Home | Foundries | Silicon IP | Design Center | Latest News |

Foundries News

• TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer (Tuesday Mar. 03, 2020)
  With an area of approximately 1,700mm2, this next generation CoWoS interposer technology significantly boosts computing power for advanced HPC systems by supporting more SoCs as well as being ready to support TSMC’s next-generation five-nanometer (N5) process technology.
  
  
• GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications (Thursday Feb. 27, 2020)
  GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020.
  
  
• GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers (Monday Feb. 24, 2020)
  GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and GlobalWafers Co., Ltd. (GWC), one of the top three silicon wafer manufacturers in the world, today announced they have signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300mm silicon-on-insulator (SOI) wafers.
  
  
• STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products (Thursday Feb. 20, 2020)
  STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.
  
  
• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Wednesday Feb. 05, 2020)
  UMC today announced that the company has certified its 14nm process on the Calibre™ Eco Fill tape-out flow utility from Mentor, a Siemens business.
  
  
• Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training (Thursday Dec. 12, 2019)
  Designed to accelerate deep learning deployment, the accelerator’s core Deep Thinking Unit (DTU) is based on GF’s 12LP™ FinFET platform with 2.5D packaging to deliver fast, power-efficient data processing for cloud-based AI training platforms.
  
  
• UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle (Monday Dec. 02, 2019)
  United Microelectronics today announced the technology readiness of its 22nm process technology following first-pass silicon success using a USB 2.0 test vehicle.
  
  
• MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology (Friday Nov. 08, 2019)
  MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC.
  
  
• USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US (Tuesday Oct. 22, 2019)
  Partnership through USC Information Sciences Institute's MOSIS Service will offer multi-project-wafer runs for microelectronics by combining MOSIS Service integrated circuits manufacturing services with Samsung's foundry device fabrication technology
  
  
• X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform (Thursday Oct. 17, 2019)
  X-FAB Silicon Foundries SE today announced the availability of SONOS-based Flash and embedded EEPROM on its widely implemented XT018 BCD-on-SOI platform.
  
  
• Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich (Thursday Oct. 10, 2019)
  To address the growing demand in the autonomous and electric vehicle market, Samsung offers various foundry solutions based on 28nm FDS and 14nm process
  
  
• GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems (Thursday Oct. 10, 2019)
  GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it is working with Arm® to offer secure system-on-chip (SoC) solutions on GF’s 22FDX® platform, based on FD-SOI, for cellular IoT applications.
  
  
• TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume (Monday Oct. 07, 2019)
  TSMC (TWSE: 2330, NYSE: TSM) today announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume.
  
  
• GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications (Friday Sep. 27, 2019)
  GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, announced today at its annual Global Technology Conference (GTC) that since its launch in 2017, more than 20 clients representing more than $1 billion in design win revenue are now working with GF’s enhanced 45RFSOI solution for 5G/mmWave mobile and wireless infrastructure applications.
  
  
• Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing (Thursday Sep. 26, 2019)
  Arm and TSMC, the High-Performance Computing (HPC) industry leaders, today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm® cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging solution.
  
  
• UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor (Wednesday Sep. 25, 2019)
  UMC today announced that the company has satisfied all closing conditions, including final approval from all relevant government agencies, for the full acquisition of Mie Fujitsu Semiconductor Limited
  
  
• GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications (Tuesday Sep. 24, 2019)
  Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI requirements, compelling economics and industry-leading physical IP from Arm
  
  
• TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints (Tuesday Aug. 27, 2019)
  TSMC is in the process of reviewing the complaints filed by GlobalFoundries on August 26, but is confident that GlobalFoundries’ allegations are baseless.
  
  
• GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany (Monday Aug. 26, 2019)
  GLOBALFOUNDRIES (GF), the world’s leading specialty foundry based in the United States, today filed multiple lawsuits in the U.S. and Germany alleging that semiconductor manufacturing technologies used by Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) infringe 16 GF patents.
  
  
• Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement (Monday Aug. 19, 2019)
  Toppan Photomasks and GLOBALFOUNDRIES (GF) today announced that they have entered into a multi-year supply agreement in which Toppan will provide GF with photomasks and related services currently supported by GF’s Burlington, Vermont U.S. photomask manufacturing operation.
  
  
• GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications (Wednesday Aug. 07, 2019)
  GLOBALFOUNDRIES today announced that it has taped-out an Arm®-based 3D high-density test chip that will enable a new level of system performance and power efficiency for computing applications such as AI/ML and high-end consumer mobile and wireless solutions.
  
  
• Ambiq Micro Achieves World-Leading Power Consumption Performance with TSMC 40ULP Technology (Tuesday Jul. 02, 2019)
  Ambiq Micro and TSMC today announced that Ambiq’s Apollo3 Blue wireless SoC, built on TSMC’s 40 nanometer ultra-low power (40ULP) process, has achieved world-leading power consumption performance.
  
  
• GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center (Friday Jun. 07, 2019)
  GLOBALFOUNDRIES (GF) and Soitec today announced that they have signed multiple long-term supply agreements for 300mm silicon-on-insulator (SOI) wafers to secure the high-volume supply to meet the growing demand from GF customers for its differentiated radio-frequency-silicon-on-insulator (RF-SOI), fully-depleted-silicon-on-insulator (FD-SOI) and silicon photonics technology platforms.
  
  
• Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform (Wednesday May. 15, 2019)
  
  
  
• TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement (Friday Apr. 26, 2019)
  TSMC today announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence, Microsoft Azure, and Synopsys.
  
  
• ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility (Monday Apr. 22, 2019)
  ON Semiconductor Corporation (Nasdaq: ON) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York.
  
  
• TSMC Unveils 6-nanometer Process (Tuesday Apr. 16, 2019)
  TSMC (TWSE: 2330, NYSE: TSM) today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs.
  
  
• Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits (Tuesday Apr. 16, 2019)
  Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and now is ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market.
  
  
• TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology (Wednesday Apr. 03, 2019)
  TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets.
  
  
• MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts (Wednesday Mar. 06, 2019)
  MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands