English
SanDisk, Zoran ink deal to co-develop advanced MPEG-4 chip
 |
SanDisk, Zoran ink deal to co-develop advanced MPEG-4 chip
By Semiconductor Business News
February 9, 2001 (2:08 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010209S0019
SUNNYVALE, Calif. -- SanDisk Corp. and Zoran Corp. here today announced a partnership to accelerate the development of MPEG-4-enabled digital cameras, flash-memory cards, and other products. Under the terms, Zoran will integrate SanDisk's flash-memory technology into its MPEG-4-enabled COACH (Camera On a Chip) processor. The new chip will enable MPEG-4 compression, video clips, and other advanced features in future digital cameras. Zoran will sell the MPEG-4 enabled COACH chips, while SanDisk will provide the Secure Digital flash memory cards and MultiMediaCards. Availability of digital cameras that incorporate the new chip is currently projected for the second half of next year.
Related News
- Hantro joins the MIPS alliance program to provide MPEG-4 solutions for advanced MIPS-based' applications
- Hitachi, Triscend ink deal to co-develop configurable RISC processors
- OmniVision and eASIC Offer MPEG-4 Reference Design to Provide Rapid Development of Camera Solutions
- ARM Releases AAC, MP3, MPEG-4, H.264 and FFT OpenMAX DL Libraries, Highly Optimized for Cortex-A8/NEON and ARM11 Processors
- Allegro introduces world's first H.264/MPEG-4 AVC High-Profile/High-Definition Hardware Video Encoding IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |