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IP / SOC Products News

• Inside Secure announces new high-performance 400G MAC layer security (MACsec) IP for Datacenters and the Cloud (Monday Jul. 24, 2017)
  Inside Secure (Euronext Paris: INSD), at the heart of security solutions for mobile and connected devices, has released its newest MACsec IP cores that successfully tackle two major challenges in securing high-speed networking: power consumption and flexible line rate throughput in an optimal die area. Leading chipmakers today are already realizing the benefits of Inside Secure’s 400G MACsec IP in their devices (400 Gigabit/sec).
  
  
• Flex Logix's EFLX Embedded FPGA Accelerates Processor Performance By 40-100X (Friday Jul. 21, 2017)
  Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA IP and software, today released an application note highlighting the power of its EFLX® embedded FPGA as a reconfigurable accelerator.
  
  
• Microsemi and Tamba Collaborate on New PolarFire Devices to Deliver Industry-Leading Low Power FPGA-Based 10G Ethernet Solution (Tuesday Jul. 18, 2017)
  Microsemi and Tamba Networks today announced their collaboration to incorporate Tamba Networks' Ethernet media access controller (MAC) in Microsemi's new cost-optimized, low power, mid-range PolarFire™ field programmable gate array (FPGA) to offer industry-leading low power FPGA-based 10G Ethernet solution.
  
  
• Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70% (Monday Jul. 17, 2017)
  Dolphin Integration provides its customers with a complete set of Foundation IPs in TSMC 55 nm uLP and uLP eFlash processes; these are specifically designed to help reduce the SoC power consumption during sleep and active modes.
  
  
• GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks (Friday Jul. 14, 2017)
  GLOBALFOUNDRIES and VeriSilicon today announced a collaboration to deliver the industry’s first single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks.
  
  
• Chuang Fei Xin Anti-Fuse One Time Programming Solution Qualified In Silterra High Voltage Technology (Friday Jul. 14, 2017)
  SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Zhuhai Chuangfeixin Technology Co., Ltd. ("CFX"), an memory IP design house, jointly announced the production release of Anti-Fuse One-Time-Programming (OTP) IP in SilTerra’s 160nm and 110nm High Voltage technology.
  
  
• Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller (Thursday Jul. 13, 2017)
  Faraday Technology today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process.
  
  
• Arasan Announces IP solutions for the Next Generation of Mobile Storage - UFS 3.0 (Wednesday Jul. 12, 2017)
  Arasan extends its long history of support for JEDEC and MIPI standards with the availability of UFS 3.0 controller IP, supporting a maximum throughput of 11.6 Gbps with M-PHY HS-Gear 4 2-lane operation, providing the highest data transfer rate with low power consumption for advanced mobile applications such as smartphone and tablets.
  
  
• The fastest C-Compiler for i251 from Dolphin Integration is now available with our free discovery license! (Monday Jul. 10, 2017)
  Dolphin Integration blows a fresh air in the i251 software ecosystem with SmartVision™ IDE, now imbedding a C-compiler using the leading-edge technologies from LLVM / Clang.
  
  
• IP-Maker NVMe IP, ready for persistent memories (Monday Jul. 10, 2017)
  IP-Maker, the leading storage IP startup, will exhibit at Flash Memory Summit in Santa Clara, CA, on August 8 to 10. The next generation of non-volatile memories comes with an access time in the microsecond range.
  
  
• eVaderis Joins FDXcelerator Program to Deliver Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform (Monday Jul. 03, 2017)
  eVaderis today announced that it has joined GLOBALFOUNDRIES' FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF's 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.
  
  
• VeriSilicon Unveils Vivante 2 Teraflop "MESH" Architecture Compute IP Cores for Embedded Devices (Wednesday Jun. 28, 2017)
  VeriSilicon today announces Vivante CC8000, a dedicated IP series based on highly parallel, scalable MESH (Memory Efficient Shader) processor architecture with the highest GFLOPs per square millimeter silicon for embedded applications like scientific computing, cryptography, advanced signal processing, machine vision, natural language processing and more.
  
  
• ICE-P3 EPU Integrates Temperature-Compensated Voltage And Frequency Control For Maximum Energy Savings (Monday Jun. 26, 2017)
  Sonics today introduced ICE-P3™, the IP industry's first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches.
  
  
• Synopsys Embedded Vision Processor IP Quadruples Neural Network Performance for Machine Learning Applications (Monday Jun. 26, 2017)
  Synopsys today announced that it has enhanced the convolutional neural network (CNN) engine in its DesignWare® EV6x Vision Processors to address the increasing video resolution and frame rate requirements of high-performance embedded vision applications.
  
  
• Arastu Systems announces LPDDR3/4 Single Controller for optimal performance (Thursday Jun. 22, 2017)
  High-end computing applications requires Higher Performance keeping the Power and Latency intact. Arastu Systems, a product engineering services company, today announced the immediate availability of LPDDR3/4 DRAM Memory Controller Core. The IP is highly configurable and delivers performance up to 4266 MT/s.
  
  
• Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process (Tuesday Jun. 20, 2017)
  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology.
  
  
• Menta Offers Validation Board for Embedded FPGA Supporting TSMC's 28nm HPC+ Process (Tuesday Jun. 20, 2017)
  Menta today announced a validation board supporting TSMC’s 28-nanometer High Performance Compact Plus (28HPC+) process. The board includes a test chip with an embedded FPGA (eFPGA) IP core from Menta, and is supplied with all of the hardware and software required for validation of the complete eFPGA design flow from RTL to bitstream, and through final hardware test and measurement.
  
  
• UltraSoC announces industry's first processor trace support for RISC-V (Monday Jun. 19, 2017)
  UltraSoC, the leading developer of embedded analytics technology, today announced that it has developed processor trace support for products based on the open source RISC-V architecture.
  
  
• Sankalp Semiconductor Announces Availability of 16nm IO Libraries (Monday Jun. 19, 2017)
  Sankalp Semiconductor a design service company offering comprehensive mixed signal and SoC solutions today announced the availability of its 16nm IO library.
  
  
• GUC Successfully Rolls out HBM2 Total Solution (Monday Jun. 19, 2017)
  Global Unichip has successful taped out a 16nm, second-generation High Bandwidth Memory (HBM) PHY and controller with verified interposer design and CoWoS Package. The innovative ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications.
  
  
• Barco Silex extends crypto offering with Chacha20/Poly1305 authenticated encryption (Friday Jun. 16, 2017)
  Barco Silex, leading provider of IP cores for embedded hardware security, adds an RFC7539-compliant crypto engine to its offering to provide its customers with future-proof authenticated encryption between networked applications, for example in the IoT.
  
  
• The new release of SoC-e IEEE 1588 IP Core supports 10 Gigabit Ethernet (Friday Jun. 16, 2017)
  The spectacular increment of IEEE 1588 solution in different sectors is demanding supporting hardware time-stamping in very different media types. SoC-e PreciseTimeBasic IP core (PTB) core is a media-independent hardware time-stamping solution implemented on the FPGA. It does not require 1588-aware Ethernet Phyters and supports SFP modules (fiber, copper, etc.).
  
  
• Noesis Technologies releases its XTS mode AES processor IP Core (Thursday Jun. 15, 2017)
  Noesis Technologies has announced today the immediate availability of its ntAES_XTS IP Core, a fully compliant core with AES-XTS algorithm standardized at NIST SP800-38E and IEEE 1619-2007 recommendations targeting disk encryption applications at sector (data unit) addressable level.
  
  
• Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for IoT SoC Market (Thursday Jun. 15, 2017)
  Andes Technology and M31 Technology today jointly announced that AndesCoreTM N705 CPU had adopted M31’s low-power silicon IPs and Power Management Kit (PMK) to provide a very low power consumption CPU solution for SoC design in IoT and related low power applications.
  
  
• Imagination launches the MIPS I6500-F, CPU IP designed for safety-critical systems in an autonomous age (Wednesday Jun. 14, 2017)
  Imagination Technologies announces a highly-scalable 64-bit MIPS multiprocessing solution that has been stringently assessed and validated to meet functional safety (FuSa) compliance for ISO 26262 and IEC 61508 standards.
  
  
• Arasan Announces Advanced Process Nodes for High Performance SD Card UHS-II Physical Layer Interface (Wednesday Jun. 14, 2017)
  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, announces availability of its SD Card UHS-II analog physical interface IP Core in advanced process nodes.
  
  
• ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions on FPGA COTS Boards (Wednesday Jun. 14, 2017)
  Orthogone Technologies, a provider of industry-leading semiconductor IP and electronic product design services, today announced their strategic alliance with ReFLEX CES, a leading provider of complex, high-density FPGA-based boards.
  
  
• CAST Drives Automotive IP Forward with New AVB/TSN Ethernet and SAE J2716 Sensor Bus Cores plus CAN-FD Time-Stamping (Tuesday Jun. 13, 2017)
  Semiconductor intellectual property provider CAST, Inc. today announced three significant improvements to its automotive IP family. New IEEE 802.1AS AVB/TSN and SENT/SAE J2716 Cores now available; CAN/CAN-FD Controller Core now supports AUTOSAR-compliant time-stamping
  
  
• Silab Tech Announces Release of XGS-PON SERDES IP Core (Monday Jun. 12, 2017)
  Silab Tech, a leading supplier of high speed serial interface intellectual property designs (IP cores) announced today the release of its XGS-PON PHY. This IP Core provides symmetrical 10Gbps interconnect solution for Next Generation Passive Optical Networks (PON).
  
  
• Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node (Wednesday Jun. 07, 2017)
  Uniquify today announced that its LPDDR4 Super Combo IP for the 28-nanometer (nm) low-power semiconductor process node is in volume production.