LSI Logic Unveils Highly Efficient Quad-MAC DSP Core Targeting Advanced Mobile Multimedia Applications
- The ZSP540 provides improved performance with power/size efficiencies of a dual-MAC DSP
- LSI Logic offers most comprehensive family of software compatible DSP cores in the industry
The ZSP540 augments the existing ZSP(R) core roadmap to be the most comprehensive offering of licensable, software compatible DSP cores. SoC designers can choose the most suitable ZSP core for their application without compromising scalability or their software investment. The ZSP540, like all other ZSP cores, can run software previously written for another ZSP core, providing a scalable path for core selection with maximum design reusability.
Will Strauss, president of market research firm Forward Concepts in Tempe, Arizona and leading analyst for the DSP marketplace, commented: "LSI Logic has continued to expand its ZSP portfolio of DSP cores. Now, with the introduction of the ZSP540, the ZSP technology addresses the 3G wireless handset market while extending its reach into new applications like image processing, advance navigation systems and other areas requiring higher bandwidth and advanced complex-arithmetic performance."
Based on the G2 architecture, the ZSP540 leverages world-class software development tool chains, SoC design tools and comprehensive suites of readily available software for voice processing, audio/video multimedia applications and more. The ZSP540 is also equipped with the Z.Turbo(TM) accelerator feature allowing SoC designers to further accelerate the processor performance through instruction set extension or coprocessor implementation.
"With its quad-MAC capabilities at the system cost of a dual-MAC core, the ZSP540 delivers a new 'sweet-spot' in price, power and performance," said Tuan Dao, vice president and general manager of the LSI Logic DSP Division. "The advanced performance, low power consumption and higher code density of the ZSP540 make it very appealing for customers providing feature-rich multimedia 3G wireless solutions."
About the LSI Logic ZSP Processing Solutions
The ZSP Processing Solutions are complete and optimized DSP solutions for multimedia, voice, wireless and other applications requiring high performance signal processing. The solutions are based upon an open, industry-standard DSP architecture. The architecture offers a superior combination of performance, efficient memory usage, and ease of use providing very cost effective options. The ZSP Processing Solutions are available as a licensable, synthesizable technology, as well as off-the-shelf general purpose DSP, multi-channel voice processors and additional application specific standard products from LSI Logic and the ZSP licensees. The ZSP product family includes a series of software compatible DSP cores including the ZSP200 (single MAC), ZSP400 (small footprint, dual MAC), ZSP500 (high-performance dual MAC), ZSP540 (small footprint, quad MAC) and the ZSP600 (6-issue quad MAC). It also includes comprehensive software suites, bundled device/software packages and reference designs. For more information about the ZSP Processing Solutions please visit http://www.zsp.com/
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with Platform ASICs, standard-cell ASICs, standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com
|
Related News
- CEVA Debuts CEVA-X1641 - High-Performance Quad-MAC DSP Targeting Next-Generation Cellular and Portable Multimedia Applications
- StarCore Unveils V4 Architecture Targeting Advanced Mobile Multimedia
- CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
- LSI Logic Announces Cached DSP Cores for Innovative Wireless, Voice and Multimedia Systems
- LSI Logic Expands DSP Multimedia Capabilities to Support Projected $1.4 Billion Market
Breaking News
- TSMC August 2024 Revenue Report
- Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
- Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads
- intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology
- BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI
Most Popular
- Semidynamics on major recruitment drive for RISC-V software engineers
- Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions
- SMIC cuts capex and R&D
- Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company
- Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
E-mail This Article | Printer-Friendly Page |