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Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market |
May. 20, 2019 |
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New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets |
May. 15, 2019 |
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Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies |
May. 15, 2019 |
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Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology |
May. 15, 2019 |
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Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology |
May. 13, 2019 |
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Cadence Delivers Smart JasperGold Formal Verification Platform |
May. 07, 2019 |
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Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology |
Apr. 24, 2019 |
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Cadence Reports First Quarter 2019 Financial Results |
Apr. 23, 2019 |
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Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design |
Apr. 22, 2019 |
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Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology |
Apr. 17, 2019 |
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Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design |
Apr. 03, 2019 |
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Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments |
Apr. 01, 2019 |
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Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology |
Apr. 01, 2019 |
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Cadence Collaborates with Northrop Grumman on Chip Design |
Mar. 28, 2019 |
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Cadence Announces Industry's First Verification IP for USB4 |
Mar. 14, 2019 |
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Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution |
Mar. 04, 2019 |
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Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications |
Feb. 28, 2019 |
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New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications |
Feb. 26, 2019 |
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Cadence Drives Release of Alternative EVS Codec Implementation in 3GPP |
Feb. 25, 2019 |
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Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market |
Feb. 20, 2019 |
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Cadence Reports Fourth Quarter and Fiscal Year 2018 Financial Results |
Feb. 20, 2019 |
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Cadence and Green Hills Software Announce Strategic Partnership to Accelerate Embedded System Safety and Security |
Feb. 20, 2019 |
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Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES |
Feb. 15, 2019 |
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Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution |
Jan. 08, 2019 |
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Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC |
Jan. 08, 2019 |
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耐能与Cadence携手合作，将先进视觉应用带到新一代智能设备中 |
Dec. 20, 2018 |
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Cadence Timing Signoff Tools Enable MaxLinear to Deliver Industry's First 400Gbps PAM4 SoC on 16FF Process |
Dec. 10, 2018 |
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Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers |
Nov. 14, 2018 |
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Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing |
Oct. 31, 2018 |
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Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology |
Oct. 24, 2018 |
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Cadence Reports Third Quarter 2018 Financial Results |
Oct. 23, 2018 |
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Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP |
Oct. 22, 2018 |
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Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing |
Oct. 16, 2018 |
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Cadence Verification Suite Enabled on Arm-Based HPC Datacenters |
Oct. 16, 2018 |
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Cadence to Demonstrate System and Automotive Solutions at Arm TechCon 2018 |
Oct. 10, 2018 |
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Cadence Recognized with Four 2018 TSMC Partner of the Year Awards |
Oct. 10, 2018 |
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Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment |
Oct. 03, 2018 |
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Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies |
Oct. 02, 2018 |
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Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation |
Oct. 01, 2018 |
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Cadence Launches New Tensilica DNA 100 Processor IP Delivering Industry-Leading Performance and Power Efficiency for On-Device AI Applications |
Sep. 19, 2018 |
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Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution |
Sep. 18, 2018 |
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Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX Certification |
Aug. 31, 2018 |
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Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC to Accelerate SoC Design |
Aug. 14, 2018 |
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Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation |
Jul. 24, 2018 |
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Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes |
Jul. 23, 2018 |
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ArcSoft and Cadence Partner to Develop AI and Vision Applications |
Jul. 13, 2018 |
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Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification |
Jul. 13, 2018 |
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Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements |
Jul. 09, 2018 |
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Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology |
Jul. 03, 2018 |
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Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC |
Jun. 28, 2018 |
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Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0 |
Jun. 27, 2018 |
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Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors |
Jun. 25, 2018 |
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Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud |
Jun. 25, 2018 |
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Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform |
Jun. 25, 2018 |
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Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs |
Jun. 01, 2018 |
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Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology |
May. 23, 2018 |
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Cadence Shortens Automotive Verification Closure with New Verification IP for UFS 3.0, CoaxPress, and HyperRAM |
May. 03, 2018 |
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Cadence Innovus Implementation System Speeds Development of New Realtek DTV SoC Solution |
May. 03, 2018 |
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Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC |
May. 01, 2018 |
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Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation |
May. 01, 2018 |
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Cadence Supports New TSMC WoW Advanced Packaging Technology |
May. 01, 2018 |
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Cadence Reports First Quarter 2018 Financial Results |
Apr. 24, 2018 |
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Lip-Bu Tan on AI, China & Moore |
Apr. 12, 2018 |
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Cadence: Last Holdout for Vision + AI Programmability |
Apr. 12, 2018 |
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Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP |
Apr. 11, 2018 |
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Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout |
Apr. 11, 2018 |
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Imec and Cadence Tape Out Industry's First 3nm Test Chip |
Feb. 28, 2018 |
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GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor |
Feb. 26, 2018 |
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Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP |
Feb. 20, 2018 |
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Cadence Reports Fourth Quarter and Fiscal Year 2017 Financial Results |
Feb. 01, 2018 |
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Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs |
Jan. 08, 2018 |
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Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP |
Nov. 29, 2017 |
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Cadence Appoints Anirudh Devgan as President |
Nov. 20, 2017 |
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HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor |
Nov. 06, 2017 |
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Cadence to Expand High-Speed Communications IP Portfolio with Acquisition of nusemi inc |
Nov. 02, 2017 |
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Cadence Joules RTL Power Solution Enables Socionext to Accelerate Low-Power HEVC 4K/60p Video Codec Chip Development |
Nov. 02, 2017 |
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Cadence Reports Third Quarter 2017 Financial Results |
Oct. 26, 2017 |
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Cadence and Arm Deliver First SoC Verification Solution for Low-Power, High-Performance Arm-Based Servers |
Oct. 24, 2017 |
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Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology |
Oct. 13, 2017 |
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Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform |
Oct. 12, 2017 |
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Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard |
Oct. 11, 2017 |
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Teradyne Standardizes on Cadence Xcelium Parallel Logic Simulator |
Oct. 10, 2017 |
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Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development |
Oct. 02, 2017 |
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Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies |
Sep. 25, 2017 |
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Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology |
Sep. 19, 2017 |
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Cadence Recognized with Three TSMC Partner of the Year Awards |
Sep. 18, 2017 |
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Cadence Introduces the Conformal Smart Logic Equivalence Checker |
Sep. 14, 2017 |
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Cadence Collaborates with TSMC to Advance 7nm FinFET Plus Design Innovation |
Sep. 11, 2017 |
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Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process |
Sep. 11, 2017 |
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Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform |
Sep. 07, 2017 |
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Cadence Announces Legato Memory Solution, Industry's First Integrated Memory Design and Verification Solution |
Sep. 07, 2017 |
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Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU |
Aug. 07, 2017 |
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Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications |
Jul. 25, 2017 |
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Cadence Reports Second Quarter 2017 Financial Results |
Jul. 25, 2017 |
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Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement |
Jul. 20, 2017 |
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Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM |
Jul. 18, 2017 |
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Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs |
Jul. 11, 2017 |
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Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery |
Jun. 20, 2017 |
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Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node |
Jun. 20, 2017 |
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Cadence Announces VirtualBridge Adapter for Palladium Z1 Emulator to Accelerate Software Bring-Up Time by Up to Three Months |
May. 31, 2017 |
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New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board |
May. 31, 2017 |
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Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Technology |
May. 25, 2017 |
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Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technologies |
May. 25, 2017 |
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Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff |
May. 16, 2017 |
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Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics |
May. 16, 2017 |
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Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers |
May. 02, 2017 |
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Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets |
May. 01, 2017 |
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Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform |
Apr. 26, 2017 |
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Cadence Reports First Quarter 2017 Financial Results |
Apr. 25, 2017 |
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Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution |
Apr. 12, 2017 |
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Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes |
Apr. 05, 2017 |
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Cadence Voltus IC Power Integrity Solution Enables Juniper Networks to Achieve First-Pass Silicon Success for its Largest Networking SoC |
Apr. 05, 2017 |
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Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier |
Mar. 22, 2017 |
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Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology |
Mar. 15, 2017 |
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Cadence Achieves Certification for TSMC's 7nm Process Technology |
Mar. 14, 2017 |
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Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology |
Mar. 13, 2017 |
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Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market |
Mar. 02, 2017 |
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Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML |
Feb. 28, 2017 |
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Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator |
Feb. 27, 2017 |
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Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development |
Feb. 27, 2017 |
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Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs |
Feb. 23, 2017 |
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Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP |
Feb. 23, 2017 |
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First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP |
Feb. 21, 2017 |
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Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP |
Feb. 21, 2017 |
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Cadence发布创新Sigrity 2017快速实现PCB电源完整性签核 |
Feb. 07, 2017 |
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Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results |
Feb. 02, 2017 |
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Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform |
Feb. 01, 2017 |
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Cadence Announces Availability of Industry-First Bluetooth 5 Verification IP |
Jan. 09, 2017 |
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Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP |
Jan. 09, 2017 |
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Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor |
Jan. 09, 2017 |
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中关村芯园与Cadence达成平台合作协议 |
Jan. 05, 2017 |
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Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology |
Jan. 05, 2017 |
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Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs |
Jan. 04, 2017 |
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Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution |
Dec. 15, 2016 |
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Cadence与西安电子科技大学携手共建集成电路设计培训中心 |
Nov. 15, 2016 |
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Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface |
Nov. 14, 2016 |
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Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors |
Oct. 26, 2016 |
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Cadence Reports Third Quarter 2016 Financial Results |
Oct. 25, 2016 |
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Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung's 10nm Process Technology |
Oct. 24, 2016 |
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Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development |
Oct. 24, 2016 |
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Cadence Enables Customer Innovation with ARM-Optimized Solutions from Chips to Boards to Systems at ARM TechCon 2016 |
Oct. 19, 2016 |
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Cadence Delivers 10 New VIP Solutions to Accelerate Time to Market for Applications Based on Critical New Standards |
Oct. 10, 2016 |
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Cadence Recognized with Four TSMC Partner of the Year Awards |
Sep. 28, 2016 |
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Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle |
Sep. 27, 2016 |
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Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms |
Sep. 23, 2016 |
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Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology |
Sep. 22, 2016 |
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Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process |
Sep. 20, 2016 |
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Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU |
Sep. 20, 2016 |
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Cadence Tensilica HiFi DSP Offers First processor IP Approved for Dolby AC-4 Decoder |
Sep. 12, 2016 |
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Cadence Offers Industry's First Licensable MPEG-H Audio Decoder for Tensilica HiFi DSPs |
Sep. 12, 2016 |
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