English
TSMC Senior Vice President and Chief Information Officer Dr. Quincy Lin to Retire
Dr. Stephen T. Tso to be appointed as Senior VP and CIO of TSMC
Hsinchu Science Park, Taiwan, September 29, 2004 - Taiwan Semiconductor Manufacturing Company (TSMC) (TAIEX: 2330, NYSE: TSM) today said that Dr. Quincy Lin, Senior Vice President and Chief Information Officer of the Company, has set a retirement date for February 28, 2005. At that time, Dr. Stephen T. Tso, President of WaferTech LLC (“WaferTech”), TSMC’s wholly-own subsidiary in Camas, Washington, USA, will become the new Senior Vice President and Chief Information Officer of TSMC.
“Quincy dedicated himself to helping TSMC grow from the moment he first joined the young Company in 1989,” said Dr. Morris Chang, Chairman and CEO of TSMC. “I would like to express my personal gratitude for Quincy’s significant contributions in his 15 years of service with TSMC. We wish him all the best for his future endeavors.”
Dr. Lin held a variety of management positions at TSMC, heading up organizations including Strategic Planning, Human Resources and Administration, Corporate Marketing and Sales, and Corporate Development and Information Technology. His distinguished contribution is highly recognized by both the company and the IC industry.
Dr. Stephen T. Tso, the current President of WaferTech, also has a long history with TSMC. He joined the company in 1997 as Vice President of R&D, and has also been its Senior Vice President of Worldwide Marketing and Sales and Senior Vice President of Operations.
“I have every confidence that Dr. Tso will continue in Dr. Lin’s footsteps, making outstanding contributions in his new assignment,” said Dr. Morris Chang.
Mr. K.C. Hsu, Vice President of WaferTech, will take over Dr. Stephen T. Tso’s position as the President of WaferTech.
Hsinchu Science Park, Taiwan, September 29, 2004 - Taiwan Semiconductor Manufacturing Company (TSMC) (TAIEX: 2330, NYSE: TSM) today said that Dr. Quincy Lin, Senior Vice President and Chief Information Officer of the Company, has set a retirement date for February 28, 2005. At that time, Dr. Stephen T. Tso, President of WaferTech LLC (“WaferTech”), TSMC’s wholly-own subsidiary in Camas, Washington, USA, will become the new Senior Vice President and Chief Information Officer of TSMC.
“Quincy dedicated himself to helping TSMC grow from the moment he first joined the young Company in 1989,” said Dr. Morris Chang, Chairman and CEO of TSMC. “I would like to express my personal gratitude for Quincy’s significant contributions in his 15 years of service with TSMC. We wish him all the best for his future endeavors.”
Dr. Lin held a variety of management positions at TSMC, heading up organizations including Strategic Planning, Human Resources and Administration, Corporate Marketing and Sales, and Corporate Development and Information Technology. His distinguished contribution is highly recognized by both the company and the IC industry.
Dr. Stephen T. Tso, the current President of WaferTech, also has a long history with TSMC. He joined the company in 1997 as Vice President of R&D, and has also been its Senior Vice President of Worldwide Marketing and Sales and Senior Vice President of Operations.
“I have every confidence that Dr. Tso will continue in Dr. Lin’s footsteps, making outstanding contributions in his new assignment,” said Dr. Morris Chang.
Mr. K.C. Hsu, Vice President of WaferTech, will take over Dr. Stephen T. Tso’s position as the President of WaferTech.
|
||||||
Related News
- TSMC Senior Vice President Dr. Stephen Tso to Retire
- TSMC Appoints Dr. Shang-Yi Chiang as Senior Vice President
- LSI Names Robert Payne Senior Vice President and Chief Technology Officer
- Dr. Rick Tsai Appointed Chief Executive Officer of TSMC; Dr. F.C. Tseng Elected Vice Chairman of TSMC
- Quadric Appoints Former Arm Vice President Steve Roddy as Chief Marketing Officer and Accelerates the Licensing of Its GPNPU Architecture
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |