NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
LSI Logic Announces Webcast Of RapidChip Platform ASIC Partner Program Presentations
MILPITAS, CA November 8, 2004 - LSI Logic Corporation (NYSE: LSI) will webcast tomorrow's presentations introducing the 13 Third-Party IP, Design Service and EDA vendors providing support for the company's RapidChip® Platform ASIC.
The Tuesday November 9 noon PST webcast (approximate time) can be accessed via the following link: http://www.videonewswire.com/event.asp?id=25831. A replay of the webcast is expected to be available around 2 p.m. PST the same day. Presentations will be made by Rick Marz, LSI Logic executive vice president of Worldwide Strategic Marketing, and representatives from ARM Limited, Arrow, Denali Software, GDA Technologies, Memec, Synplicity and TeraSystems.
About LSI LogicLSI Logic Corporation (NYSE: LSI) focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with Platform ASICs, standard-cell ASICs, standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com.
|
Related News
- Mentor Graphics Provides Platform Express Solution for LSI Logic RapidChip Platform ASIC Partner Program
- CAST Joins LSI Logic RapidChip Platform ASIC IP Partner Program
- Jennic to provide Serial RapidIO® IP in LSI Logic's RapidChip Platform ASIC Partner Program
- Poseidon joins LSI Logic RapidChip Platform ASIC Partner Program, providing performance analysis and acceleration for ARM-based designs
- LSI Logic RapidChip(R) Platform ASIC Meets Military and Extended Industrial Temperature Range Specifications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |