The RapidIO Interconnect Architecture is an industry-standard, packet-based interconnect technology that provides a reliable, high-performance interconnect between NPUs (network processing units), CPUs (central processing units), and DSPs (digital signal processors). Serial RapidIO enables chip-to-chip, board-to-board, and system-to-system communications and is targeted at the networking, embedded, and storage markets. RapidIO has won broad acceptance in wireless infrastructure applications, where it is used as a primary interconnect for DSP clusters in baseband processing.
Evaluate SRIO 2.1 IP Core With AMC Evaluation Platform LatticeECP3 AMC Demonstration Kit consists of
* LatticeECP3 AMC Evaluation board
* Associated cables
* AMC interface card
* Demonstration bitstreams and files