eASIC Expands its Global Presence to Korea By Signing An Agreement with Advanced Design Technology (ADT)
San Jose, California, March 22, 2005 -- eASIC® Corporation, a provider of Configurable Logic and Structured ASIC products, today announced the expansion of its award-winning Configurable Logic products to Korea through partnership with ADT (Advanced Design Technology, Korea), Co Ltd, a Fabless semiconductor company providing semiconductor design services and products using state-of-the-art System-on- Chip (SoC) implementation technologies. ADT has joined eASIC’s DSR (Design Service Representative) program and signed the partnership agreement. As part of this agreement, ADT will sell eASIC’s Structured ASIC products in Korea and also provide design services and support per the customer needs. This expansion is part of eASIC’s aggressive growth plans for Asia Pacific and inline with its channel distribution sales strategy.
“We are pleased to have ADT join our DSR partnership plan,” said Salah Werfelli, eASIC Executive Vice President of Strategic Business Worldwide. “We realized an increasing demand in Korea for rapid-turn and low-cost configurable logic solution. eASIC’s NRE-free offering allows for ‘no-barrier design start’ and enables quick ramp to volume production. Our innovative products can now be delivered with comprehensive local support and design services in the local language. We look forward to continue helping our customers to achieve lower total costs and higher performance together with ease-of-design.”
“We are very excited to represent eASIC in Korea and be able to provide our customers with a very cost-efficient and high performance Structured ASIC solution”, said Sang Jo, ADT Executive Vice President. “We believe that semiconductor design is the foundation of our country’s technology and ADT is aimed at contributing to construct a world-class semiconductor production with superior customer service. eASIC’s innovative technology is of great value as we continuously look for ways to use leading-edge technologies and complete our customers’ ASIC designs in short time-to-market and with low-cost.”
About eASIC
eASIC® has developed a breakthrough Configurable Logic technology aimed at dramatically reducing the overall fabrication cost and time of customized high-performance semiconductor chips. Its Structured eASIC architecture enables rapid and low-cost ASIC and SoC (System-on-Chip) designs by innovative use of proven programmable logic fabric in conjunction with single-via customizable segmented routing. As single-via generates ten times higher throughput of Direct-write e-Beam customization, it enables eASIC to offer NRE-free Structured ASIC. The Structured eASIC technology was successfully proven in silicon and validated by world-class semiconductor vendors. Partnering with industry leaders to jointly develop, manufacture and market Structured ASIC products, the company is positioned to become the preferred Structured ASIC solution.
eASIC Corporation is a privately held company, Venture Capital backed by Kleiner Perkins Caufield and Byers. Headquartered in San-Jose, California, eASIC was founded in 1999 by Zvi Or-Bach, the founder of Chip Express.
www.eASIC.com
About ADT
ADT is the leading SoC Design Services provider focused on delivering state-of-the-art design solutions to its customers. ADT has realized rapid growth dramatically in SoC design services market with complete design and engineering services by lowering their costs and reducing their time to market. And it also has developed IPs such as LVDS Rx/Tx, Mini-LVDS, RSDS, PLL and DLL to offer its customers top-notch design solutions. Headquartered in Bundang-gu near Seoul in Korea and founded in 2002. For more information, please visit: www.adtek.co.kr
|
Related News
- IPextreme Expands Global Presence with Three New Representatives: Maojet in Taiwan; Progate in Korea; and Sital in Israel
- eASIC Expands Global Presence by Adding New Channel Partners in Asia
- Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia
- NetSpeed Systems continues global expansion, expands presence in China
- CEVA Expands Global Presence with New Sales and Support Office in Shanghai, China
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |