TI India working on single-chip solution for mobile phones
K.C. Krishnadas
Nov 03, 2004 (10:02 AM)
BANGALORE, India — Engineers at the Indian subsidiary of Texas Instruments Inc. are working on a single-chip solution for mobile phones that would integrate analog, digital, radio frequency and modem functionalities.
Engineers here are working on the systems and software for the single chip solution in India, said Biswadip Mitra, managing director, Texas Instruments (India) Ltd., during a conference on innovation in information technology.
During a visit here earlier this year, TI President and CEO Rich Templeton disclosed that it was working on a single chip solution for mobile phones but did not reveal that it was being done at the Bangalore center.
Samples should be out sometime this year, and production is expected to begin next year. Templeton had said he expected the project to dramatically reduce the price of mobile phones. The center here is also playing a role in addressing the growing market in India for GSM and CDMA-based wireless services, he added.
TI's established its first overseas research and development center here in 1984. The staff of 1,600 engineers has produced several locally designed and developed chips.
Copyright © 2003 CMP Media, LLC | Privacy Statement
Related News
- TI Single-Chip Solution Drives GPS into Mainstream Mobile Phones
- Broadcom Announces Groundbreaking 65 Nanometer Single-Chip Bluetooth 2.1 + EDR Solution for Mobile Handsets
- Beceem Introduces World's First Single-Chip, 65 Nanometer Mobile WiMAX Solution - Sets New Standard for Low Power Consumption
- Qualcomm Makes Next-generation Mobile Internet Accessible with New Single-chip Solution
- Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards for Cell Phones
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |