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Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem (Monday Oct. 15, 2018)
The emergence of the Internet of Things (IoT) presents a tremendous opportunity to disrupt the way we interact with devices and the world around us. However, solving the complexity, fragmentation and diversity challenges of IoT devices and the data generated by them is not an easy task.
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Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada (Monday Oct. 15, 2018)
Vidatronic, Inc. today announced that it has signed a representative agreement with Schoenduve Corporation of California.
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Dialog Semiconductor and Apple enter agreement (Thursday Oct. 11, 2018)
Dialog Semiconductor plc (XETRA:DLG), today entered into an agreement with Apple Inc. to license its power management technologies, transfer certain of its assets and over 300 employees from Dialog to support chip research and development.
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Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications (Thursday Oct. 11, 2018)
Spectral Design & Test Inc. (SDT), the leading provider of embedded MemoryIP, announced it has signed a joint marketing agreement (JMA) with NSCore Inc to OEM MTP/OTP solutions based on SDT’s Memory Development EDA platform.
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Sankalp Semiconductor Opens Second Design Centre in Bangalore (Wednesday Oct. 10, 2018)
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today announced opening of its second new design centre in Bangalore.
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Arasan Chip Systems Relocates it's Corporate Headquarters to accommodate future growth (Monday Oct. 08, 2018)
Arasan today announced the relocation of its corporate headquarters to 2150 N 1st Street, San Jose CA 95131 to accommodate future growth while continuing to be strategically located at the heart of Silicon Valley.
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Vidatronic Selects Redtree Solutions as Its Sales Representative for European and Middle-Eastern Markets (Friday Oct. 05, 2018)
Vidatronic, Inc. today announced the appointment of Redtree Solutions as the distributor of its proprietary power management and CMOS radio frequency (RF) intellectual property (IP) cores and design services in European and Middle-Eastern marketplaces.
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HDL Design House Appoints New Sales Representative for US and Canada (Wednesday Sep. 19, 2018)
HDL Design House, provider of digital, analog, and back-end design and verification services and products in various architectures and numerous areas of SoC and complex FPGA designs, today announced that it has signed a representative agreement with Camille Kokozaki , President of Design Rivers, for the territory of the USA and Canada.
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Vodafone to co-operate on integrated SIM with Arm (Friday Sep. 14, 2018)
Vodafone has today announced it will be collaborating with Arm on its integrated SIM (iSIM) technology. The two companies will work together to advance this technology, and agree the iSim will be critical in accelerating the market development of cellular IoT by delivering scalable, commercially viable solutions and significantly reducing the cost of connected IoT devices.
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Intel Acquires NetSpeed Systems for Chip Design (Tuesday Sep. 11, 2018)
Intel today announced the acquisition of NetSpeed Systems, a San Jose, California-based provider of system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP).
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Renesas to Acquire Integrated Device Technology, to Enhance Global Leadership in Embedded Solutions (Tuesday Sep. 11, 2018)
Renesas and IDT today announced they have signed a definitive agreement under which Renesas will acquire IDT for US$49.00 per share in an all-cash transaction representing an equity value of approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar).
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Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia (Monday Sep. 10, 2018)
Codasip, the leading supplier of RISC-V® embedded processor IP, today announced that it has signed new reseller representative agreements with leading firms in China, Taiwan, Japan, and India.
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Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round (Thursday Sep. 06, 2018)
ThinCI Inc., an AI hardware startup developing computing platforms for the expanding AI/Machine Learning market has announced the successful close of its $65 Million Series C round.
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NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks (Tuesday Sep. 04, 2018)
NXP Semiconductors has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving.
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RoodMicrotec selected as key partner for EnSilica automotive ASIC project (Tuesday Aug. 28, 2018)
RoodMicrotec N.V., the leading independent company for semiconductors supply and quality services, has been selected by EnSilica as a key partner to support a major automotive ASIC design win.
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Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America (Wednesday Aug. 22, 2018)
Flex Logix Technologies, Inc.the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has hired Quantum Leap Sales in response to growing demand for its leading eFPGA platform in North America.
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Soitec and MBDA to Acquire Dolphin Integration Assets (Tuesday Aug. 21, 2018)
Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.
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Skyworks Closes Acquisition of Smart Interface Innovator Avnera Corporation (Friday Aug. 17, 2018)
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of highperformance analog semiconductors connecting people, places and things,today closed its acquisition of Avnera Corporation, a leading developerof Analog System on Chips (ASoCs). The companies entered into adefinitive agreement on August 3, 2018.
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OPENEDGES Joins SiFive's DesignShare (Tuesday Aug. 14, 2018)
SiFive, the leading provider of commercial RISC-V processor IP, today announced a new member to its growing DesignShare economy: OPENEDGES, a provider of IPs for smart computing.
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UltraSoC selects MosChip to support its growth in India (Tuesday Aug. 14, 2018)
UltraSoC today announced that it has appointed MosChip as its technical sales representative in India, as part of a program to support the rapidly developing global market for its embedded analytics technology.
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Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions (Thursday Aug. 09, 2018)
Andes Technology has created a RISC-V core licensing project and has signed joint promotion agreements to form a multinational design service alliance with several top ASIC/SoC design service companies. The alliance is expected to continue expanding eventually reaching 20 or more companies globally in the following several months.
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Skyworks to Acquire Smart Interface Innovator Avnera Corporation (Thursday Aug. 09, 2018)
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high performance analog semiconductors connecting people, places and things, today announced it signed a definitive agreement to purchase Avnera Corporation, a leading developer of Analog System on Chips (ASoCs).
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Mobiveil Inc. and SiFive, Inc. partner to develop RISC-V based configurable SSD Platform For Data Center and Enterprise storage Applications (Wednesday Aug. 08, 2018)
Mobiveil has selected SiFive's multicore E51 and U54 Core IPs to power Mobiveil's new advanced configurable Gen4 PCIe-NVMe SSD platform offering a high performance and low power SSD solution for data center storage applications
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eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP (Tuesday Aug. 07, 2018)
SiFive and eSilicon today announced that, after extensive review and testing of available options in the market, eSilicon has selected the SiFive E2 Core IP Series as the best solution for its next-generation SerDes IP at 7nm.
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Lekha Wireless appoints T2M for global marketing, representation and business development (Tuesday Aug. 07, 2018)
Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
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Arm acquires Treasure Data to set the stage for IoT transformation (Monday Aug. 06, 2018)
The Internet of Things (IoT) will give businesses superpowers. Whether it’s an energy provider drawing data from its infrastructure to sense failures; a sensor-equipped building anticipating and then proactively dealing with occupants’ needs; or a retailer using data streams from its stores and warehouses to streamline operations – IoT systems can be transformational.
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Wave Computing Announces Strategic Collaboration with Broadcom For Next-Generation AI DPU ASIC (Thursday Aug. 02, 2018)
Wave Computing today announced a strategic collaboration with Broadcom Inc.. The companies will collaborate to bring Wave’s next-generation dataflow processing unit (DPU) to market at the leading-edge 7nm process node.
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Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources (Thursday Jul. 26, 2018)
China’s top state chip manufacturer Tsinghua Unigroup Ltd has signed a deal to acquire French smart chip components maker Linxens for about 2.2 billion euros ($2.6 billion), five people with direct knowledge of the matter said.
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Kandou Bus Closes Series B Investment Round (Wednesday Jul. 25, 2018)
Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M investment from Bessemer Venture Partners and Walden Investment. The close of the Series B signifies Kandou’s accomplishment of critical research and development milestones and key design wins.
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Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions (Tuesday Jul. 24, 2018)
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the era of high-performance computing.
