Dual-CORE HEVC/H.265 & AVC/H.264 combined codec for 8Kp60
Turnkey TWS Bluetooth Audio platform
56Gbps LR SerDes IP on TSMC 16nm
28G Multi-protocol SerDes PHY
CFX announces commercial availability of anti-fuse OTP technology on 90nm CIS process
Xiphera receives Business Finland's Young Innovative Company funding
Brite Launches High-Precision 16 bit SAR ADC
Stop-For-Top IP model to replace One-Stop-Shop by 2025... and support the creation of successful Chiplet business
Lossless Compression Efficiency of JPEG-LS, PNG, QOI and JPEG2000: A Comparative Study
Understanding Interface Analog-to-Digital Converters (ADCs) with DataStorm DAQ FPGA
The design of the NoC is key to the success of large, high-performance compute SoCs
TSMC FINFLEX - Ultimate Performance, Power Efficiency, Density and Flexibility
Introducing Open Access: SoC design for everyone
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