MIPS, Hughes ink deal to develop set-top boxes
MIPS, Hughes ink deal to develop set-top boxes
By Semiconductor Business News
January 29, 2001 (1:22 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010129S0055
MOUNTAIN VEIW, Calif. -- MIPS Technologies Inc. and Hughes Network Systems today announced a three-year agreement to co-develop next-generation set-top boxes. As part of the deal, Hughes announced that it has standardized all of its system design activities on MIPS' 32-bit RISC processors. In addition, MIPS will provide HNS with advanced simulation and design tools. Hughes will integrate MIPS' MIPS32 4Kc microprocessor cores in its new line of DIRECTV set-top boxes. Hughes will introduce the products in the fall of 2001. "By providing support to [Hughes], MIPS Technologies has enabled them to reduce their time to market," said John Bourgoin, chairman and chief executive of MIPS. Hughes is among several companies competing in the exploding set-top box business. The digital set-top box market is projected to grow from 12.1 million in 2000 to 57.1 million in 2006, according Jon Peddie Associates.
Related News
- CeRoma Partners with ARM to Develop Next-Generation Digital TV Set-Top Boxes
- MIPS Technologies 24Kc Core to Power Advanced Digital Set-Top Boxes; Scientific-Atlanta Licenses MIPS32 24Kc Core
- MIPS Technologies Brings Android "Home" with Demos of World's First Android Set-top Boxes; New Partners and Key Technology Milestones
- DivX Certifies High-Definition Chip from Broadcom for HDTVs and Set-Top Boxes
- Horizon Semiconductors announces the world's first single chip dual channel 1080/60p HD decoder & integrated transcoder for Cable and Satellite Set-Top Boxes
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |