English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Winbond buys stake in Silicon Valley-based NexFlash
 |
Winbond buys stake in Silicon Valley-based NexFlash
By Semiconductor Business News
February 2, 2001 (10:12 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010202S0016
SANTA CLARA, Calif.--Taiwan's Winbond Electronics Corp. has acquired a minority stake in NexFlash Technologies Inc., a Santa Clara-based developer of intellectual property for flash memory. The stake was purchased for $33 million, according to NexFlash, which was established in 1998 by Integrated Silicon Solution Inc. (ISSI) here. "Partnering with Winbond will enable NexFlash to pool the resources to develop very advanced process technologies and products," said Mo Bandali, president of NexFlash. "In addition, the cash infusion will finance our growth as we go forward." About 45% of the funds from Winbond will go directly to NexFlash with the rest being received by shareholders in the privately-held company. The investment was made by the investment arm of Winbond, based in Hsinchu, Taiwan.
Related News
- 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
- zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
- Axiomise Heads to Silicon Valley Next Week for RISC-V Summit North America
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |