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IP / SOC Products News

• Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC" (Monday Nov. 30, 2020)
  T2M-IP, the global independent Semiconductor IP Cores, SW & Technology provider, is pleased to announce the availability of a Bluetooth LE RF Transceiver Phy KGD for instantly adding Bluetooth connectivity to any SoC with an embedded CPU.
  
  
• Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications (Monday Nov. 30, 2020)
  Xiphera Ltd., an expert in the field of hardware-based cryptography IP cores, launches a resource-optimised TLS 1.3 IP core with entirely FPGA-based cryptography and key management to serve software-independent security for Industrial Internet of Things (IIoT). The TLS 1.3 IP core brings a mission-critical level of security to industrial automation applications.
  
  
• CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification (Monday Nov. 23, 2020)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification.
  
  
• Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign (Friday Nov. 20, 2020)
  Palma Ceia SemiDesign announced today the availability of the company’s Wi-Fi HaLow Reference Platform, including all necessary hardware and software, for the design of Wi-Fi HaLow devices and systems based on the IEEE 802.11ah specification.
  
  
• GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC (Tuesday Nov. 17, 2020)
  Global Unichip disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC 7nm process and TSMC InFO_oS advanced packaging technology for AI, HPC and Networking applications to do multi-die integration for system scaling.
  
  
• Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure (Tuesday Nov. 17, 2020)
  Marvell (NASDAQ: MRVL) today unveiled the industry's first 112G 5nm SerDes solution that has been validated in hardware. The DSP-based SerDes boasts industry-leading performance, power and area, helping to propel 112G as the interconnect of choice for next generation 5G, enterprise, and cloud data center infrastructure.
  
  
• Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving (Thursday Nov. 12, 2020)
  Imagination Technologies announces IMG Series4, its next-generation neural network accelerator (NNA) for advanced driver-assistance systems (ADAS) and autonomous driving. Series4 targets automotive industry-leading disruptors as well as Tier 1s, original equipment manufacturer (OEMS) and automotive semiconductor system-on-chip (SoC) manufacturers.
  
  
• Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices (Thursday Nov. 12, 2020)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its 22ULP/ULL fundamental IP set has been adopted by customers in multiple IC developments, including IP camera SoCs, true-wireless-stereo (TWS) earphone SoCs, IoT SoCs, and voice recognition AI processors.
  
  
• PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP (Tuesday Nov. 10, 2020)
  PLDA, the industry leader in high-speed Interconnect solutions, today announced CXL 2.0 support for its XpressLINK™ and XpressLINK-SOC™ CXL IP solutions.
  
  
• Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs (Tuesday Nov. 10, 2020)
  Silex Insight, a leading provider of embedded security IP cores, has entered into an agreement with Silicon Labs (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world to contribute their security enclave IP (called eSecure) as part of the award-winning Secure Vault technology.
  
  
• CAST Releases MIPI I3C Basic Slave Controller IP Core (Tuesday Nov. 10, 2020)
  The new I3C-S MIPI I3C Basic Slave Controller core supports the latest I3C Basic specification, is suitable for any I3C bus topology, and is easy to configure and use. It includes—uniquely, the company believes—an I3C to AMBA AHB bridging mode.
  
  
• Pinnacle Imaging Systems Announces Denali 3.0 ISP (Tuesday Nov. 10, 2020)
  The 3rd generation Denali programable ISP is a fully customizable solution for designers of mission critical applications demanding maximum real-time imaging data from a small-footprint and energy-efficient ISP on the Xilinx Zynq UltraScale+ platform.
  
  
• Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP (Monday Nov. 09, 2020)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification.
  
  
• PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests (Thursday Nov. 05, 2020)
  PLDA XpressSWITCH IP passed all Gold and Interoperability tests as a Switch Component at PCIe 4.0 architecture speed (16 GT/s)
  
  
• eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications (Thursday Nov. 05, 2020)
  eMemory, one of the world’s top-ten providers of semiconductor intellectual property (IP), announced today its NeoFuse IP has been qualified on GLOBALFOUNDRIES® (GF®) 28HV platform in response to the rising demand for Organic Light Emitting Diode (OLED) display applications.
  
  
• 28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing (Wednesday Nov. 04, 2020)
  T2MIP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the availability of a comprehensive range of high-volume production proven SERDES IPs extracted from, production 28FDSOI chips.
  
  
• Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core (Tuesday Nov. 03, 2020)
  Xylon announces a new and updated version of the company’s very successful logicBRICKS IP core, the logiVIEW Multiview 3D Video Transformation Engine for high-performance and real-time processing of multiple video streams or still images in embedded systems.
  
  
• intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard (Thursday Oct. 29, 2020)
  intoPIX, leading provider of innovative compression solutions for audio-visual applications, today announces the release, with direct availability, of 8K TICO-XS encoder and decoder IP-Cores.
  
  
• SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP (Thursday Oct. 29, 2020)
  T2MIP is pleased to announce the availability of a unique 3rd Generation SDR RF IP in TSMC40ULP with a contiguous frequency range from 100MHz-2.6GHz for ultra-low power IOT applications.
  
  
• Analog Bits Announces Analog IP Availability on Samsung Technologies (Wednesday Oct. 28, 2020)
  Analog Bits announced a comprehensive and differentiating foundation analog IP portfolio today on multiple Samsung Foundry technologies, including 32LP, 28LPP, 28FDSOI, 14LPP, 8LPP, 7LPP, 5LPE.
  
  
• Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps (Wednesday Oct. 28, 2020)
  Rambus today announced the availability of a high-performance IPsec Packet Engine with integrated DPDK and companion key negotiation toolkit capable of securing 5G network traffic at data rates from 1 to 10 Gbps.
  
  
• QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process (Wednesday Oct. 28, 2020)
  QuickLogic today announced the availability of its ArcticPro™ 3 embedded FPGA (eFPGA) IP, which is now available on Samsung's 28nm FD–SOI process
  
  
• Micro Magic, Inc. Unleashes World's Fastest RISC-V Core (Monday Oct. 26, 2020)
  Today Micro Magic, Inc. announced the world’s fastest 64-bit RISC-V core achieving 5GHz and 13,000 CoreMarks at 1.1V. A single Micro Magic core running at 0.8V nominal delivers 11,000 CoreMarks at 4.25GHz consuming only 200mW.
  
  
• PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY (Thursday Oct. 22, 2020)
  PLDA, the industry leader in PCI Express® controller IP solutions has today unveiled their PCIe 5.0 demonstration. The demo showcases stable PCIe 5.0 Link Training (32 GT/s) and exceptional signal integrity with a Broadcom® PCIe 5.0 PHY platform.
  
  
• Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry (Wednesday Oct. 21, 2020)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced gains in advanced to high-end audio applications with adoption and recognition from some of the top brands in musical instruments.
  
  
• TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC (Tuesday Oct. 20, 2020)
  T2M, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the availability of a comprehensive range of Silicon Proven SERDES Phy IPs in TSMC’s advance 12FFC process technology.
  
  
• Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency (Monday Oct. 19, 2020)
  With an ever-increasing range of devices adding artificial intelligence (AI) functionality, Arm today announced the latest member of its Ethos product line, the Arm Ethos-U65 microNPU (Neural Processing Unit).
  
  
• CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio (Thursday Oct. 15, 2020)
  CSEM, a leader in ultra-low-power RF design, announced today at the GLOBALFOUNDRIES® (GF®) Global Technology Conference (GTC) EMEA that CSEM has released its Bluetooth Dual-Mode silicon IP on GF’s 22nm FD-SOI (22FDX®) platform for next generation of portable audio devices.
  
  
• Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor (Tuesday Oct. 13, 2020)
  Synopsys today announced its collaboration with Intel to achieve successful system-level interoperability between the Synopsys DesignWare Controller and PHY IP for PCI Express 5.0 and future Intel Xeon Scalable processors (codename Sapphire Rapids).
  
  
• Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process (Tuesday Oct. 13, 2020)
  Innosilicon, as a global one-stop provider of IP and ASIC customization, has achieved the world-first tapeout success on the advanced SMIC FinFET N+1 process with all the function tests passed in one stroke. This marks a significant milestone of the process iterations and joint efforts in the past few months.