Start-up to offer integrated multimode RF for wireless
![]() |
Start-up to offer integrated multimode RF for wireless
By Darrell Dunn, EBN
March 7, 2001 (4:06 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010307S0048
A start-up company appears to have taken the lead in RF integration with a promise to deliver by the end of the year a single-chip device that provides capabilities for GSM/GPRS, GPS, and Bluetooth. Ashvattha Semiconductor Inc., which began operations in January, has had initial silicon manufactured by IBM using a 0.25-micron silicon germanium BiCMOS process. The results demonstrate the feasibility of the company's high-integration product strategy, it claims. Other RF suppliers in the portable handset arena are currently utilizing separate RF chips for GSM, GPS, and Bluetooth. Kartik Sridharan, chief executive of Ashvattha in Jacksonville, Fla., said the company plans to have its part on the market by the end of the year or early 2002. A version for the CDMA market with GPS and Bluetooth is planned for later in 2002, and a wideband CDMA with GPS and Bluetooth device is likely for late 2002 or early 2003. "We not only take all the R F for GSM, GPS, and Bluetooth, and cram all those onto a single chip, but we also allow for simultaneous modes of operation," Sridharan said. "When we do this integration we are also very mindful of a the important parameters for handheld devices like power consumption, form factor, and cost." The company uses patent-pending technology that creates isolation structures between the RF devices on the chip to substantially reduce cross-talk and noise susceptibility, Sridharan said. Ashvattha recently closed a $4.5 million round of financing from Comstellar Technologies Inc., and Redwood Ventures.
Related News
- New Semiconductor IP Start-up Previews Silicon-Based Acceleration Technology for Wireless Internet Applications
- Zeevo, Inc., a Fabless Semiconductor and Communications Start-Up, Licenses ARM® Technology for Wireless Products
- Howard Bubb Named CEO of Ambric, a Fabless Semiconductor Start-up
- Arteris, a start-up developing Network on Chip (NoC) Intellectual Property, names Philippe Geyres to its Board of Directors
- Ambric, Inc. Adds Industry Veterans to its Start-up Team; New Fabless Semiconductor Company Adds VP of Architecture and Director of IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |