2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
AresCORE16 can be configured to support advanced packaging such as CoWoS (Chip-on-Wafer-on-Substrate), InFO (Integrated-Fan-Out) for maximum density, and Organic Substrates for most cost-effective solution covering all market segments.
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Block Diagram of the 2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
