3D Resistive RAM - High-Density Memory
CrossBar is enabling a new class of persistent memory solutions for read-intensive applications that benefit from the superior characteristics of CrossBar’s 3D ReRAM technologies.
Supported densities are from 64Gbits (8GBytes) or custom sizes, enabling 128GB NVDIMM to 1TB NV-DIMM with 8 chips per package. At system level, NV-DIMM read performance achieves 25.6 GB/s – 64 IOs – 250ns random read latency while consuming less than 1W active reads.
In addition to high-density non-volatile memory applications, CrossBar is also offering its high-density ReRAM technology for use in security applications, where the ReRAM cell is utilized for secure physical unclonable function (PUF) keys embedded in semiconductors.
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3D ReRAM IP
- Scalable 3D Graphics Accelerator
- 2D/3D Vector Graphics Accelerator / GPU (Graphics Processing Unit)
- 2-cluster Series6XT 3D/2D/Compute GPU including OpenGL ES 3.0, DX10_0 Feature Level and OpenCL Support , 10-bit YUV, YUV framebuffer
- 2-cluster Power Consumption & Performance Efficiency Enhanced Series6XT 3D/2D/Compute GPU including OpenGL ES 3.0, DX10_0 Feature Level and OpenCL Support , 10-bit YUV, YUV framebuffer, ASTC
- 4-cluster Power Consumption & Performance Efficiency Enhanced Series6XT 3D/2D/Compute GPU including OpenGL ES 3.0, DX10_0 Feature Level and OpenCL Support, 10-bit YUV, YUV framebuffer, ASTC
- 6-cluster Power Consumption & Performance Efficiency Enhanced Series6XT 3D/2D/Compute GPU including OpenGL ES 3.0, DX10_0 Featur