The high-end packaging market will reach more than $4 billion by 2025 with a 31% CAGR between 2019 and 2025, says Yole Développement.
www.electronicsweekly.com, Nov. 05, 2020 –
The high-end packaging market will reach more than $4 billion by 2025 with a 31% CAGR between 2019 and 2025, says Yole Développement.
The biggest market today is related to telecom and infrastructure applications.
The biggest growth will be in mobile & consumer and automotive & mobility with 60% and 88% market shares respectively.
Technology: fuelled by digital end-system demands and technological innovation, high-end packaging technology options are increasingly abundant and ground-breaking.
Companies of different business models including foundry, IDM and OSAT are competing.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging. But how will Samsung react?