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• SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology (Friday Jul. 29, 2016)
  SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.
  
  
• AppliedMicro Adopting TSMC 7nm FinFET Process Technology (Monday Jul. 11, 2016)
  Applied Micro Circuits today announced that it has adopted 7nm process technology from TSMC, the world’s leading foundry, to enable AppliedMicro’s innovative silicon products for cloud computing and networking applications.
  
  
• SMIC Commences Successful Mass Production of Qualcomm Snapdragon 425 Processor in Beijing (Wednesday Jun. 22, 2016)
  SMIC announces that the Snapdragon™ 425 processor and MDM9x07 has passed customer qualification and begun mass production in Beijing, after the successful technology transfer from SMIC's Shanghai 12-inch fab to SMIC's majority owned joint venture fab in Beijing.
  
  
• Marvell Releases New ARMADA Hyperscale Virtual SoC Families Featuring the ARM Cortex-A72 CPU with Advanced Networking and I/O Support (Tuesday May. 31, 2016)
  Marvell today announced the availability of production samples of the industry's first ARM® Cortex®-A72 based system-on-chip (SoC) families built on Marvell's ground-breaking MoChi™ architecture, the Marvell® ARMADA® 7000 and 8000.
  
  
• GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing (Tuesday May. 31, 2016)
  GLOBALFOUNDRIES today announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the company plans to expand its global manufacturing footprint by establishing a 300mm fab in China.
  
  
• GLOBALFOUNDRIES Releases Performance-Enhanced 130nm SiGe RF Technology to Advance Next Generation Wireless Network Communications (Monday May. 23, 2016)
  GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio. The technology is optimized for customers who need improved performance solutions for automotive radar, satellite communications, 5G millimeter-wave base stations and other wireless and wireline communication network applications.
  
  
• MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes (Tuesday May. 10, 2016)
  MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it has expanded its line of cost effective 0.18 micron multiple-time programmable intellectual property (MTP-IP) devices.
  
  
• Hua Hong Semiconductor's 90nm eFlash Process Platform Successfully Achieved Mass Production (Wednesday Apr. 06, 2016)
  Hua Hong Semiconductor, a global leading pure-play 200mm foundry, today announced the successful mass production of its 90nm embedded Flash (eFlash) process platform for fabrication of highly competitive chips featuring small die size, low power and high performance
  
  
• TSMC and Nanjing Sign 12-inch Fab Investment Agreement (Monday Mar. 28, 2016)
  TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement. This agreement affirms that TSMC will make an investment in Nanjing valued at US$3 billion to establish TSMC (Nanjing) Co. Ltd., a wholly-owned subsidiary managing a 12-inch wafer fab and a design service center.
  
  
• ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute (Tuesday Mar. 15, 2016)
  ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. The new agreement expands the companies’ long-standing partnership and advances leading-edge process technologies beyond mobile and into next-generation networks and data centers.
  
  
• GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software (Tuesday Mar. 15, 2016)
  GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.
  
  
• GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices (Tuesday Mar. 15, 2016)
  GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.
  
  
• SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore (Tuesday Feb. 16, 2016)
  SMIC and Leadcore, one of the core members of Datang Telecom Technology and Industry Group, jointly announce that SMIC's 28nm HKMG (High-K Metal Gate) process is ready with customer's NTO (New Tape Out) success
  
  
• Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology (Thursday Jan. 14, 2016)
  Samsung Electronics Co., Ltd. today announced that it has begun mass production of advanced logic chips utilizing its 14nm LPP (Low-Power Plus) process, the 2nd generation of the company’s 14nm FinFET process technology.
  
  
• TowerJazz Announces Availability of its Next-Generation Power Management Platform Enabling up to 30% Efficiency Boost and Form Factor Reduction (Wednesday Nov. 18, 2015)
  TowerJazz today announced a new 0.18um power management process with an industry best-in-class on-resistance (Rdson) of 9 mohm-mm2 for a 30V device. Low on-resistance helps power ICs achieve higher efficiency, lower power consumption, lower temperature rise and smaller form factor.
  
  
• UMC's Automotive Semiconductor Revenue Doubles YoY on Strong Customer Adoption (Tuesday Nov. 17, 2015)
  UMC today announced that revenue from its manufacture of semiconductors used in automotive applications has doubled (YoY) from 2014 to 2015. Full-year 2015 revenue for automotive ICs at UMC is expected to be hundreds of millions of US dollars.
  
  
• GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process Technology (Wednesday Nov. 11, 2015)
  GLOBALFOUNDRIES today announced the availability of FX-14, an application-specific integrated circuit (ASIC) offering built on the company’s next-generation 14nm FinFET process technology.
  
  
• GLOBALFOUNDRIES Achieves 14nm FinFET Technology Success for Next-Generation AMD Products (Monday Nov. 09, 2015)
  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GLOBALFOUNDRIES’ most advanced 14nm FinFET process technology.
  
  
• Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform (Wednesday Oct. 07, 2015)
  CEA-Leti today announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX™ technology platform.
  
  
• SMIC Receives 'Hi-Tech Enterprise Achievement Award' for the Second Time (Thursday Sep. 24, 2015)
  SMIC has been selected again by Hong Kong Yazhou Zhoukan Limited in the fifth Mainland Enterprises Listed in Hong Kong Ranking Award and awarded the Hi-Tech Enterprise Achievement Award for its outstanding business operations and overall performance.
  
  
• UMC Enters High Volume Touch IC Production using Foundry Industry's First 0.11um eFlash Process (Tuesday Sep. 22, 2015)
  United Microelectronics Corporation today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.
  
  
• GLOBALFOUNDRIES and Catena Partner to Provide Next-Generation RF Connectivity Solutions for Growing Wireless Markets (Friday Sep. 04, 2015)
  
  
  
• QEOS and GLOBALFOUNDRIES to Offer Industry's First CMOS Platform for MillimeterWave Markets (Friday Sep. 04, 2015)
  QEOS, Inc., a world leading designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.
  
  
• TowerJazz and TPSCo Announce Breakthrough RF Technology for Next-Generation 4G LTE Enabled Smartphones and IoT Applications (Thursday Sep. 03, 2015)
  TowerJazz, the global specialty foundry leader and TowerJazz Panasonic Semiconductor Co. (TPSCo), the leading analog foundry in Japan, today announced breakthrough RF technology for next-generation 4G LTE smartphones and IoT devices.
  
  
• SMIC's 28nm Chips Power Mainstream Smartphones Marking a New Era for Advanced Chip Manufacturing in China (Monday Aug. 10, 2015)
  SMIC today announced its 28nm process technology that is used for manufacturing Qualcomm® Snapdragon™ 410 processors, has been successfully adopted into mainstream smartphones.
  
  
• UMC Enters Volume Production for TSV Process Used to Enable AMD's High-Performance Radeon R9 Fury X GPU (Monday Jul. 20, 2015)
  UMC today announced that it has entered volume production for the Through-Silicon-Via (TSV) technology used on the AMD Radeon™ R9 Fury X, the flagship GPU in the recently announced Radeon™ R 300 Series of graphics cards.
  
  
• GLOBALFOUNDRIES Launches Industry's First 22nm FD-SOI Technology Platform (Monday Jul. 13, 2015)
  The “22FDX™” platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, providing an optimal solution for the rapidly evolving mainstream mobile, Internet-of-Things (IoT), RF connectivity and networking markets.
  
  
• IBM Research Alliance Produces Industr's First 7nm Node Test Chips (Thursday Jul. 09, 2015)
  An alliance led by IBM Research today announced that it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything from smartphones to spacecraft.
  
  
• SMIC Receives "2014 Foundry Supplier of the Year" Award from Qualcomm (Thursday Jun. 25, 2015)
  SMIC today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.
  
  
• SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company (Tuesday Jun. 23, 2015)
  SMIC, Huawei; imec, and Qualcomm held a signing ceremony at the Great Hall of the People, to announce the formation of SMIC Advanced Technology Research & Development (Shanghai) Corporation, an equity joint venture company.