Strategic collaboration will accelerate access to 3G market for semiconductor vendors and create a standard for 3G baseband chipset designsJanuary 31, 2005
-- TTP Communications plc.[LSE: TTC] and ARM [(LSE:ARM); (Nasdaq:ARMHY)], today announced a strategic collaboration to design and develop the next generation of 3G Intellectual Property (IP) platforms, incorporating ARM® processors and TTPCom Cellular Baseband Engine (CBEmacro) technology. The new platforms will significantly reduce engineering effort and time-to-market for semiconductor vendors developing 3G system-on-chip (SoC) solutions. TTPCom will distribute the combination of an ARM technology-based subsystem and TTPCom’s multimode 3G baseband to semiconductor manufacturers to enable them to get their products to market quickly, with lower cost and risk. ARM will be responsible for licensing the processor core to its silicon partners whilst TTPCom will license the CBEmacro technology.
The first of these platforms will be the CBEmacro 3G, a multimode cellular baseband engine, which provides a complete communications sub-system for GSM, GPRS, EDGE, WCDMA and HSDPA (High Speed Downlink Packet Access). The CBEmacro 3G is delivered pre-verified and warranted, enabling licensees to bring innovative and price competitive products to market more rapidly. The CBEmacro 3G is based on the ARM1156T2-S™ processor and incorporates AMBA™3 AXI methodology, PrimeCell® peripherals and CoreSight™ debug technology. This delivers significant efficiency and performance advantages whilst also providing a familiar processor architecture for semiconductor vendors and their customers. Licensees of CBEmacro 3G will be able to re-use their existing investment in ARM tools and design flows, and rapidly integrate with their in-house IP to make complete cellular SoC products.
“The winning combination of our 3G technology and ARM leading-edge processors will enable silicon Partners to bring high-performance 3G baseband semiconductor solutions to the mass market,” said Tony Milbourn, MD of TTPCom. “The complexity associated with implementing global cellular wireless standards has now been eased. CBEmacro 3G enables silicon Partners and their OEM/ODM customers to reduce integration costs and bring products to market more quickly. By outsourcing the modem design, our mutual customers will be able to focus on more profitable and sustainable sources of product differentiation. This collaboration will instigate change within our industry”.
“Over the last 10 years, TTPCom has become a leader in wireless technology IP and has established a reputation for innovation,” said Warren East, CEO, ARM, “This collaboration between two of the industry’s leading IP vendors will result in a family of ARM Powered® CBEmacro products that will enable our mutual customers to remain competitive, both now and into the future”.