VIA to license 3Com patents

![]() ![]() | |
EE Times: Latest News VIA to license 3Com patents | |
(11/12/2004 9:22 AM EST) URL: http://www.eetimes.com/showArticle.jhtml?articleID=52601149 | |
MANHASSET, N.Y. — 3Com Corp. (Marlborough, Mass.) and VIA Technologies Inc. (Taipei, Taiwan) have entered into a patent license agreement that grants VIA rights under certain 3Com patents. The agreement, whose terms were not disclosed, covers the licensing of specific 10/100 Ethernet controller semiconductors developed and sold by VIA and its subsidiaries. VIA will make on-going royalty payments based on future sales. Neal Goldman, senior vice president and general counsel at 3Com, said in a statement, "I am pleased that VIA has elected to become another 3Com licensee. 3Com is committed to protecting its IP rights and patents through an active licensing program that covers Ethernet and other 3Com patents."
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |

Related News
- Via Licensing and Pegatron Settle Patent License Dispute Concerning AAC Essential Patents
- WiLAN Signs Second Wireless License in Automotive Industry
- WiLAN Signs Wireless License with Motorola
- Judge Rules Qualcomm Must License Modem Patents
- Via Expands LTE Patent Pool License Coverage to Include LTE-Advanced
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |