless operators. For example, U.K. vendor BenQ reportedly recently signed an ODM agreement to develop smartphones for Nokia. ODMs enable large, more visible vendors like Nokia, as well as wireless operators, to come to market with new devices quickly and inexpensively.
PalmSource said it signed licensing agreements with GSPDA, Inventec Appliances Corp. and Portable Technology Ltd. Neither PalmSource nor the vendors said which vendors the devices would be developed for or what type of devices they would develop. However, GSPDA specializes in smart phones.
Related News
- Arteris FlexNoC Interconnect IP is Licensed by SK Hynix for Solid State Storage Device (SSD) Controllers
- ARM Announces Device Platform and Free OS to Accelerate Internet of Things Deployment
- C2C Interchip Link Connectivity IP Licensed by 10 Leading Processor and Modem Vendors
- Ittiam's Video Communication Offering Now Even Broader, Available on Three Platforms for Next-Generation Applications
- Tokyo Electron Device Announces simultaneous release of three high-density FPGA PCI express platforms
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |