Now Includes 5HPE, 5PA, 6RF, 7WL and 7HP, in Addition to 6HP AUBURN, Calif., Jan. 3 /PRNewswire/
-- Tahoe RF Semiconductor, Inc., a leading Electronic Design Services (EDS) company and IBM Business Partner, announced today it is now validated as "Ready for IBM Technology" (RFIT) for IBM's industry-leading 180-nm SiGe process technologies.
The RFIT program from IBM is intended to help IBM's foundry customers speed time to market, reduce development risk, lower development costs, and improve return on investment by identifying design centers that have pre- tested and validated their methodologies for compatibility with IBM technologies. Tahoe RF was asked to be among the first IP and design services companies to participate in the IBM RFIT program when it was introduced in 2003. Tahoe RF is currently validated for IBM's BiCMOS 5HPE, BiCMOS 5PA, CMOS 6RF in addition to the BiCMOS 7WL and BiCMOS 7HP technology validations announced today.
"We are very pleased to offer our vast array of IP solutions in these new technologies," said Irshad Rasheed, President, Tahoe RF. "These validations add a new dimension to our IP solutions that we can now offer our customers."
Tahoe RF can now offer an expanded base of IP blocks for customers, such as VCOs, mixers, amplifiers and libraries in six IBM process technologies. "Accessing these ready and available core and integrated IP solutions in any of these processes can help customers reduce their development costs and time to market for our customers' new products," said Christopher Saint, VP of Engineering, Tahoe RF.
"We are delighted that Tahoe RF can now provide IBM foundry customers access to their broad array of IP solutions across a wide range of IBM's SiGe and RF CMOS technologies," said Ned Cahoon, manager of IBM's foundry business development.
ABOUT TAHOE RF SEMICONDUCTOR, INC.
Tahoe RF Semiconductor, Inc., provides world-class RFIT design services and IP blocks to SoC manufacturers in the wireless communications market. Tahoe RF was founded in 2002 by a group of key engineers and managers from IBM's analog and mixed signal design center. Located in the Sierras near Lake Tahoe in California, this team provides everything from front-end architecture, design and simulation all the way to post-layout simulation and fully packaged fabrication support and management. For additional information, visit us at http://www.TahoeRF.com.