I/O:Ultra Small Size Dup-Pad total solution
Features
- Standard IO size is low to 80um*44um;
- Supports 3.3V/5.0V application;
- HBM ESD ability is over 2KV.
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PAD IP
- A 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options
- LVDS IO Pad Set
- RF I/O Pad Set and Discrete RF ESD Protection Components
- DDR3_DDR4 IO Pad Set
- SSTL_15 / SSTL_18 Combo I/O Pad Set
- I2C IO Pad Set