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Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement |
Jul. 20, 2017 |
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Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM |
Jul. 18, 2017 |
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Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs |
Jul. 11, 2017 |
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Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery |
Jun. 20, 2017 |
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Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node |
Jun. 20, 2017 |
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Cadence Announces VirtualBridge Adapter for Palladium Z1 Emulator to Accelerate Software Bring-Up Time by Up to Three Months |
May. 31, 2017 |
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New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board |
May. 31, 2017 |
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Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Technology |
May. 25, 2017 |
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Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technologies |
May. 25, 2017 |
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Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff |
May. 16, 2017 |
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Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics |
May. 16, 2017 |
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Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers |
May. 02, 2017 |
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Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets |
May. 01, 2017 |
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Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform |
Apr. 26, 2017 |
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Cadence Reports First Quarter 2017 Financial Results |
Apr. 25, 2017 |
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Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution |
Apr. 12, 2017 |
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Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes |
Apr. 05, 2017 |
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Cadence Voltus IC Power Integrity Solution Enables Juniper Networks to Achieve First-Pass Silicon Success for its Largest Networking SoC |
Apr. 05, 2017 |
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Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier |
Mar. 22, 2017 |
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Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology |
Mar. 15, 2017 |
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Cadence Achieves Certification for TSMC's 7nm Process Technology |
Mar. 14, 2017 |
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Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology |
Mar. 13, 2017 |
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Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market |
Mar. 02, 2017 |
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Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML |
Feb. 28, 2017 |
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Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator |
Feb. 27, 2017 |
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Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development |
Feb. 27, 2017 |
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Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs |
Feb. 23, 2017 |
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Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP |
Feb. 23, 2017 |
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First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP |
Feb. 21, 2017 |
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Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP |
Feb. 21, 2017 |
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Cadence发布创新Sigrity 2017快速实现PCB电源完整性签核 |
Feb. 07, 2017 |
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Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results |
Feb. 02, 2017 |
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Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform |
Feb. 01, 2017 |
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Cadence Announces Availability of Industry-First Bluetooth 5 Verification IP |
Jan. 09, 2017 |
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Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP |
Jan. 09, 2017 |
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Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor |
Jan. 09, 2017 |
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中关村芯园与Cadence达成平台合作协议 |
Jan. 05, 2017 |
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Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology |
Jan. 05, 2017 |
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Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs |
Jan. 04, 2017 |
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Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution |
Dec. 15, 2016 |
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Cadence与西安电子科技大学携手共建集成电路设计培训中心 |
Nov. 15, 2016 |
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Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface |
Nov. 14, 2016 |
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Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors |
Oct. 26, 2016 |
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Cadence Reports Third Quarter 2016 Financial Results |
Oct. 25, 2016 |
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Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung's 10nm Process Technology |
Oct. 24, 2016 |
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Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development |
Oct. 24, 2016 |
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Cadence Enables Customer Innovation with ARM-Optimized Solutions from Chips to Boards to Systems at ARM TechCon 2016 |
Oct. 19, 2016 |
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Cadence Delivers 10 New VIP Solutions to Accelerate Time to Market for Applications Based on Critical New Standards |
Oct. 10, 2016 |
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Cadence Recognized with Four TSMC Partner of the Year Awards |
Sep. 28, 2016 |
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Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle |
Sep. 27, 2016 |
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Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms |
Sep. 23, 2016 |
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Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology |
Sep. 22, 2016 |
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Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process |
Sep. 20, 2016 |
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Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU |
Sep. 20, 2016 |
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Cadence Tensilica HiFi DSP Offers First processor IP Approved for Dolby AC-4 Decoder |
Sep. 12, 2016 |
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Cadence Offers Industry's First Licensable MPEG-H Audio Decoder for Tensilica HiFi DSPs |
Sep. 12, 2016 |
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Irida Labs' NoiseSweeper and EnLight Software Now Available on Cadence Tensilica Imaging/Vision DSPs |
Aug. 23, 2016 |
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Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions |
Aug. 02, 2016 |
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Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications |
Jul. 27, 2016 |
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Cadence Reports Second Quarter 2016 Financial Results |
Jul. 26, 2016 |
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