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IP / SOC Products News

• Wave Computing Turbo Boosts "MIPS" with Licensable AI Subsystems, An Expanded Ecosystem & New Product Roadmap (Monday Nov. 05, 2018)
  Wave Computing today announced its strategy for its AI-enabled MIPS® offering and ecosystem. MIPS is already widely known as an industry-standard technology that has been designed into thousands of products with billions of units shipped worldwide.
  
  
• Imagination delivers industry's first visually lossless image compression for GPUs with a guaranteed reduction in memory footprint (Friday Nov. 02, 2018)
  Imagination Technologies announces the groundbreaking PowerVR PVRIC4, the new generation of its powerful image compression technology which will enable SoC customers targeting devices such as DTVs, smartphones and tablets to reduce costs without a discernible loss of image quality.
  
  
• VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications (Thursday Nov. 01, 2018)
  VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI process.
  
  
• Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth (Thursday Nov. 01, 2018)
  Flex Logix Technologies, Inc. today announced that it has leveraged its core patent-protected interconnect technology from its embedded FPGA (eFPGA) line of business to launch a completely new product line focused on neural inferencing.
  
  
• Imagination introduces industry's most comprehensive GNSS IP core as part of its Ensigma wireless communications portfolio (Wednesday Oct. 31, 2018)
  Imagination Technologies announces the industry’s most comprehensive Global Navigation Satellite System (GNSS) IP offering. The Ensigma Location GNSS IP core supports GPS, GLONASS, Galileo, and BeiDou as well as several Satellite-Based Augmentation Systems (SBAS) including WAAS and EGNOS.
  
  
• Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing (Wednesday Oct. 31, 2018)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® HiFi 5 DSP for audio and voice, the first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing.
  
  
• SiFive Core IP 7 Series Creates New Class of Embedded Intelligent Devices Powered by RISC-V (Wednesday Oct. 31, 2018)
  SiFive today announced the availability of the SiFive Core IP 7 Series, the highest performance commercially available RISC-V cores. The 7 Series product family is designed to enable embedded intelligence with features that have not been commercially available until today.
  
  
• AImotive's aiWare3 Hardware IP Helps Drive Autonomous Vehicles To Production (Wednesday Oct. 31, 2018)
  AImotive™, the global provider of full stack, vision-first self-driving technology, today announced the release of aiWare3™, the company's 3rd generation, scalable, low-power, hardware Neural Network (NN) acceleration core.
  
  
• Arteris IP Announces New FlexNoC 4 Interconnect IP with Artificial Intelligence (AI) Package (Wednesday Oct. 31, 2018)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced the new Arteris IP FlexNoC version 4 interconnect IP and the companion AI Package.
  
  
• Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM (Tuesday Oct. 30, 2018)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that the DesignWare® STAR Memory System™ solution offers new memory built-in self-test (BIST), repair, and diagnostic capabilities for embedded MRAM (eMRAM)-based designs, with initial support for GLOBALFOUNDRIES (GF) eMRAM on the 22FDX® process.
  
  
• PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology (Monday Oct. 29, 2018)
  PLDA, the industry leader in PCI Express® IP solutions and MegaChips, a global semiconductor company specializing in ASIC Solution Services, today announced their collaboration to design a combined PCIe Controller IP and PHY IP solution.
  
  
• Silex Insight releases IPsec as a hardware block to accelerate IoT, cloud, or edge servers (Friday Oct. 26, 2018)
  Silex Insight, leading provider of IP cores for secure computing, is excited to announce that is has released the BA454, an extremely scalable and flexible hardware accelerator implementing the IPsec security protocol. BA454 has been conceived to provide security to high-throughput, time-critical applications, for example in data centers or servers at the heart of IoT, cloud, or edge networks.
  
  
• DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available (Thursday Oct. 25, 2018)
  Creonic GmbH, the market leader in Satellite Communications IP cores, announced today, the general availability of its latest IP core. The DVB-RCS2 modulator allows to implement a return channel over satellite and provides the capability to operate in MF-TDMA systems.
  
  
• eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing (Thursday Oct. 25, 2018)
  eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that its 7nm 56G long-reach SerDes is now available for licensing. eSilicon will demonstrate the SerDes during SuperCompute 2018 in Dallas, Texas on November 12-15.
  
  
• Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families (Thursday Oct. 25, 2018)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018.
  
  
• Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions (Wednesday Oct. 24, 2018)
  Synopsys today announced new DesignWare® Memory Interface IP solutions supporting the next-generation DDR5 and LPDDR5 SDRAMs. The DDR5 and LPDDR5 IP significantly increase memory interface bandwidth compared to DDR4 and LPDDR4 SDRAM interfaces, while reducing area and improving power efficiency.
  
  
• Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP (Monday Oct. 22, 2018)
  Cadence today unveiled the industry’s first silicon-proven, long-reach 112G SerDes IP in 7nm. The Cadence® 7nm 112G PAM-4 SerDes IP delivers industry-leading power, performance and area (PPA) efficiency required to build high-port density networking products for next-generation cloud-scale and telco datacenters.
  
  
• Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process (Monday Oct. 22, 2018)
  The race toward the lowest power consumption and the longest battery life is faster than ever with regards to IoT devices, and particularly for Bluetooth Low Energy and Low Power MCU.
  
  
• eMemory's OTP IP Qualified on 22nm FD-SOI process (Wednesday Oct. 17, 2018)
  eMemory today announced that its one-time programmable non-volatile memory (OTP) IP, NeoFuse, has been qualified for 22nm Fully-Depleted Silicon On-Insulator (FD-SOI), also known as 22FDX, process technology.
  
  
• Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices (Tuesday Oct. 16, 2018)
  Today at Arm TechCon, Arm disclosed details on a dedicated roadmap and new brand of infrastructure-class IP for 5G networks and next-generation cloud to edge infrastructure.
  
  
• OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller (Tuesday Oct. 16, 2018)
  OPENEDGES, the leading IP provider in smart computing, announced its release of cutting-edge ORBITTM Memory Subsystem IP solution combining Network-on-Chip (NoC) interconnect and DDR memory controller.
  
  
• QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process (Tuesday Oct. 09, 2018)
  QuickLogic today announced the availability of silicon-proven and ready-to-use ultra-low power ArcticPro™ eFPGA technology on GLOBALFOUNDRIES 22FDX® (FD-SOI) process technology.
  
  
• Andes Announces over 1.2 GHz RISC-V Cores Series at 28nm: A25/AX25 and N25F/NX25F (Monday Oct. 08, 2018)
  Andes Technology, a founding member of the RISC-V Foundation and the leading Taiwan-based supplier of 32/64-bit embedded CPU cores with solutions serving in excess of 2.5-Billion SoCs covering a wide range of applications, today announced the availability of the latest four members of the AndeStar™ V5 high efficiency processor series.
  
  
• Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution (Thursday Oct. 04, 2018)
  Northwest Logic and Mixel® announced today that their MIPI® CSI-2SM and DSI-2SM solutions which utilize MIPI C-PHY SM / D-PHY SM have been deployed and silicon proven in 28nm, 40nm, 55nm and 65nm process nodes. These high performance, low power, cost effective solutions contain controllers from Northwest Logic and PHYs from Mixel.
  
  
• Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC N7+ FinFET Process (Thursday Oct. 04, 2018)
  Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with TSMC to develop a broad portfolio of DesignWare® Interface IP, Logic Libraries and Embedded Memories for the TSMC N7+ FinFET process.
  
  
• Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA (Thursday Oct. 04, 2018)
  Omnitek today announced immediate availability of the highest performance CNN on an FPGA, achieving over 50% higher performance than any competing CNNs and out-performing GPUs for a given power or cost budget.
  
  
• Silicon Creations Highlights PLL Developments in 22nm, 12nm, 7nm, and 5nm at TSMC OIP Ecosystem Forum (Tuesday Oct. 02, 2018)
  Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC’s 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer’s SoC timing demands.
  
  
• M31 Technology's Diversified TSMC 28HPC+ ULL Memory Compilers Empower More Flexible SoC Design Architecture (Tuesday Oct. 02, 2018)
  M31 Technology Corporation (Taiwan stock code: 6643), a global Silicon Intellectual Property (IP) boutique, today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design.
  
  
• Arm expands design possibilities with free Cortex-M processors for Xilinx FPGAs (Monday Oct. 01, 2018)
  Today at the Xilinx Developer Forum in San Jose, Arm has announced it is collaborating with Xilinx, the market leader in FPGAs, to bring the benefits of Arm Cortex-M processors to FPGA through the Arm DesignStart program, providing scalability and a standardized processor architecture across the Xilinx portfolio.
  
  
• Dolphin Integration accelerates the development of energy-efficient SoCs for Arm-based secure IoT devices (Monday Oct. 01, 2018)
  Dolphin Integration today announced it is collaborating with Arm to make embedded and Internet of Things (IoT) devices more efficient. By combining a set of low-power and high-efficiency voltage regulators with a range of Arm-based IoT System-on-Chip (SoC) solutions, Dolphin aims to accelerate the cost-effective design of secure, smart and energy-efficient SoCs.