English
OTP/eMTP: 8K - 512Kbit NVM in 65nm Standard Logic CMOS process
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Sondrel Expands into India (Thursday Sep. 21, 2017)
Sondrel, a UK headquartered IC Design Consultancy, today announced the establishment of an entity in India, having opened its first engineering design centre in Hyderabad. The company provide concept to silicon design services to an international client base.
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videantis receives growth financing from eCAPITAL to accelerate market penetration in embedded vision and autonomous driving (Wednesday Sep. 20, 2017)
videantis GmbH, a leading supplier of visual computing solutions, today announced the successful closing of a growth financing round led by eCAPITAL. The visual computing technology of videantis is integrated into intelligent cameras and smart sensing systems, enabling autonomous driving, advanced driver assistance systems (ADAS), drones, novel smartphone cameras, and surveillance cameras.
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Synopsys Strengthens Design-Technology Co-Optimization Solution with Acquisition of QuantumWise (Tuesday Sep. 19, 2017)
Synopsys today announced it has completed its acquisition of QuantumWise, a leading provider of simulation tools for materials modeling in early manufacturing process development.
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CoreHW accelerates growth - Panostaja invests in CoreHW by purchasing a majority shareholding (Tuesday Sep. 19, 2017)
On Friday 15th September, CoreHW has signed an agreement on selling the shares in CoreHW to Panostaja Plc. After the transaction, Panostaja will own 63 percent of the new group to be formed through the transaction.
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Lattice Semiconductor and Canyon Bridge Capital Partners, LLC Announce Termination of Merger Agreement Following Decision from President Trump (Thursday Sep. 14, 2017)
Lattice Semiconductor Corporation (NASDAQ:LSCC) today announced the termination of the acquisition by Canyon Bridge Capital Partners, LLC (“Canyon Bridge”) of Lattice Semiconductor following an order from the President of the United States.
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UltraSoC expands to address embedded analytics market opportunity (Wednesday Sep. 13, 2017)
UltraSoC today announced a significant global expansion to address the increasing demand for more sophisticated, ‘self-aware’ silicon chips in a range of electronic products, from lightweight sensors to the server farms that power the Internet.
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Inside Secure Announces Successful Fundraising of 16M Euros (Monday Sep. 11, 2017)
Inside Secure (Euronext Paris: INSD), at the heart of security solutions for mobile and connected devices, announced today the successful completion of fundraising in the global amount of €16 million through the issuance of bonds convertible into new shares and/or exchangeable for existing shares (“OCEANE”) due in 2022.
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eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC's Custom IC Platform (Wednesday Sep. 06, 2017)
eASIC reacts to increased demand in China for its configurable custom IC’s in applications such as artificial intelligence, virtual reality, data center acceleration, data center storage and next generation communications.
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Flex Logix Joins TSMC IP Alliance Program (Tuesday Sep. 05, 2017)
Flex Logix Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC’s Open Innovation Platform®.
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Vidatronic Partners with Avant Technology as Its Distributor for Asian Markets (Friday Sep. 01, 2017)
Vidatronic, Inc. today announced the appointment of Avant Technology as the distributor of its proprietary power management Intellectual Property (IP) cores, products, and design services in Asian marketplaces, including representation in China, Taiwan, Korea, Japan, Malaysia, Vietnam and Singapore.
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Qualcomm and Himax Technologies Jointly Announce High Resolution 3D Depth Sensing Solution (Thursday Aug. 31, 2017)
Qualcomm and Himax today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.
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Siemens to Acquire TASS International, Adding Automated Driving Solutions to Portfolio (Thursday Aug. 31, 2017)
emens will acquire TASS International, a global provider of simulation software, plus engineering and test services aimed primarily at the automotive industry, and focused on autonomous driving, integrated safety, advanced driver assistance systems (ADAS), and tyre modeling.
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S3 Semiconductors refocuses on design-to-delivery custom chip service for industrial applications (Wednesday Aug. 30, 2017)
S3 Group has announced a change in strategy for its custom semiconductor business, S3 Semiconductors (S3semi). It will now focus on industrial and communications OEMs, converting their electronic systems and boards into mixed-signal integrated circuits and delivering packaged and tested chips, rather than just design services and IP.
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Inside Secure completes the acquisition of Meontrust and enters Security-as-a-Service market (Tuesday Aug. 29, 2017)
Inside Secure, at the heart of security solutions for mobile and connected devices, today announced it has completed the acquisition of Meontrust, a Finland-based cybersecurity emerging-growth company, in an all-cash cash transaction of up to 5 million euros.
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Silvaco Announces Completion of SoC Solutions Acquisition (Monday Aug. 28, 2017)
Silvaco, Inc. today announced it has completed the acquisition of SoC Solutions, a privately held company providing semiconductor IP and services located in the greater Atlanta, Georgia area.
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TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China (Monday Aug. 28, 2017)
TowerJazz the global specialty foundry leader, and Tacoma Technology Ltd and Tacoma (Nanjing) Semiconductor Technology Co., Ltd (collectively known as “Tacoma”) announced today that Tower has received a first payment of $18 million net, rendering phase one of the framework agreement with Tacoma binding.
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Sondrel Announces 10M GBP Investment in European Semiconductor Sector (Thursday Aug. 24, 2017)
Sondrel today announced its target to hire 100 electronic engineers in Europe, amounting to an investment of ten million pounds into the semiconductor sector over the next 3 years. This comes swiftly on the heels of the acquisition of the IMGWorks team from Imagination Technologies; a move that increased the engineering headcount of the company to over 250 in July of this year.
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Brite Semiconductor partners with SaberTek, Inc. to develop low-cost transceiver chips for WiSUN and 802.11ah (Wednesday Aug. 23, 2017)
Brite Semiconductor, a world-leading ASIC design solution provider headquartered in Shanghai, China, today announced to license SaberTek Inc. SBR6201 transceiver IP to develop high performance and low cost Wireless Smart Utility Network (Wi-SUN) and 802.11ah radio chip.
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SiFive and Rambus to Provide IP to the 'DesignShare' Economy (Monday Aug. 21, 2017)
SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus, (NASDAQ: RMBS), a leader in digital security, semiconductor and IP products and services, to make Rambus cryptography technology available for the SiFive Freedom platforms.
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Sankalp Semiconductor awarded with ISO 9001: 2015 certification (Wednesday Aug. 16, 2017)
Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its upgradation to ISO 9001:2015 certification. By meeting the extensive criteria for the ISO 9001: 2015 standards, the company reinforces its ability to deliver IC design services with continuous improvements in its offerings and customer delivery processes.
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Global Unichip Achieves SGS-TUV ISO26262 Certification (Thursday Aug. 03, 2017)
Global Unichip Corp. (GUC), the Custom ASIC Leader, is opening new opportunities for companies focusing on the emerging Automotive IC markets thanks to its recent designation as an ISO26262-certified supplier.
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Moortec Semiconductor announces new sales representatives in Japan (Tuesday Aug. 01, 2017)
Moortec Semiconductor, specialists in embedded In-Chip Monitoring Subsystem IP are pleased to announce that they are working with Spinnaker Systems, Inc. in Japan. Spinnaker are based in Kanagawa, just south of Tokyo and provide design-driven sales for companies in the semiconductor sector, with a particular focus on broadcast, communication, consumer and automotive markets.
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INVECAS Acquires Lattice's HDMI Design Team and Simplay Labs Subsidiary (Monday Jul. 31, 2017)
INVECAS today announced that it has signed a definitive agreement, pursuant to which INVECAS will acquire Lattice Semiconductor Corporation’s (NASDAQ: LSCC) HDMI design team and Simplay Labs subsidiary, which oversees standards compliance and interoperability testing services.
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Sankalp Semiconductor to hire 300 engineers (Wednesday Jul. 26, 2017)
Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its plan to hire 300 engineers in the next 12 months. Sankalp plans to hire engineers for its India design centers in Bangalore, Hubli and Kolkata.
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Founders of DeepMind, OpenAI and Chief Scientist at Uber back Graphcore in new $30m funding round led by Atomico (Friday Jul. 21, 2017)
Graphcore IPU products will lower the cost of accelerating AI applications, increase the performance of both training and inference by 10x to 100x compared to the fastest systems today and enable recent success in deep learning to evolve rapidly towards useful, general artificial intelligence.
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REFLEX CES Takes Its Autonomy with MBO Partenaires (Thursday Jul. 20, 2017)
The French specialist in complex electronic embedded systems associates with MBO Partenaires and takes its independence from the PLDA group. This spin-off, led by the manager Sylvain Neveu, allows the management team to hold the majority of the equity.
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HDL Design House and AFuzion Synergy to Enhance DO-254 Projects (Thursday Jul. 20, 2017)
HDL Design House and AFuzion have started a collaboration to simplify the complex DO-254 project requirements and reduce overall project time, by relying upon HDL DH’s verification expertize and AFuzion’s DO-254 training and avionics certification services.
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Uniquify Joins FDXcelerator Program to Deliver DDR Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform (Tuesday Jul. 11, 2017)
Uniquify today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. This partnership extends Uniquify’s existing co-operation with GF to include FD-SOI technology to enable faster, broader deployment of the foundry’s 22FDX® and 12 FDX™ FD-SOI processes that support IoT, mobile and wireless applications.
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GUC Opens New Korea Office (Tuesday Jul. 11, 2017)
Global Unichip Corp. (GUC), the custom ASIC LeaderTM, has greatly expanded its facilities in Seoul, Korea. The company's new offices are located in AnnJay Tower at 3F, 208 Teheran-ro, Gangnam-gu, Seoul.
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Spectra7 Microsystems Inc. Announces Closing of $4.6 Million Bought Deal Financing and First Tranche of Private Placement of $1.3 Million (Thursday Jul. 06, 2017)
Spectra7 Microsystems Inc. is pleased to announce that it has closed its previously announced bought deal offering of 11,500,000 units (“Units”) at a price of $0.40 per Unit, including the full exercise of the over-allotment option, for aggregate gross proceeds of $4,600,000 (the “Public Offering”).
