Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Reusable intellectual property group disbands
![]() |
Reusable intellectual property group disbands
By Semiconductor Business News
February 6, 2001 (1:23 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010206S0040
LOS GATOS, Calif.--Backers of the Reusable Application-Specific Intellectual Property Developers (RAPID) group have decided to disband the organization, which was formed in 1996 to help promote the concept of buying and selling third-party design cores. Some industry analysts and observers believe the intellectual property (IP) design movement got ahead of itself in the late 1990s, with many IP startups succumbing to pricing competition and the lack of viable business models. A number of leading IP core suppliers were also acquired by chip houses and design automation suppliers. The RAPID organization said it is turning over reusable IP industry activities to other organizations, such as the Virtual Socket Interface Alliance (VSIA) and the Internet-based Virtual Component Exchange (VCX) in Livingston, Scotland. "I'd like to thank everyone who participated in the RAPID working groups and those who served on the board of directors over t he years," said Mark Miller, chairman of RAPID. "I'm proud of the many contributions that RAPID has made to foster the development of reusable intellectual property for the semiconductor industry."
Related News
- Imaging Solutions Group (ISG) announces High Speed FireWire(tm) IEEE-1394b Intellectual Property
- The TPL Group Names F. Eric Saunders Chief Counsel for Intellectual Property (IP) and Dennis Miller Vice President of IP Development Engineering
- The Linley Group Seminar Targets Advances in CPU Cores and Intellectual Property for Networking and Communications ASICs and SoCs
- Imagination Technologies Group plc, leading provider of System-on-Chip Intellectual Property (IP), today announces results for the six months to 30 September 2005
- BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |