IO 1.8V LVDS Automotive Grade 1 GF (22nm)
MIPI I3C PHY - TSMC (12nm, 7nm, 5nm, and 22nm) - GF 12nm
GDDR6 Memory PHY - TSMC 7nm
10/100 Mbit Ethernet MAC
YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
The Ideal Crypto Coprocessor with Root of Trust to Support Customer Complete Full Chip Evaluation: PUFcc gained SESIP and PSA Certified™ Level 3 RoT Component Certification
Advanced Packaging and Chiplets Can Be for Everyone
Timing Optimization Technique Using Useful Skew in 5nm Technology Node
RISC-V Processor Design - Free YouTube Course by Maven Silicon
Redefining XPU Memory for AI Data Centers Through Custom HBM4 - Part 3
Evaluating AI/ML Processors - Why Batch Size Matters
© 2024 Design And Reuse
All Rights Reserved.
No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.
Suppliers, list your IPs for free.