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VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications |
Oct. 24, 2019 |
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VeriSilicon Launches VIP9000, New Generation of Neural Processor Unit IP |
Aug. 07, 2019 |
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Xiaomi picks up 6% stake in chip designer VeriSilicon |
Jul. 17, 2019 |
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VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices |
Jan. 08, 2019 |
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VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC) |
Jan. 08, 2019 |
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VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications |
Nov. 01, 2018 |
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Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt |
Feb. 27, 2018 |
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GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks |
Jul. 14, 2017 |
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VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market |
Jul. 13, 2017 |
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VeriSilicon Unveils Vivante 2 Teraflop "MESH" Architecture Compute IP Cores for Embedded Devices |
Jun. 28, 2017 |
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VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor |
Jun. 07, 2017 |
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VeriSilicon's Vivante VIP8000 Neural Network Processor IP Delivers Over 3 Tera MACs Per Second |
May. 03, 2017 |
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FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform (IPU2.0) |
Dec. 21, 2016 |
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VeriSilicon Supports the Connected Car by Joining Automotive Grade Linux |
May. 12, 2016 |
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VeriSilicon Completes Acquisition of Vivante |
Jan. 07, 2016 |
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VeriSilicon and NextG-Com Announce Joint Partnership for Developing Next Generation Cat-0/Cat-M Reference Platform |
Dec. 10, 2015 |
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Sequans Selects VeriSilicon ZSP Digital Signal Processor for LTE Cat0/Cat1 IoT and M2M Chipsets |
Oct. 21, 2015 |
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VeriSilicon to Acquire Vivante Corporation in All-Stock Transaction |
Oct. 13, 2015 |
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VeriSilicon Appoints Robert A. Brown as Chief Financial Officer |
Apr. 30, 2015 |
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VeriSilicon Introduces Hantro G2v2 Multi-format Decoder IP with VP9 Profile 2 to Support 10-bit Premium Internet Content |
Mar. 02, 2015 |
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China's VeriSilicon Files For IPO |
Oct. 23, 2014 |
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VeriSilicon Introduces Hantro H2 HEVC Encoder Semiconductor IP |
Jul. 15, 2014 |
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VeriSilicon Expands Its Hantro Video IP Portfolio With HEVC Main 10 Profile and AVS+ Decoder Capabilities |
Apr. 08, 2014 |
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VeriSilicon Introduces Hantro G2 Video Decoder IP with HEVC and VP9 Support |
Jul. 01, 2013 |
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VeriSilicon Introduces Hantro G2 Video Decoder IP with HEVC and VP9 Support |
Jun. 18, 2013 |
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Leadcore Adopts Hantro Video IP |
Apr. 16, 2013 |
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VeriSilicon touts shift from fab lite to design lite |
Sep. 05, 2012 |
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Nufront NS115 adopts Hantro Video IP |
Sep. 05, 2012 |
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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC |
Feb. 23, 2012 |
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VeriSilicon Licenses ZSP G3 Cores to Marvell |
Feb. 13, 2012 |
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VeriSilicon Licenses a Wide Range of ARM Technology for Advanced Consumer and Embedded Applications |
Nov. 28, 2011 |
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VeriSilicon Holdings Co., Ltd. Expands Power Architecture Eco-system and Technology throughout Asia |
Aug. 11, 2011 |
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Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products |
Feb. 14, 2011 |
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VeriSilicon Licenses Sorenson Spark Video Decoder for Inclusion in Libraries, Core Chipset for Mobile Devices |
May. 25, 2010 |
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VeriSilicon Announces Support for WebM on ZSP Digital Signal Processor Cores and SoC Platforms |
May. 19, 2010 |
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VeriSilicon Expands SoC Platform with On2 Technologies Finland's Silicon Proven Video Solutions |
May. 10, 2010 |
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VeriSilicon Joins Power Forward Initiative to Accelerate Advanced Low-Power Design |
May. 12, 2008 |
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Analysis: VeriSilicon's HD audio IP solution |
Jan. 30, 2008 |
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VeriSilicon Introduces VZ.AudioHD: A Complete, Licensable Audio Solution for Exploding High Definition Market |
Jan. 02, 2008 |
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VeriSilicon Holdings Co., Ltd. Secures $20 Million in Financing |
Nov. 06, 2007 |
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VeriSilicon Introduces VZ.VoiceHQ Appplication Platform to Accelerate Development of Next Generation VoIP Products |
Aug. 29, 2007 |
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VeriSilicon and DTS Announce Strategic Collaboration to Proliferate DTS HD Audio Technologies |
Jul. 18, 2007 |
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VeriSilicon Selects SRS WOW HD and SRS TruSurround HD for its ZSP (R) and VZ.Audio Platform |
Jul. 17, 2007 |
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VeriSilicon Announces Agreement with IBM to Dramatically Reduce Design Time for PowerPC Based Products |
May. 09, 2007 |
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VeriSilicon and ARM Extend Partnership to Further Address Advanced Consumer and Networking SoC Designs |
May. 09, 2007 |
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VeriSilicon Launches New Families of Advanced Audio / Video Application Platforms to Accelerate Portable Multimedia Designs |
Jan. 29, 2007 |
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VeriSilicon and Chips&Media Announce a Strategic Partnership to Provide Advanced Multimedia Solutions for Consumer Devices |
Jan. 23, 2007 |
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VeriSilicon Licenses ZSP(R) G2 Processor Family to Yamaha for Advanced Multimedia Applications |
Oct. 25, 2006 |
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Sequans Communications Selects VeriSilicon's ZSP540 Processor for its WiMAX Silicon Products |
Oct. 10, 2006 |
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VeriSilicon Announces ZView Developement Environment for its Industry Standard ZSP Processors |
Sep. 26, 2006 |
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SMIC and VeriSilicon Announced Release of a Standard Design Platform for SMIC's 0.13u Low Leakage Process |
Sep. 06, 2006 |
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VeriSilicon Shipping ZSP Based ASIC for SyChip's Voice Over WLAN Module |
Aug. 08, 2006 |
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VeriSilicon Launches GSM-AMR-WB (G.722.2) Wideband Codec on ZSP(R) for 3G Wireless and VoIP Applications |
Aug. 07, 2006 |
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VeriSilicon Announces Acquisition of ZSP Digital Signal Processor Unit from LSI |
Jul. 06, 2006 |
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VeriSilicon Receives US$ 14.8M in Series-C Financing Round From US Based Leading Venture Capital Firms |
Jul. 06, 2006 |
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VeriSilicon Tapes out Flip-Chip Design With Cadence Encounter |
Jan. 24, 2006 |
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VeriSilicon and SMIC Jointly Announce Standard Design Platform for SMIC's Advanced 0.13-micron CMOS Process Technology |
Oct. 31, 2005 |
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VeriSilicon Completes Series B Financing |
Aug. 15, 2005 |
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VeriSilicon Announced Release of Library Products for HeJian Technology 0.18 and 0.25 micron Process Technology |
Mar. 15, 2005 |
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VeriSilicon Provided Backend Design Service for COMMIT 3G TD-SCDMA Chip, Achieved |
Dec. 08, 2004 |
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VeriSilicon and Magma Team to Deliver "Magma-Ready" Libraries for China-Based Wafer Foundries |
Jul. 19, 2004 |
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