MindTree to demonstrate its Bluetooth capabilities on OMAP and Nucleus at CTIA Wireless 2005
IPs to be showcased will include EtherMind Bluetooth Stack and Profiles
Bangalore, March 15, 2005 - MindTree Consulting, a leading provider of Bluetooth Intellectual Properties (IPs) and Wireless solutions, today announced that it would showcase its Bluetooth Protocol Stack and Profiles, targeted for usage in mobile phones, on TI OMAP and Nucleus platforms at the CTIA Wireless 2005 at New Orleans, March 14-16, 2005.
MindTree offers one of the most complete suites of Bluetooth-based solutions in the industry. This includes EtherMind™ 1.2 Upper Layer Stack, Profiles such as Headset/Hands-free, Serial Adapter, Human Interface Devices (HID) and others, as well as BlueWiz™ 1.2 Baseband Controller. MindTree’s Bluetooth Stack and Profiles are specifically designed for ease of integration into mobile phones and embedded devices.
“Today we see Bluetooth being integrated into huge variety of products such as mobile phones, headsets, automotive and computer peripherals,” said Janakiraman S., MindTree President and Chief Executive Officer, R&D Services. “MindTree provides the right mix of Bluetooth and hardware/software solutions for mobile phones. Our Bluetooth IPs are demonstrated on TI platforms to enable a mobile phone to be used as a remote control device, for streaming of stereo audio to headsets, for image transfer from camera phones and for use as a cordless phone!”
MindTree offers a wide range of services for TI OMAP and a variety of operating systems such as Nucleus, Embedded Linux and Symbian. These services include development of applications, device drivers, flash file systems, power management software etc. MindTree also develops cellular wireless protocols, mobile application platforms and wireless network management software, among others.
MindTree has sold more than 22 licenses of its Bluetooth IPs in the last four years and its software is shipped as a standard embedded option in the platforms sold by global silicon vendors. MindTree also offers its world-class, design-engineering services to build prototypes for Bluetooth-enabled devices, leveraging its global delivery model and technology expertise to help clients bring their products to market faster.
About MindTree
MindTree Consulting is an international IT company that delivers affordable business and technology solutions through global software development. Co-headquartered in Somerset, NJ and Bangalore, India, the company approaches technology initiatives in a business context, with the industry knowledge of a seasoned management team and employees exceptionally skilled in technology, business analysis and project management. MindTree Consulting develops applications to help companies enhance their enterprise operations. The company also delivers R&D services and designs re-usable building blocks for hi-tech companies. MindTree is the world's youngest company to be assessed at Level 5 in both CMMi and P-CMM. MindTree has been ranked fifth in the Great Places to Work Study 2004 conducted by Grow Talent Company and Businessworld. MindTree has also been rated as one of the Best Employers in India for the second consecutive year in 2004 by Hewitt Associates. Please visit www.mindtree.com for more information.
|
MindTree Hot IP
Related News
- Aura Semiconductor Announces Partnership with Mindtree to Deliver Advanced Wireless Personal Area Network (WPAN) Solutions for IoT Devices
- Mindtree 4.2 Bluetooth Smart IP Powers NXP Kinetis KW41Z Wireless MCU
- CEVA to Demonstrate Software-Based LTE UE PHY and HD Video Platforms at CTIA Wireless 2010
- Hantro to Demonstrate High Performance Video Codec at CTIA Wireless in Las Vegas
- CEVA to Demonstrate New Multimedia and Indoor GPS Solutions for Wireless Handsets at 3GSM Asia 2005
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |