Foundries News

• Intel Foundry Services Forms Alliance to Enable Design in the Cloud (Thursday Jun. 30, 2022)
  Intel Foundry Services (IFS) today launched the next phase of its Accelerator ecosystem program. The IFS Cloud Alliance will enable secure design environments in the cloud, improving foundry customer design efficiency and accelerating time-to-market by harnessing the power of massive on-demand compute.
  
  
• Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture (Thursday Jun. 30, 2022)
  Samsung Electronics, the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.
  
  
• TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center (Monday Jun. 27, 2022)
  TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed construction of its clean room in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST). An opening event was held today.
  
  
• GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool (Thursday Jun. 23, 2022)
  GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced that its first tool has been moved into the company’s new facility on its Singapore campus.
  
  
• TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Friday Jun. 17, 2022)
  TSMC today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FINFLEX™ technology for the N3 and N3E processes making their debut.
  
  
• Fujikura collaborates with GlobalFoundries to accelerate large-scale commercialization of 5G mmWave Technologies (Friday May. 20, 2022)
  Fujikura, Ltd., a leading supplier to the telecom market is pleased to announce it is collaborating with GlobalFoundries (GF) in enabling the commercial availability of FutureAccess™, industry’s most integrated 28GHz 5G mmWave module, for both mobile as well as fixed wireless infrastructure markets.
  
  
• GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations (Friday May. 20, 2022)
  At its annual GF Technology Summit (GTS), GlobalFoundries (Nasdaq: GFS) (GF), today announced GF Connex, the industry’s most comprehensive and advanced portfolio of feature-rich radio frequency (RF) technology solutions for next generation wireless connectivity.
  
  
• GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation (Friday May. 20, 2022)
  At its annual GF Technology Summit (GTS), GlobalFoundries (Nasdaq: GFS) (GF) today announced the launch of GF Labs, a new program that extends the development horizon of innovative, differentiated semiconductor technology and broadens the company’s portfolio of feature-rich and enablement solutions.
  
  
• GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply (Thursday May. 19, 2022)
  GlobalFoundries Inc. (GF) (Nasdaq: GFS) and Motorola Solutions (NYSE: MSI) today announced a long-term agreement to safeguard the supply of innovative chip solutions for Motorola Solutions’ radios, which are widely used by public safety, critical infrastructure and enterprise organizations across the world.
  
  
• Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs (Monday May. 09, 2022)
  Releasing its second-generation 65nm BCD scalable power LDMOS expanding voltages to 24V operation and 20% lower Rdson; and adding deep trench isolation (DTI) to its 180nm BCD platform enabling up to 40% die size reduction for operation up to 125V
  
  
• U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems (Tuesday May. 03, 2022)
  GlobalFoundries Inc. (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced a $117 million agreement with the U.S. Department of Defense (DoD) to provide a strategic supply of U.S.-made semiconductors that are critical to national security systems.
  
  
• GlobalFoundries Announces Next Generation in Silicon Photonics Solutions and Collaborates with Industry Leaders to Advance a New Era of More in the Data Center (Monday Mar. 07, 2022)
  GlobalFoundries Inc (Nasdaq: GFS) (GF) today announced it is collaborating with industry leaders including Broadcom, Cisco Systems, Inc, Marvell and NVIDIA, along with breakthrough photonic leaders including Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu, to deliver innovative, unique, feature-rich solutions to solve some of the biggest challenges facing data centers today.
  
  
• UMC announces new 22nm wafer fab in Singapore (Thursday Feb. 24, 2022)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced that its Board of Directors has approved a plan to build a new advanced manufacturing facility next to its existing 300mm fab (Fab12i) in Singapore.
  
  
• Intel to Acquire Tower Semiconductor for $5.4 Billion (Tuesday Feb. 15, 2022)
  Intel Corporation (Nasdaq: INTC) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced a definitive agreement under which Intel will acquire Tower for $53 per share in cash, representing a total enterprise value of approximately $5.4 billion.
  
  
• Intel Foundry Services Launches Ecosystem Alliance to Accelerate Customer Innovation (Tuesday Feb. 08, 2022)
  ntel Foundry Services (IFS) today launched Accelerator, a comprehensive ecosystem alliance designed to help foundry customers smoothly bring their silicon products from idea to implementation.
  
  
• Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem (Tuesday Feb. 08, 2022)
  A collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritize investments in capabilities that accelerate foundry customers’ time to market – spanning intellectual property (IP), software tools, innovative chip architectures and advanced packaging technologies.
  
  
• Taiwan's Intellectual Property and Commercial Court Announced Its Ruling on UMC and Other Defendants with Respect to Micron Case (Thursday Jan. 27, 2022)
  Taiwan's Intellectual Property and Commercial Court today announced its ruling on UMC and other defendants with respect to the case of the violation of the Trade Secrets Act. UMC appreciates the fairness of the ruling and its basis in facts
  
  
• GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply (Monday Dec. 27, 2021)
  GlobalFoundries Inc. (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced that it hasagreed to amend its Wafer Supply Agreement (WSA) with AMD to increase the volume of chips GF will supply as well as extend the terms of the agreement to secure supply through 2025.
  
  
• TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers (Thursday Dec. 16, 2021)
  TSMC today presented its 2021 Excellent Performance Awards to show appreciation for global suppliers who helped the Company successfully expand its fabs, broaden its global footprint, and collaborated to do their part for manufacturing excellence and semiconductor industry development in the face of the continuous challenges presented by the COVID-19 pandemic.
  
  
• TSMC Introduces N4X Process (Thursday Dec. 16, 2021)
  TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family.
  
  
• BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply (Thursday Dec. 09, 2021)
  The BMW Group is exploring new ways of working with suppliers and, in the case of strategically important components, becoming more closely involved in the supplier network. To secure semiconductor supplies for the long term, the company has signed a direct supply assurance agreement with high-tech microchip developer INOVA Semiconductors and semiconductor manufacturer GlobalFoundries® (GF®).
  
  
• MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip (Monday Nov. 22, 2021)
  MediaTek and TSMC today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial intelligence (AI) engines, Motion Estimation and Motion Compensation (MEMC), Versatile Video Coding (VVC) decoding and picture-in-picture (PiP) technology.
  
  
• GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand (Thursday Nov. 18, 2021)
  GlobalFoundries and Ford Motor Company today announced a strategic collaboration to advance semiconductor manufacturing and technology development within the United States, aiming to boost chip supplies for Ford and the U.S. automotive industry.
  
  
• Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 (Thursday Nov. 18, 2021)
  With the theme of 'Performance Platform 2.0: Innovation, Intelligence, Integration', Samsung provides a comprehensive look at design enablement solutions
  
  
• Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications (Thursday Nov. 11, 2021)
  'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit
  
  
• TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder (Tuesday Nov. 09, 2021)
  TSMC and Sony Semiconductor Solutions (“SSS”) today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.
  
  
• TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum (Wednesday Oct. 27, 2021)
  The OIP Partner of the Year awards honor TSMC OIP ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Their collaborative efforts effectively promote innovation in the semiconductor industry.
  
  
• TSMC Expands Advanced Technology Leadership with N4P Process (Tuesday Oct. 26, 2021)
  TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4P process, a performance-focused enhancement of the 5-nanometer technology platform. N4P joins the industry’s most advanced and extensive portfolio of leading-edge technology processes.
  
  
• Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices (Thursday Oct. 07, 2021)
  Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled plans for continuous process technology migration to 3- and 2-nanometer (nm) based on the company’s Gate-All-Around (GAA) transistor structure at its 5th annual Samsung Foundry Forum (SFF) 2021.
  
  
• Marvell Extends Data Infrastructure Leadership with TSMC 3nm Platform (Wednesday Oct. 06, 2021)
  Marvell today announced it is extending its data infrastructure silicon leadership with a new advanced silicon platform based on TSMC's 3nm process technology, offering the best power, performance, and area in the industry.