Fully Digital Physically Unclonable Function (PUF) - PQC Ready
FSA Announces Fabless Fundings Total $1.5 Billion From Q1 Through Q3 2004
SAN JOSE, Calif. (October 27, 2004) – The Fabless Semiconductor Association (FSA), the voice of the global fabless business model, announced today that 117 private fabless companies have generated $1.5 billion in venture and private equity funding in the first three quarters of 2004. This year’s fabless fundings are on pace to garner the largest amount since 2001.
In Q3 2004, 32 fabless companies raised $434.2 million, a 10 percent year-over-year increase.
Eight companies, the most since 2000, each raised more than $20 million, totaling $202.6 million in Q3 2004.
The average amount raised in Q3 2004 equaled $13.6 million, a 12 percent sequential increase.
The digital and wireless markets garnered the most funding in Q3 2004, with 33 percent and 19 percent, respectively.
The FSA noted Q3 2004 fabless industry fundings, at $434.2 million, continues to outpace the overall semiconductor industry, with $164.1 million in private equity investments. More information about fabless fundings can be found in the FSA’s Q3 2004 “Fabless Fundings” report.
About the Fabless Semiconductor Association:
The FSA is the voice of the global fabless business model. Incorporated in 1994, the Association positively impacts the growth and return on invested capital of this business model to enhance the environment for innovation. The FSA provides a platform for meaningful global collaboration between fabless companies and their partners; provides members with timely research and resources; and identifies, debates, and discusses business and technical issues. FSA members include fabless companies and their supply chain and service partners and represent more than 21 countries spanning North America, Asia-Pacific, Europe and the Middle East. www.fsa.org
|
Related News
- The Fabless Semiconductor Association (FSA) Announces Fabless Fundings Increase 32 Percent in Q1 2004
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion
- 4 Reasons for Intel's $1.5 Billion Bet in China
- Intel to Pay NVIDIA Technology Licensing Fees of $1.5 Billion
- S1 Core updated to OpenSPARC T1 version 1.5
Breaking News
- Alphawave Semi Opens Pune Office, Continues Expansion into India
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
- Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
Most Popular
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
- SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
- CEO Interview: Ian Lankshear, EnSilica
- Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |