≡ Menu Design And Reuse

Design And Reuse

CEA Latest News

Headline Sign Up for SoC News Alert	Publication


Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard	Apr. 02, 2020

CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020	Feb. 18, 2020

CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses & Analogue Spiking Neurons	Dec. 13, 2019

CEA-Leti & Stanford Target Edge-AI Apps with Breakthrough NVM Memory Cell	Feb. 20, 2019

CEA-LETI Develops Circuits for Neuromorphic Processors That Replace CMOS Transistor-Based Tcam Memory With Rram-Based Tcam Memory	Dec. 06, 2018

Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor	Sep. 04, 2018

Leti Launches Emulator Service to Boost Roi and Speed Time to Market For European Chipmakers	Sep. 01, 2017

Leti announces backside shield that protects microchip from physical attacks	Mar. 09, 2017

High-Performance Computing gets more energy-efficient data transfer	Mar. 02, 2017

LETI Develops 3D Network-on-Chip to Improve High-Performance Computing	Jul. 13, 2016

Leti Strains to Improve FDSOI	Dec. 21, 2015

Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform	Oct. 07, 2015

Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications	Jun. 09, 2015

Previous Headlines:

2021

Jan

2020

2019

2018

2017

2016

2015

2014

2013

2012

2011

2010

2009

2008

2007

2006

2005

2004

2003

2002

2001

2000

1999

© 2020 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.

Partner with us

Partner with us

List your Products

Suppliers, list your IPs for free.

List your Products

Design-Reuse.com