CYIT Licenses ZSP500 to Meet DSP Needs of TD-SCDMA Wireless Devices
- ZSP500 Digital Signal Processor Selected by CYIT for Its Low-Power and Multimedia-Rich Performance Capabilities, Ideal in TD-SCDMA Applications
- The ZSP Architecture is Quickly Becoming a DSP-of-Choice for 3G Wireless Designs, Including Those Based on TD-SCDMA, CDMA2000 and WCDMA Standards
"China currently has sales of over five million handsets a month," said Allen Nogee, a principal analyst with In-Stat. "China's investment in the new TD-SCDMA standard will enable the rapid spread of telecommunications to China's thinly populated areas and the broad transmission bandwidth needed for access to the Internet. With this type of market potential in the world's largest populated country, the adoption of the ZSP500 by CYIT represents a significant design win for the ZSP architecture, which is quickly becoming a DSP-of-choice for 3G wireless designs."
CYIT selected the ZSP500 core for its unique ability to deliver quad-MAC capabilities in a very efficient footprint, low power consumption and best-in-class code density, making it ideal for the demands of high bandwidth 3G baseband processing and media-rich applications. In June 2003, CYIT was the first company to demonstrate a TD-SCDMA-based mobile phone prototype. Having now secured licenses for both the ARM9E and ZSP500 processors, CYIT anticipates developing its commercial TD-SCDMA mobile phone chipset by Q3 2005.
"The ease-of-integration of the ZSP500 enabled our rapid development of a low-power, high-performance TD-SCDMA solution," said Neng Nie, chairman of CYIT and president of ChongQing University of Posts & Telecom. "The power and performance of the ZSP500 combined with the expert support of the ZSP team was a winning solution for CYIT's next-generation wireless applications. We look forward to working with LSI Logic into the future as the 3G market grows."
George Liao, managing director of APAC, DSP Products Division of LSI Logic, added, "TD-SCDMA is a very important market for ZSP and we are pleased that CYIT has selected the ZSP500 for its design. The ZSP engineers have developed specific expertise in the TD-SCDMA standard to support our customers in developing the optimum system solution. The ZSP architecture is now established as a leader in the 3G market with adoption across three CDMA-based 3G standards: TD-SCDMA, CDMA2000 and WCDMA."
About the LSI Logic ZSP Processing Solutions
The LSI Logic ZSP Products Division is a leading licensor of signal processing cores and solutions. The ZSP processor architecture is gaining considerable momentum as the DSP of choice in many key vertical markets including 3G wireless handsets, multimedia and networked voice appliances. The ZSP roadmap offers a range of software compatible cores delivering performance points that meet the cost, power and efficiency constraints of today's SoC designs. A variety of standard products are also available for lower volume designs and prototype implementations. ZSP Solution Partners augment the technology with world-class software tools, EDA modeling support and a large portfolio of application software. For more information about the ZSP Processing Solutions please visit www.zsp.com.
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with Platform ASICs, standard-cell ASICs, standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com .
SOURCE LSI Logic Corporation
|
Related News
- CYIT Selects Vivante to Meet the GPU Needs of TD-SCDMA Wireless Devices
- Spreadtrum Utilizes CEVA-X DSP to Develop TD-SCDMA Baseband Processors for 3G Wireless Handsets
- ZTE Leverages Altera Stratix II FPGAs to Deliver New TD-SCDMA Remote Radio Unit
- Xilinx Announces Immediate Availability of TD-SCDMA Digital Front-End Reference Design
- Spreadtrum to Integrate Hantro Multi-Format Video Solution into their Next Generation 3G TD-SCDMA Baseband IC
Breaking News
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
Most Popular
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Imagination pulls out of RISC-V CPUs
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
E-mail This Article | Printer-Friendly Page |