Sonics adds engineering executive as demand for SMART Interconnects increases

Company Appoints Raymond G. Brinks Vice President of Engineering

Mountain View, Calif. - Jan. 10, 2005 - Sonics, Inc., the premier supplier of system-on-chip (SoC) SMART Interconnects™, today announced the appointment of Raymond G. Brinks as vice president of engineering. Brinks will drive product development of Sonics’ internal interconnect solutions that deliver higher SoC design predictability and increased engineering efficiencies.

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“As SoC core integration now reaches 50 and above, we are experiencing a dramatic increase in demand for our SMART Interconnects. Ray’s substantial management experience adds another dimension to our engineering organization and significantly enhances our ability to keep up with growing customer demands,” said Grant Pierce, Sonics president and CEO.

Brinks has more than 20 years expertise in virtually all areas of electronic product design, development, and customer support at aggressive young start-ups and fortune 100 companies. Prior to joining Sonics, he was executive vice president and general manager of the SoC Division at MosChip Semiconductor where he ensured the company’s PC connectivity and SoC security products were developed and designed to the correct technology, architecture, timeframe and specifications required by the company’s customers. Brinks also served as president of fabless semiconductor start-up, Verasity Technologies and led its successful acquisition by MosChip.

Prior to that, Brinks served as chief technology officer at ZF Micro Devices and spent over a decade in various engineering management positions at IBM Corp.

Brinks holds an MSEE from the University of Arizona and a BSEE from the University of Michigan.

“I’m very impressed by the world-class list of customers that Sonics has attracted with its SMART interconnect technology,” said Brinks. “The company is positioned in a critical path of SoC design and I look forward to supporting Sonics during this exciting time of product and corporate growth.”

About Sonics, Inc.

Sonics, Inc. is a leading provider of SMART Interconnects that deliver high SoC design predictability and increase design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com

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