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CEA-Leti Collaborates with Siemens to Launch Process Design Kit that Supports Multiple Technologies, Simplifies Creation of Optical Circuits	Jun. 17, 2021

CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%	Feb. 22, 2021

Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard	Apr. 02, 2020

CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020	Feb. 18, 2020

CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses & Analogue Spiking Neurons	Dec. 13, 2019

CEA-Leti & Stanford Target Edge-AI Apps with Breakthrough NVM Memory Cell	Feb. 20, 2019

CEA-LETI Develops Circuits for Neuromorphic Processors That Replace CMOS Transistor-Based Tcam Memory With Rram-Based Tcam Memory	Dec. 06, 2018

Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor	Sep. 04, 2018

Leti Launches Emulator Service to Boost Roi and Speed Time to Market For European Chipmakers	Sep. 01, 2017

Leti announces backside shield that protects microchip from physical attacks	Mar. 09, 2017

High-Performance Computing gets more energy-efficient data transfer	Mar. 02, 2017

LETI Develops 3D Network-on-Chip to Improve High-Performance Computing	Jul. 13, 2016

Leti Strains to Improve FDSOI	Dec. 21, 2015

Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform	Oct. 07, 2015

Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications	Jun. 09, 2015

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