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IP / SOC Products News

• Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP (Wednesday Dec. 01, 2021)
  Arasan Chip Systems, the leading provider of Total IPTM solutions for today’s Systems on a Chip (SoC) market announces the immediate availability of Arasan’s MIPI I3CⓇ PHY I/O IP, in compliance with MIPI I3CⓇ specifications v1.1.
  
  
• LeapMind Announces Efficiera v2 Ultra-Low Power AI Inference Accelerator IP (Wednesday Dec. 01, 2021)
  LeapMind Co., Ltd., a leading creator of the standard in edge artificial intelligence (AI), today announced version 2 (hereinafter: v2) of the ultra-low power AI inference accelerator IP Efficiera, scheduled to be available in December 2021.
  
  
• videantis achieves Automotive SPICE Level 2 certification (Wednesday Dec. 01, 2021)
  Today, videantis, a leading supplier of deep learning, computer vision, image processing, and video coding solutions powering already more than 10 million cars on the road, announces the achievement of Automotive SPICE® Level 2 Certification (Automotive SPICE® is a registered trademark of the Verband der Automobilindustrie e.V. (VDA)).
  
  
• intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week (Monday Nov. 29, 2021)
  Not yet officially announced but not exactly a secret either; intoPIX, leading expert in video compression for ProAV, has again extended its large range of JPEG XS codecs with the addition of the Flawless Imaging Profile (FIP) in its revolutionary “TicoXS FIP” Codec.
  
  
• VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification (Wednesday Nov. 24, 2021)
  VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced its Image Signal Processor (the Vivante ISP) IP ISP8000L-FS V5.0.0, designed for advanced and high-performance camera applications, has now been certified ASIL-B as Safety Element out of Context (SEooC) in compliance with the ISO 26262 standard.
  
  
• CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) (Tuesday Nov. 23, 2021)
  SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.
  
  
• Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs (Tuesday Nov. 23, 2021)
  Grovf Inc. today announced RDMA RoCE v2 IP core, a new product to democratize the RNIC market. RDMA RoCE v2 IP core is an FPGA IP and enables FPGA-based smart NIC producers and system integrators to develop and deploy RNIC use-cases.
  
  
• RISC-V Low-Power Embedded Processor IP Core Now Available from CAST (Wednesday Nov. 17, 2021)
  Implementing a two-stage pipeline, the new 32-bit BA51 Low-Power Deeply Embedded RISC-V Processor is compact—just 16k gates in its minimum configuration–but can still run at over 500 MHz in modern ASIC processes.
  
  
• Intrinsic ID and Rambus Raise the Bar for Hardware Security with Integration of PUF Technology and Rambus Root of Trust (Tuesday Nov. 16, 2021)
  Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP today announced the availability of integrated solutions that combine the Intrinsic ID PUF technology with Rambus Root of Trust security cores.
  
  
• Arteris IP Helps Automate System-on-Chip Semiconductor Design Traceability with Harmony Trace Design Data (Tuesday Nov. 16, 2021)
  Arteris IP today announced the launch of the Arteris® Harmony Trace™️ Design Data Intelligence Solution to ease compliance with semiconductor industry functional safety and quality standards such as ISO 26262, IEC 61508, ISO 9001, and IATF 16949.
  
  
• Faraday Announces Proven MIPI D-PHY for Samsung Foundry 14LPC Process (Tuesday Nov. 16, 2021)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its silicon proven MIPI D-PHY IP in Samsung Foundry 14LPC process technology.
  
  
• Floadia Announces eNVM of 150 degree C retention on HHGrace 180BCD (Monday Nov. 15, 2021)
  Floadia Corporation announces that its high-quality eNVM (embedded Non-volatile Memory), with product name “ZT”, supporting 150 degree C retention of 10 years, is now available on Shanghai Huahong Grace Semiconductor Manufacturing Corporation (HHGrace) 180BCD (Z8) platform.
  
  
• Menta and Secure-IC Partnership Expands to Provide the Most Secure eFPGA IP Available (Wednesday Nov. 10, 2021)
  Menta and Secure-IC today announced a new milestone in their groundbreaking technology partnership: the availability of a 28nm test chip and board incorporating Menta’s eFPGA and Secure-IC’s integrated Secure Elements solutions.
  
  
• NSITEXE unveils A New Product AI accelerator "ML041", realizes high power efficiency (Wednesday Nov. 10, 2021)
  The AI accelerator “ML041”, developed by NSITEXE, divides input data (“Tiling”), and fuses the processing of multiple layers for each divided input data (“Layer fusion”), reducing the load/store transactions of intermediate data to the external memory and improving power efficiency.
  
  
• Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Tuesday Nov. 09, 2021)
  Digital Blocks DB9000 Display Controller & Processor IP Core Family Extends Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, AR/VR Headsets, Wearables, Signage, and Cinema Applications
  
  
• Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm (Thursday Nov. 04, 2021)
  Alphawave IP and Samsung are pleased to announce they have secured a strategic design win with a flagship global hyperscaler for a leading-edge datacentre system-on-chip (SoC). This represents one of the first global hyperscaler design wins in Samsung’s 4nm technology, and highlights Alphawave’s continued leadership of its connectivity technology.
  
  
• Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead (Thursday Nov. 04, 2021)
  Blue Cheetah, a leading provider of parallel chiplet interface solutions, announced the development of the BlueLynxTM Generator. BlueLynxTM produces a wide range of tapeout-ready, BoW PHY parallel interface configurations, thereby allowing customers to tradeoff package, performance, process, and complexity while maintaining the same standard.
  
  
• Imagination launches the most advanced ray tracing GPU (Thursday Nov. 04, 2021)
  Imagination Technologies announces IMG CXT, its flagship GPU IP which debuts its PowerVR Photon ray tracing architecture. By adding Photon hardware ray tracing, the IMG CXT represents another big jump in GPU IP, delivering incredible performance for games and other graphical use cases.
  
  
• eMemory and UMC Bring New ReRAM Intellectual Property to Market (Thursday Nov. 04, 2021)
  This achievement makes eMemory one of the world’s first companies to provide this emerging memory IP and enables UMC to offer more comprehensive solutions for MCU, PMIC, and AIoT markets. eMemory now offers ReRAM together with existing IP product lines of traditional non-volatile memory technologies.
  
  
• Truechip Introduces Silicon IP For Network on Chip (NoC) Focussed For Tilelink RISC-V Chips (Friday Oct. 29, 2021)
  Truechip, the Verification IP Specialist, today announced that it has introduced a Silicon IP to its product offering in addition to its existing Verification IP product line. This silicon IP named as NoC Silicon IP for RISC-V based chips supporting the TileLink protocol.
  
  
• Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices (Friday Oct. 29, 2021)
  Cadence today announced the Cadence® Tensilica® HiFi 1 DSP, which improves the user experience by delivering breakthrough audio/voice innovation for small battery devices such as TWS earbuds, hearing aids, Bluetooth headsets, smart watches and other wearables.
  
  
• AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface (Thursday Oct. 28, 2021)
  AccelerComm's latest product allows swift integration into any 5G Distributed Unit (DU) that supports the O-RAN AAL, enabling operators to select the most appropriate 5G physical layer accelerator cards to maximise flexibility and ease of deployment.
  
  
• Omni Design Announces Availability of LiDAR Receiver Subsystem (Wednesday Oct. 27, 2021)
  Omni Design Technologies, a leading provider of high-performance, ultra-low-power mixed-signal Intellectual Property (IP) solutions, today announced a LiDAR receiver subsystem that is available in FinFET to 28nm process nodes.
  
  
• Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process (Wednesday Oct. 27, 2021)
  Synopsys today announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWare® Interface and Foundation IP on the TSMC N4P process.
  
  
• SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products (Wednesday Oct. 27, 2021)
  T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its partner’s SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHY IP Cores which are silicon proven in major Fabs and Nodes with High storage capability making it easy to integrate and implement a varied range of applications.
  
  
• QuickLogic Announces First eFPGA IP From Australis IP Generator on UMC 22nm Process (Tuesday Oct. 26, 2021)
  QuickLogic today announced the availability of its first customer-defined eFPGA block from the Australis IP Generator for the UMC 22nm process.
  
  
• videantis processing platform reduces cost, increases flexibility of fail-operational systems (Monday Oct. 25, 2021)
  Today, videantis, a leading supplier of deep learning, computer vision, image processing and video coding solutions, announced availability of its technological platform for fail-operational processing at reduced cost for both smart sensors as well as highly integrated central ECUs.
  
  
• Xiphera expands its AEAD portfolio (Monday Oct. 25, 2021)
  Xiphera has expanded its AEAD portfolio by adding two Intellectual Property (IP) cores, XIP2113B and XIP2113H, to support ChaCha20-Poly1305 in addition to AES-GCM.
  
  
• ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers (Monday Oct. 25, 2021)
  T2MIP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the licensing of its partners mass production, field proven ISDB-S3 Demodulator IP Core is available for licensing for the integration into TV & STB SoCs.
  
  
• Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process (Thursday Oct. 21, 2021)
  The 5nm PCIe 6.0 PHY test chip silicon from Cadence demonstrated excellent electrical performance across all PCIe rates. The PAM4/NRZ dual-mode transmitter delivered optimal signal integrity, symmetry and linearity with extremely low jitter.