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Deals / Success Stories News

• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel (Friday Oct. 11, 2024)
  SEMIFIVE has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production.
  
  
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs (Thursday Oct. 03, 2024)
  Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify the secure boot process for industrial PCs (IPCs) using its QuarkLink security platform.
  
  
• EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP (Wednesday Oct. 02, 2024)
  EXTOLL has been selected by Frontgrade Technologies, a leading provider of mission critical electronics for aerospace and defense, as a key SerDes IP block supplier for its ASIC development portfolio.
  
  
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Thursday Sep. 26, 2024)
  SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.
  
  
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP (Thursday Sep. 26, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution.
  
  
• GUC Announces Adoption of HBM3E IP by CSP Data Center (Tuesday Sep. 24, 2024)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several High-Performance Computing (HPC) solution providers.
  
  
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Tuesday Sep. 24, 2024)
  Dolphin Design, the leader in Power management IP, and SigmaSense, the leader in direct-to-digital precision sensing, today announced a partnership to deliver Dolphin Design’s advanced power management solutions in the development of SigmaSense’s latest touch controller SDC300, now in volume production.
  
  
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Monday Sep. 23, 2024)
  The companies are expanding their collaboration where Omni Design’s advanced multi-gigahertz Swift™ data converters and supporting cores are deployed in EnSilica’s turnkey ASIC solutions for advanced wireless communications and digital beamformer applications.
  
  
• RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform (Wednesday Sep. 18, 2024)
  Menta has delivered its best technology to the Research Association for Advanced Systems (RaaS).
  
  
• Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family (Wednesday Sep. 18, 2024)
  In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors' latest automotive audio DSP family
  
  
• Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar (Monday Sep. 16, 2024)
  Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), and supporting IP solutions.
  
  
• Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC (Wednesday Sep. 11, 2024)
  NX45 Becomes the Only RISC-V Core to Pass Rivos’ Rigorous Verification Process After Extensive Evaluation of Leading RISC-V Cores
  
  
• Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design (Tuesday Sep. 10, 2024)
  Arteris FlexNoC 5 interconnect IP physical awareness feature enhances timing closure, alleviates wire congestion and reduces design iterations for more reliable chip design
  
  
• intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology (Tuesday Sep. 10, 2024)
  intoPIX, the leading expert in innovative video compression solutions, is proud to announce the integration of its revolutionary JPEG XS technology into BCnexxt's playout platform, Vipe.
  
  
• EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP (Tuesday Sep. 10, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by PsiQuantum as a key SerDes IP block supplier for its digital ASIC development.
  
  
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions (Monday Sep. 09, 2024)
  Movellus and Tenstorrent announced that Tenstorrent has licensed Movellus’ digital IP family as part of a strategic engagement, for its AI and HPC chiplets
  
  
• Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company (Monday Sep. 09, 2024)
  Qualitas Semiconductor announced a groundbreaking licensing agreement with a major fabless company based in the United States. This agreement highlights Qualitas' cutting-edge 2nm GAAFET MIPI DCPHY IP solutions, designed to enhance SoC(System on Chip) design architecture.
  
  
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market (Monday Sep. 02, 2024)
  Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC-V in automotive electronics.
  
  
• Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI (Tuesday Aug. 27, 2024)
  Dolphin Design announces a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union’s PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies.
  
  
• Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro (Monday Aug. 19, 2024)
  Everspin Technologies today announced a new strategic contract with Frontgrade Technologies.
  
  
• Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA (Monday Aug. 19, 2024)
  This contract is part of the third tranche of the $5.26 Million Strategic Radiation Hardened Contract awarded to QuickLogic
  
  
• AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Wednesday Aug. 14, 2024)
  VeriSilicon today announced that AutoChips has adopted VeriSilicon’s high-performance IP portfolio in its new generation intelligent cockpit domain control SoC AC8025, including Neural Network Processing Unit (NPU) IP, Video Processing Unit (VPU) IP, and Display Processing IP.
  
  
• Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company (Monday Aug. 12, 2024)
  QUALITAS SEMICONDUCTOR, a leading provider of high-speed interface IP, has entered into a substantial licensing agreement with a leading fabless company based in South Korea.
  
  
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform (Thursday Aug. 01, 2024)
  M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
  
  
• FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs (Wednesday Jul. 31, 2024)
  FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the second-gen AI accelerator, RNGD (pronounced “Renegade”), the most efficient data center accelerator for high-performance large language and multimodal models.
  
  
• Raaam signs lead licensee for SRAM replacement technology (Monday Jul. 29, 2024)
  Memory IP licensing startup Raaam Memory Technologies Ltd. (Petah Tikva, Israel) has signed a major fabless chip company as its lead partner to help it develop an alternative to static RAM.
  
  
• Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs (Thursday Jul. 25, 2024)
  Balletto BLE 5.3 and Matter Wireless Microcontroller family features Neural Co-Processor for AI/ML Workloads targeting wireless audio and the smart home
  
  
• Comcores supports BAE systems as a key partner with JESD204C IP (Wednesday Jul. 24, 2024)
  Comcores, a leading provider of high-performance and silicon-proven digital IP cores is chosen by BAE Systems as a key partner for the STEAM PIPE project to supply JESD204C IP.
  
  
• STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module (Thursday Jul. 11, 2024)
  Fully programmable certified ST87M01 LTE Cat-NB2 NB-IoT industrial module leverages Ceva-Waves Dragonfly NB-IoT platform IP to deliver ultra-reliable Low Power Wide Area Network (LPWAN) connectivity
  
  
• Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight (Thursday Jun. 27, 2024)
  The European Space Agency (ESA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, a contract under the ARTES Core Competitiveness programme to qualify the GR716B microcontroller for flight.