All Silicon Charge Pump for X-FAB 180nm
NVM MTP in Samsung (130nm)
Post-Quantum Security Subsystem (PQ-HW-SUB)
USB-C 3.2 SS/SSP PHY in Type-C in TSMC (N7, N6, N5, N3E)
BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
The Ideal Crypto Coprocessor with Root of Trust to Support Customer Complete Full Chip Evaluation: PUFcc gained SESIP and PSA Certified™ Level 3 RoT Component Certification
Advanced Packaging and Chiplets Can Be for Everyone
Timing Optimization Technique Using Useful Skew in 5nm Technology Node
Enabling Massive AI Clusters with the Industry's First Ultra Ethernet and UALink IP Solutions
Audio Transport in DisplayPort VIP
HDT Bluetooth: the Next Step in High Quality Audio Streaming
© 2024 Design And Reuse
All Rights Reserved.
No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.
Suppliers, list your IPs for free.