D&R Headline News (January 2024)
Headlines for Wednesday Jan. 31, 2024
Navigating the RISC-V Revolution in Europe
RISC-V International expects the market for RISC-V IP and software to reach $1.07 billion by 2025.Headlines for Tuesday Jan. 30, 2024
Arteris Selected by Rain AI for Use in the Next Generation of AI
Optimizing on-chip mesh connectivity with Arteris’ FlexNoC 5 physically aware network-on-chip enables Rain AI to realize faster data transfers at ultra-low power to achieve record performance for Generative AI and Edge AI computing at scale.- Alphawave Semi and proteanTecs Collaborate to Provide System Insights and Analytics for Custom Silicon and Chiplets
- DCD celebrates 25 years
Headlines for Monday Jan. 29, 2024
INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology
Siemens Digital Industries Software announced today that INTERCHIP CORPORATION, a leading fabless semiconductor company specializing in high precision, low power oscillator products, used Siemens‘ Analog FastSPICE platform and Symphony™ platform to verify its newest IPV Voltage-Controlled Crystal Oscillator (VCXO) integrated circuit (IC) and IPS Simple Packaged Crystal Oscillator (SPXO).Headlines for Friday Jan. 26, 2024
CEO Interview: Charlie Janac of Arteris -- "Pick a Viable Path, Don't Give Up"
Arteris CEO Charlie Janac gives EE Times a glimpse of his 40 years in the EE industry. He reflects on the time Jim Solomon asked him to become the acting CFO of SDA and how that triggered a long career through its transition to Cadence.Headlines for Thursday Jan. 25, 2024
Xylon's logicBRICKS HDR ISP IP Suite Gets an RGB-IR Image Processing Upgrade
Xylon just upgraded company’s logicBRICKS High Dynamic Range (HDR) Image Signal Processing (ISP) IP Suite with the new RGB-IR image processing module.- Logic Fruit Technologies Launches FlexRay RTL IP CORE
- China ten years behind and staying there
- Qualinx partners with EU Space Agency to develop a GNSS receiver for a service to detect spoofing and boost resilience
- eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology
- Frontgrade Gaisler and RISC-V's Space Journey
- Intel and UMC Announce New Foundry Collaboration
Headlines for Wednesday Jan. 24, 2024
Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard
Keysight Technologies introduces Chiplet PHY Designer, the latest member in its family of high speed digital design and simulation tools that provides die-to-die (D2D) interconnect simulation, which is a key step in verifying performance for heterogeneous and 3D integrated circuit (IC) designs commonly referred to as chiplets.Headlines for Tuesday Jan. 23, 2024
Revolutionizing ProAV Networks: intoPIX Unveils TicoXS FIP for Unmatched 4K & 8K AVoIP Excellence at ISE 2024
intoPIX an industry pioneer in advanced video compression technologies tailored for ProAV networks, is poised to present the groundbreaking TicoXS FIP codec in diverse and challenging environments, across various processors, and for a multitude of applications.- Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development
- Strengthening the security of broadband 5G/6G communication networks
- Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers
- Menta exhibits at Chiplet Summit and presents its new scalable chiplet platform, MOSAICS-LP
- Sondrel completes a multi-billion transistor chip design at 5nm
Headlines for Monday Jan. 22, 2024
Alphawave Semi - Q4 2023 Trading and Business Update
Alphawave Sem is pleased to publish its trading and business update for the three months ended 31 December 2023. Record quarterly bookings of US$128.7m- Renesas Extends Tender Offer for Proposed Acquisition of Sequans
- T2M Unveils ASIL B-Certified CAN and LIN IP Cores, Securing 11 Licenses in 2023
Headlines for Friday Jan. 19, 2024
Latest News- TSMC Reports Fourth Quarter EPS of NT$9.21
- Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification
Headlines for Thursday Jan. 18, 2024
ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM
ITRI has joined forces with Taiwan Semiconductor Manufacturing Company (TSMC) for pioneering research into the development of a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.- proteanTecs Launches Power Reduction Solution for High Performance Markets
- Brian Philofsky Joins Flex Logix as Senior Director of Solutions Architecture
Headlines for Wednesday Jan. 17, 2024
YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona
YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona.- OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity
- POLYN Announces Agreement with SkyWater Technology to Produce its First Commercial Voice Processing Chip
- NVM Express Announces the Release of the Computational Storage Feature
- BrainChip and MYWAI Partner to Deliver Next-Generation Edge AI Solutions
- Innatera shows RISC-V neuromorphic edge AI microcontroller
Headlines for Tuesday Jan. 16, 2024
Synopsys to Acquire Ansys, Creating a Leader in Silicon to Systems Design Solutions
Synopsys (NASDAQ: SNPS) and Ansys (NASDAQ: ANSS) today announced that they have entered into a definitive agreement under which Synopsys will acquire Ansys.- Chiplet Makers Expect to Disrupt Incumbents
- Gartner Says Worldwide Semiconductor Revenue Declined 11% in 2023
- MIPS Aims to Give Back Control, for AI-Centric Compute
Headlines for Monday Jan. 15, 2024
EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library
EnSilica, a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP.- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications
- Unveiling Sonata: Affordable CHERI Hardware for Embedded Systems
- EdgeCortix Expands Leadership Team with Semiconductor Industry Veteran Tim Vehling as Executive Vice President of Global Sales
- Unveiling a Cutting-Edge 12-bit 5Msps SAR ADC IP Core - Industry-Leading Features, Silicon Proven, and Available for Licensing Now
Headlines for Friday Jan. 12, 2024
Crypto Quantique and iMQ to enable quantum secure chip-to-cloud connection
Crypto Quantique’s QuarkLink embedded and cloud software platform provides secure connectivity to ensure compliance with incoming EU legislationHeadlines for Thursday Jan. 11, 2024
Digital Core Design Presents D68000-CPU32+ for well-known 68k family
DCD’s latest IP Core is a modern incarnation of CPU32+ based on M68020, which are no longer available, yet still in use in millions of projects. What differs D68000-CPU32+ from other similar solutions is automatic byte alignment feature that is not available in CPU32.- Crypto Quantique partners with Blaitek to enable quantum secure chip-to-cloud connection
- Innatera unveils its groundbreaking ultra-low power neuromorphic microcontroller
Headlines for Wednesday Jan. 10, 2024
CEO interview: MIPS' Sameer Wasson on a RISC-V reboot
MIPS Inc. is emerging as a significant RISC-V processor core licensor under its recently-appointed CEO Sameer Wasson. eeNews Europe interviewed Wasson to find out how he expects to navigate the choppy waters of a processor market in flux.- Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
- intoPIX Showcases Groundbreaking Sensorand Video Compression Technologies at CES 2024
- GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
- CXL Overcomes Hierarchical Routing Limits
- TSMC December 2023 Revenue Report
- Global Semiconductor Sales Increase 5.3% Year-to-Year in November
- Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth Qualified 5.4 PAwR and LE Audio Solutions
- SCALINX, Leading Fabless Semiconductor in System-on-a-Chip Design, Secures €34 Million in Second Round Funding
- Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio
Headlines for Tuesday Jan. 09, 2024
Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F
- VeriSilicon extends watch GUI ecosystem in partnership with QDay Technology for enhanced user experience
- GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology
- Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products
- Semiconductor Market: Rebound Expected in 2024, But Challenges Lie Ahead
- VeriSilicon's 2nd generation automotive ISP series IP passed ISO 26262 ASIL B and ASIL D certifications
- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product
- Thalia's AMALIA qualified on 12nm FinFET technology
- MIPS Launches New Corporate Brand At CES 2024
Headlines for Monday Jan. 08, 2024
VeriSilicon unveils the new VC9800 IP for next generation data centers
VeriSilicon today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications.- Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports
- Cadence Acquires Invecas to Accelerate System Realization
- Ceva and India's No. 1 Audio and Wearable Brand, boAt, Announce Strategic Partnership to Enhance the Wireless Audio Experience
- Ceva Expands AI Ecosystem for its Class-Leading NPU IP with New Partnerships for Automotive and Edge AI
- Comcores JESD204D IP core conforming to the Revision D of the JESD204 standard released in Dec'2023 now available
- The SHD Group Has Released a Complimentary Version of the 2024 RISC-V Market Analysis Report Containing Current Market Data and Future Projections
- OPENEDGES Achieves ISO9001: 2015 Certification, Proving IP Quality for its Customers
- Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
- BrainChip and NVISO Group Demonstrate AI-Enabled Human Behavioral Analysis at CES 2024
- DisplayPort v1.4 Tx PHY and Controller IP Cores which is Silicon proven in 12nm technology and also production proven is available for Worldwide instant licensing
Headlines for Friday Jan. 05, 2024
Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
Omni Design Technologies today announced their expanded silicon IP solutions, on advanced FinFET nodes, for next generation LiDAR (Light Detection and Ranging) applications.- GUC Monthly Sales Report - December 2023
- UMC Reports Sales for December 2023
- Andes Announces General Availability of the New RISC-V Out-Of-Order Superscalar Multicore Processor, the AndesCore™ AX65
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
Headlines for Thursday Jan. 04, 2024
Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services
By leveraging Arm Neoverse™ Compute Subsystems (CSS), Faraday is poised to deliver cutting-edge cloud, high-performance computing (HPC), and AI chips with unparalleled performance and innovation.- MulticoreWare and Imagination collaboration accelerates automotive compute workloads
- BrainChip to Unveil Akida Neuromorphic Processor Enabled by Microchip's 32-bit MPU at CES 2024
- VESA Updates Adaptive-Sync Display Standard with New Dual-Mode Support
Headlines for Wednesday Jan. 03, 2024
Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
RivieraWaves Wi-Fi 7 IP platform for next generation of Wi-Fi Access Point and Station/Client products, offers full-featured, cost- and power-optimized solutions for integrating high-performance Wi-Fi 7 connectivity into SoCs- M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission
- Arm PCs Get a New Lease on Life
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports
- MIPS Welcomes New Executives as Part of Company's Growth and Expansion
Headlines for Tuesday Jan. 02, 2024
Synopsys plus Ansys: The making of an EDA giant?
The news about Synopsys’ potential deal to buy Ansys for over $400 per share first appeared on Bloomberg late Thursday, 21 December. However, according to a Wall Street Journal report published on Friday, there could also be other suitors- Siemens EDA faces Chinese startup competitor
- ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024
- Accelerate Innovation: Harnessing the Speed of Tomorrow with PCIe Gen 4 PHY and Controller IP Cores