New Engineering Center Highlights Revenue Growth Strategy MOUNTAIN VIEW, Calif., January 6, 2005
- Sonics Inc., the premier supplier of system-on-chip (SoC) SMART™ Interconnects, today announced the opening of an engineering design center in Armenia as part of a company-wide resource realignment strategy aimed at supporting revenue growth.
“As Sonics completes it’s transition from a start-up-company previously focused on engineering critical first products, to an emerging growth company now focused on enhancing established market positions and expanding it’s customer base, we are rebalancing the company’s resources to support the expected revenue growth.” said Grant Pierce president and CEO.
The Armenia design center will be used for both product development and sustaining infrastructure projects. “The expansion into Armenia enables Sonics to manage engineering costs moving forward as our business expands.” Says Pierce.
The Company also announced it has re-aligned departmental staffing to better support the transition. Geert Rosseel, Senior Vice President of Development Programs has assumed the additional responsibility of managing Sonics’ Applications Engineering Group.
Sonics, Inc. is a leading provider of SMART Interconnects that deliver high SoC design predictability and increase design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
SMART™, SonicsMX™, SonicsMXC™, SiliconBackplane™, SonicsStudio™ and MemMax™ are trademarks of Sonics, Inc.® All other trademarks and registered trademarks are the property of their respective owners.