Configurable controllers for PCIe 4.0 and CCIX supporting Dual Mode applications
D&R Headline News (October 2020)
Headlines for Thursday Oct. 29, 2020
intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard
intoPIX, leading provider of innovative compression solutions for audio-visual applications, today announces the release, with direct availability, of 8K TICO-XS encoder and decoder IP-Cores.- Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor
- Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure
- Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams
- SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
- Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process
- QuickLogic Joins Samsung SAFE IP Partner Program
Headlines for Wednesday Oct. 28, 2020
Analog Bits Announces Analog IP Availability on Samsung Technologies
Analog Bits announced a comprehensive and differentiating foundation analog IP portfolio today on multiple Samsung Foundry technologies, including 32LP, 28LPP, 28FDSOI, 14LPP, 8LPP, 7LPP, 5LPE.- Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
- DRAM Price Erosion Expected Through the End of 2020
- Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments
- Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps
- Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs
- Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools
- Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink
- QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
Headlines for Tuesday Oct. 27, 2020
AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader
AMD (NASDAQ: AMD) and Xilinx (NASDAQ: XLNX) today announced they have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion.- Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family
- Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing
- Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
- Cortus Announces the Opening of another New Design Centre in Meyreuil (France)
Headlines for Monday Oct. 26, 2020
Latest News- EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
- Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021
- Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
- Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
- North American Semiconductor Equipment Industry Posts September 2020 Billings
- Micro Magic, Inc. Unleashes World's Fastest RISC-V Core
Headlines for Friday Oct. 23, 2020
Latest News- Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
- Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th
Headlines for Thursday Oct. 22, 2020
PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY
PLDA, the industry leader in PCI Express® controller IP solutions has today unveiled their PCIe 5.0 demonstration. The demo showcases stable PCIe 5.0 Link Training (32 GT/s) and exceptional signal integrity with a Broadcom® PCIe 5.0 PHY platform.- TSMC Sees HPC As Next Inflection Point
- Arm partners with Mentor to offer complete verification service
- Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
- M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
- eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
- SmartDV Appoints Karthik Gopal as Asia General Manager
- Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
- GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO
Headlines for Wednesday Oct. 21, 2020
Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced gains in advanced to high-end audio applications with adoption and recognition from some of the top brands in musical instruments.- Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
- Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
- Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
- Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
- TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
- IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
Headlines for Tuesday Oct. 20, 2020
Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
Flex Logix Technologies, Inc. today announced availability of its InferX™ X1, the industry’s fastest AI inference chip for edge systems.- Codasip Announces a New Design Center in France
- Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
- TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
- Cadence Reports Third Quarter 2020 Financial Results
- SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
- SK hynix to Acquire Intel NAND Memory Business
Headlines for Monday Oct. 19, 2020
Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency
With an ever-increasing range of devices adding artificial intelligence (AI) functionality, Arm today announced the latest member of its Ethos product line, the Arm Ethos-U65 microNPU (Neural Processing Unit).- Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
- Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
- Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
- Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
- Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
Headlines for Thursday Oct. 15, 2020
CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
CSEM, a leader in ultra-low-power RF design, announced today at the GLOBALFOUNDRIES® (GF®) Global Technology Conference (GTC) EMEA that CSEM has released its Bluetooth Dual-Mode silicon IP on GF’s 22nm FD-SOI (22FDX®) platform for next generation of portable audio devices.- TSMC Reports Third Quarter EPS of NT$5.30
- GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
- Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
- Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
- JEDEC Announces Publication of JEDEC Module Sideband Bus
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
Headlines for Wednesday Oct. 14, 2020
China Forecast to Represent 22% of the Foundry Market in 2020
China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China’s economic growth but its foundry marketshare still increased by two percentage points to 21%.- Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
- Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
- TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator
Headlines for Tuesday Oct. 13, 2020
Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
Synopsys today announced its collaboration with Intel to achieve successful system-level interoperability between the Synopsys DesignWare Controller and PHY IP for PCI Express 5.0 and future Intel Xeon Scalable processors (codename Sapphire Rapids).- Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
- Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process
- MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
- Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing
- Imagination launches IMG B-Series: Doing more with multi-core
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
- Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
- OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset
- New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
- Cadence Brings Verification IP to the Chip Level with New System VIP Solution
Headlines for Monday Oct. 12, 2020
AMD Reported to Be Negotiating Purchase of Xilinx
AMD is said to be negotiating to buy Xilinx, and a deal could come as soon as next week. If the two companies agree, the deal would likely be worth approximately $30 billion, according to The Wall Street Journal.- AMD and Xilinx: A Match Made in Silicon Valley?
- Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
- AMD-Xilinx Deal: Bringing The Fight To The Data Center
- Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
- Menta Appoints ETSI as United States East Coast Representative
- intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows
- Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th
- Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference
Headlines for Thursday Oct. 08, 2020
Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators
Nvidia CEO Jensen Huang is confident that the Nvidia-Arm deal, the biggest in semiconductor history at $40 billion, will get past global regulators.- Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
- proteanTecs Announces Market and Regional Expansions
- Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs
- UMC Reports Sales for September 2020
- TSMC September 2020 Revenue Report
- Pushing the boundaries of performance and security to unleash the power of 64-bit computing
- Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
- Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification
- Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology
- Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology
Headlines for Wednesday Oct. 07, 2020
CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core
Today at the virtual TSN/A Technology and Applications Conference, silicon intellectual property provider CAST, Inc. announced a new IP core that implements a switch for Time-Sensitive Networking (TSN) Ethernet networks as increasingly used in automotive, industrial, medical, and other systems.- VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving
- Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System
- SmartDV Unveils SmartConf Testbench Generator
Headlines for Tuesday Oct. 06, 2020
Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications
These 32-bit MCUs boost operating performance up to 200 MHz using the Arm® Cortex®-M33 core based on Armv8-M architecture with Arm TrustZone® technology.Headlines for Monday Oct. 05, 2020
OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions
Interlaken C2C Controller IP from OpenFive and AXLinkIO SerDes IP from AnalogX achieves ultra-low latency and <1pJ/bit solution for a Tier-1 customer- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020
- Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
- GUC Monthly Sales Report - September 2020
- Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie
- TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G
- China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
- Efabless Extends Partnerships for Rapid Development Solution of Custom ICs
- Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
- Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development
Headlines for Thursday Oct. 01, 2020
Arteris IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip Assembly Company
Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced a definitive agreement with Magillem Design Services (EPA: MLMGL) under which Arteris IP will acquire the assets of Magillem Design Services (“Magillem”). Substantially all Magillem team members will be joining Arteris IP.- Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs
- Efinix Announces Availability of Reconfigurable Acceleration Platform
- New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive