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IP / SOC Products News

• Menta Unveils 'Launch Pad' Low-Cost Embedded FPGA (eFPGA) Technology Access Program For Defense And Aerospace Customers (Thursday Mar. 20, 2025)
  Menta eFPGA Inc. has initiated a new IP access program called Launch Pad for its acclaimed embedded FPGA (eFPGA) reprogrammable IP cores. Designed to address tightening defense budgets, the program allows customers to fabricate a test chip with any size eFPGA, from 100 to 10,000 LUTs, on any current process node - at up to 90% off Menta's standard licensing fees.
  
  
• KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core (Wednesday Mar. 19, 2025)
  Offers future-proof security to ensure the integrity and confidentiality of communication networks against quantum computer-based attacks
  
  
• SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core (Monday Mar. 17, 2025)
  Global IP Core Sales – The largest IP Core portfolio on the Semiconductor market in the Aerospace & Defense, Satellite Communications and Telecommunications industry is providing the SerDes Hard Macro- IP in GlobalFoundries 22FDX to suit your product needs.
  
  
• GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology (Thursday Mar. 13, 2025)
  The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm full-duplex). This milestone was achieved using TSMC’s advanced N3P process and CoWoS® packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications.
  
  
• Allegro DVT Launches its First AI-Based Neural Video Processing IP (Tuesday Mar. 11, 2025)
  Allegro DVT, a leader in video processing semiconductor solutions, is excited to announce the launch of its latest innovation, its first AI-based Neural Video Processing NVP300 IP. This groundbreaking product marks Allegro DVT’s commitment to embrace the AI revolution and push video quality to the next level, leveraging the advanced features and benefits of AI based video processing technologies.
  
  
• Weebit Nano fully qualifies ReRAM module to AEC-Q100 for automotive applications (Tuesday Mar. 11, 2025)
  Weebit Nano has completed AEC-Q100 150°C operation qualification of its Resistive Random-Access Memory (ReRAM) module in semiconductor manufacturer SkyWater Technology’s 130nm CMOS process.
  
  
• Rambus Enhances Data Center and AI Protection with Next-Gen CryptoManager Security IP Solutions (Tuesday Mar. 11, 2025)
  The CryptoManager Root of Trust delivers a fully-turnkey solution and offers the industry’s first Quantum Safe boot flow. The CryptoManager Hub provides the ideal combination of proven cryptographic building blocks for customers designing their own root of trust or secure processor.
  
  
• Crypto Quantique demonstrating device security platform that accelerates CRA-compliant development (Tuesday Mar. 11, 2025)
  Crypto Quantique, a provider of quantum-driven silicon IP and an end-to-end security platform for embedded devices, is demonstrating the QuarkLink Hybrid PQC security platform at Embedded World 2025 on booth 5-171.
  
  
• Logic Fruit Technologies Releases High-Speed Interface IPs Stack for Advanced Computing (Monday Mar. 10, 2025)
  Logic Fruit Technologies, a leading provider of cutting-edge FPGA-based solutions, proudly announces the release of its latest High-Speed Interface IP stack, including PCIe Gen6 Controller IP, PCIe Gen6 PHY IP, and CXL 3 Controller IP.
  
  
• Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric (Friday Mar. 07, 2025)
  Baya Systems, a leader in high-performance semiconductor system technologies, today announced its new NeuraScale™ switch fabric technology designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs.
  
  
• Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems (Wednesday Mar. 05, 2025)
  Omni Design Technologies, a leading provider of high-performance, low-power Swift™ data acquisition and signal-processing solutions and Metanoia, a leading provider of 5G Radio Access Networking (RAN) solutions, partner to offer high performance ultra-low power technology for FR1 and FR2 5G systems.
  
  
• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure (Tuesday Mar. 04, 2025)
  The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era.
  
  
• MIPS Drives Real-Time Intelligence into Physical AI Platforms (Tuesday Mar. 04, 2025)
  The new MIPS Atlas product suite delivers cutting-edge compute subsystems that empower autonomous edge solutions to sense, think and act with precision, driving innovation across the growing physical AI opportunity in industrial robotics and autonomous platform markets.
  
  
• intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs (Monday Mar. 03, 2025)
  intoPIX, the leading provider of innovative image and video compression technologies, proudly announces the successful porting of its JPEG XS and TicoRAW IP cores onto Lattice FPGAs.
  
  
• CAST Releases First Commercial SNOW-V Stream Cipher IP Core (Monday Mar. 03, 2025)
  High-throughput key stream generator enables fast cryptographic mechanisms for 5G and beyond high-speed communication systems
  
  
• eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing (Monday Mar. 03, 2025)
  This groundbreaking innovation combines eMemory’s cutting-edge NeoPUF technology with advanced PQC algorithms to deliver unparalleled security for the next generation of computing, safeguarding devices against the emerging threats posed by quantum computing.
  
  
• Agile Analog extends leadership in customizable analog security IP with new clock attack monitor (Monday Mar. 03, 2025)
  Agile Analog, the customizable analog IP company, has announced the successful delivery of a comprehensive anti-tamper solution to a major fabless company in Taiwan.
  
  
• Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications (Thursday Feb. 27, 2025)
  Built on the successful Ceva-XC20 architecture, already in design with two Tier-1 infrastructure OEMs for 5G-advanced and pre-6G processors, these new DSPs enable faster, more efficient data processing while reducing latency and increasing throughput.
  
  
• Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform (Thursday Feb. 27, 2025)
  The AI revolution is no longer confined to the cloud. As our world becomes increasingly connected and intelligent, from smart cities to industrial automation, the need to process AI workloads at the edge is not just advantageous, but essential. Today marks a significant milestone in this evolution with the introduction of the Armv9 edge AI platform, featuring the new Arm Cortex-A320 CPU and the leading AI accelerator for edge AI, Arm Ethos-U85 NPU, enabling AI models of over one billion parameters to run on-device.
  
  
• VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs (Thursday Feb. 27, 2025)
  VeriSilicon (688521.SH) today announced the launch of its latest AI-based AI-NR and AI-SR series of image processing IPs, including the AINR1000 and AINR2000 for intelligent noise reduction, and the AISR1000 and AISR2000 for advanced super resolution.
  
  
• Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform (Thursday Feb. 27, 2025)
  X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, and Attopsemi Technology, the innovative one-time programmable (OTP) IP solutions provider, jointly announced today the successful demonstration of the latest version of Attopsemi’s I-fuse S3® OTP on X-FAB's XH018 technology platform.
  
  
• Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration (Tuesday Feb. 25, 2025)
  This product enables design teams to automate the hardware/software integration process, reducing the development time by 35% when compared to in-house solutions and empowers them to overcome design complexity challenges, freeing up cycles for new innovation.
  
  
• Imagination takes efficiency up a level with latest D-Series GPU IP (Tuesday Feb. 25, 2025)
  The Imagination DXTP GPU IP extends battery life when accelerating graphics and compute workloads on mobile and other power-constrained devices.
  
  
• sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40% (Tuesday Feb. 25, 2025)
  SureCore, the ultra-low power memory specialist, has enabled KU Leuven, Belgium’s renowned research university, to develop a neural processing accelerator chip for AI applications that boasts dynamic power savings in excess of 40%, compared to solutions using the industry standard SRAM.
  
  
• ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50% (Monday Feb. 24, 2025)
  ZeroPoint Technologies AB today announced a breakthrough hardware-accelerated memory optimization product that enables the nearly instantaneous compression and decompression of deployed foundational models, including the leading large language models (LLMs).
  
  
• YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI (Wednesday Feb. 19, 2025)
  YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core.
  
  
• Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results (Wednesday Feb. 19, 2025)
  FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation in automotive, datacenter, consumer electronics, communications and industrial applications.
  
  
• RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models (Wednesday Feb. 19, 2025)
  The rise of optimized reasoning models, capable of matching the performance of massive solutions like ChatGPT, strengthens RaiderChip’s commitment to AI acceleration through its affordable and high-performance edge devices.
  
  
• AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset (Tuesday Feb. 18, 2025)
  AccelerComm's innovative use of vector processing cores for signal processing moves 5G satellite beyond proof-of-concept stage delivering 30X performance improvement over single chip integrated solution, with roadmap to scale to 400X.
  
  
• Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design (Monday Feb. 10, 2025)
  A member of the TSMC Open Innovation Platform® (OIP) Ecosystem for over 12 years, Silicon Creations has won the TSMC OIP Partner of the Year award for eight consecutive years, demonstrating its leadership in the field and commitment to innovation.