Fabless / IDM News
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Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors (Thursday Aug. 29, 2024)
Today, Efficient announced a strategic partnership with GlobalFoundries (GF) to bring to market a new high-performance computer processor that is up to 166x* more energy-efficient than industry-standard embedded CPUs.
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GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access (Tuesday Aug. 27, 2024)
GigaDevice announces it has signed an Arm® Total Access (ATA) licensing agreement, laying the foundation for ongoing advancement in the design of embedded chips and the strategic expansion of its GD32 MCU product roadmap.
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SEALSQ Introduces QS7001, a Newly Developed Cutting-Edge RISC-V Secure Hardware Platform, Specifically Designed for IoT security in the Post-Quantum Era (Monday Aug. 19, 2024)
In response to the growing quantum threat, SEALSQ has introduced the QS7001, a cutting-edge RISC-V secure hardware platform specifically designed for IoT security in the post-quantum era. The platform incorporates NIST’s recommended quantum-resistant algorithms, Kyber and Dilithium, to ensure robust protection against quantum-enabled breaches
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NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks (Monday Aug. 05, 2024)
NEO Semiconductor announced today the development of its 3D X-AI™ chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
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Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver (Tuesday Jul. 30, 2024)
Rambus today announced the availability of its DDR5 Client Clock Driver (CKD) for next-generation, high-performance desktops and notebooks.
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SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing (Friday Jul. 12, 2024)
SEALSQ, a leader in developing and selling semiconductors, PKI, and post-quantum technology hardware and software products, announces the breakthrough adoption and future potential of its RISC-V technology.
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Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-bit Microprocessors (Tuesday Jul. 09, 2024)
Microchip’s PIC64GX family manages mid-range intelligent edge compute requirements using a 64-bit RISC-V® quad-core processor with Asymmetric Multiprocessing (AMP) and deterministic latencies.
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Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP (Monday Jul. 08, 2024)
Vybium is a fabless semiconductor startup building RISC-V-based solutions that will support European Digital Strategic Sovereignty & Semiconductor self-reliance
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NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications (Thursday May. 30, 2024)
Numem and IC’ALPS have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator.
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SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs (Monday May. 27, 2024)
RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
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Esperanto Technologies and Rapidus Partner to Enable More Energy-Efficient Designs for the Coming "Post GPU Era" (Wednesday May. 15, 2024)
Esperanto Technologies today announced the signing of a Memorandum of Cooperation with Rapidus, a new Japanese company that is a burgeoning leader in advanced 2nm semiconductor manufacturing with a strong focus on enabling faster time-to-market (TTM).
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Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip (Monday May. 06, 2024)
Mindgrove Technologies has launched India’s first commercial high-performance SoC (system on chip) named Secure IoT. The RISC-V-based chip will allow Indian Original Equipment Manufacturers (OEMs) to use an Indian SoC in their products and help reduce the cost of their feature-rich devices, without compromising on high-end features.
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Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs (Monday Apr. 29, 2024)
Rambus today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications.
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SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product (Thursday Mar. 28, 2024)
SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea.
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Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core (Tuesday Mar. 26, 2024)
RISC-V MCUs Offer Developers a New Low-Power, High-Performance Option along with Full Toolchain Support
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CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy (Monday Mar. 25, 2024)
This year marks a significant milestone for CoreHW, as it introduces advanced Real-Time Location System (RTLS) technology to the market.
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Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects (Monday Mar. 25, 2024)
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry’s first 5nm 800 Gbps transmit-only PAM4 optical DSP.
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Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon (Thursday Mar. 07, 2024)
Marvell is extending its collaboration with TSMC to develop the industry’s first technology platform to produce 2nm semiconductors optimized for accelerated infrastructure.
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Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm (Wednesday Mar. 06, 2024)
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Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Monday Feb. 26, 2024)
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.
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Qualinx partners with EU Space Agency to develop a GNSS receiver for a service to detect spoofing and boost resilience (Thursday Jan. 25, 2024)
Qualinx is partnering with the European Union Agency for the Space Programme (EUSPA) under the Fundamental Elements EU R&D funding mechanism to develop a consumer-grade, low-power GNSS receiver for the agency’s GNSS authentication service.
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POLYN Announces Agreement with SkyWater Technology to Produce its First Commercial Voice Processing Chip (Wednesday Jan. 17, 2024)
POLYN Technology has finalized an agreement with SkyWater Technology (NASDAQ: SKYT), to fabricate POLYN’s first commercial chip for voice processing, with the tapeout planned by the end of the year.
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Innatera shows RISC-V neuromorphic edge AI microcontroller (Wednesday Jan. 17, 2024)
Dutch chip startup Innatera has shown its neuromorphic microcontroller for edge AI sensor applications based on the RISC-V open instruction set architecture.
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Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio (Wednesday Jan. 10, 2024)
Building on the legacy of Atmosic’s innovative ATM3 and ATM33/e SoCs which support Bluetooth LE, the ATM34/e series adds support for IEEE 802.15.4 based protocols including Thread and Matter, as well as enhanced Bluetooth LE support for the latest 5.4 standard revision.
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Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD (Thursday Dec. 28, 2023)
Rambus today announced the availability of its state-of-the-art Gen4 DDR5 Registering Clock Driver (RCD) which began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023.
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BSC presents Sargantana, the new generation of the first open-source chips designed in Spain (Friday Dec. 15, 2023)
The Barcelona Supercomputing Center - Centro Nacional de Supercomputación (BSC-CNS) presented on Wednesday the new Sargantana chip, the third generation of open source processors designed entirely at the BSC.
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Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition (Thursday Nov. 30, 2023)
Renesas Electronics announced today that it has designed and tested a 32-bit CPU core based on the open-standard RISC-V instruction set architecture (ISA).
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SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology (Thursday Nov. 09, 2023)
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has released its Golion wireless headset reference design leveraging SPARK ultra-wideband (UWB) audio technology to deliver an unparalleled audio experience.
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Renesas Unveils Processor Roadmap for Next-Gen Automotive SoCs and MCUs (Wednesday Nov. 08, 2023)
Renesas Electronics today laid out plans for its next-generation system on chips (SoCs) and microcontrollers (MCUs) targeting all major applications across the automotive digital domain.
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Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor (Tuesday Oct. 31, 2023)
Renesas Electronics today introduced the world’s most powerful microcontrollers (MCUs), delivering breakthrough performance of over 3000 CoreMark points, and fully deterministic, low latency, real-time operation that satisfies customers’ most demanding application needs.